18 Other Function Telecom Interface ICs 52

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX-M10S-00B	U-blox Ag	TELECOM CIRCUIT		NO LEAD	18	DMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N18		2.7 mm	9.7 mm						10.1 mm
ESP-WROOM-02	Espressif Systems (Shanghai)	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N18		2.9 mm	18 mm				30	250	20 mm
MAX-M8Q-0	U-blox Ag	GNSS Module	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1		AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N18	4	2.7 mm	9.7 mm						10.1 mm
MAX-M8Q-0-10	U-blox Ag	GNSS Module	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1		AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N18		2.7 mm	9.7 mm						10.1 mm
TESEO-LIV3F	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N18		2.3 mm	9.7 mm				NOT SPECIFIED	NOT SPECIFIED	10.1 mm
L76L-M33	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N18		2.5 mm	9.7 mm						10.1 mm
L76-M33	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18	DMA	RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N18		2.5 mm	9.7 mm		HEIGHT CAPTURED NOMINAL				10.1 mm
MAX-M8C-0	U-blox Ag	GNSS Module	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1		AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N18	4	2.7 mm	9.7 mm						10.1 mm
FUSB340TMX	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD		R-PQCC-N18	1	.45 mm	2 mm			e4	30	260	2.8 mm
MAX-M8W-0	U-blox Ag	GNSS Module	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1		AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N18	4	2.7 mm	9.7 mm						10.1 mm
MAX-M8C-0-10	U-blox Ag	GNSS Module	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1		AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N18		2.7 mm	9.7 mm						10.1 mm
SIM68M	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18	DMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N18
MAX-M8W-0-10	U-blox Ag	GNSS Module	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1		AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N18	4	2.7 mm	2.5 mm						10.1 mm
ZM5202AE-CME3R	Silicon Labs	TELECOM CIRCUIT		NO LEAD	18	QMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-10 Cel		QUAD	.1 Mbps	R-XQMA-N18			12.5 mm						13.6 mm
MD0101K6-G	Microchip Technology	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	18	HVSON	SQUARE	PLASTIC/EPOXY	YES	1						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC18,.20SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N18		1 mm	5 mm	Not Qualified		e4			5 mm
ZM3102AE-CME1	Silicon Labs	TELECOM CIRCUIT		NO LEAD	18	XMA	RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY							UNSPECIFIED	.04 Mbps	R-XXMA-N18
HT12D(18DIP)	Holtek Semiconductor	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS				2.4/12	IN-LINE	DIP18(UNSPEC)	Other Telecom ICs		70 Cel	-20 Cel		DUAL		R-PDIP-T18				Not Qualified
MAX-8Q-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1		AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N18	4	2.7 mm	9.7 mm					245	10.1 mm
MAX-8Q-0-10	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N18	4	2.7 mm	9.7 mm						10.1 mm
MCP2140-I/SO	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	TS 16949		3 V		SMALL OUTLINE	SOP18,.4		1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G18	2	2.64 mm	7.49 mm	Not Qualified		e3			11.53 mm
CYG2030	IXYS Corporation		COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		HYBRID		9 mA	5 V	5	IN-LINE	DIP18(UNSPEC)	Other Telecom ICs		70 Cel	0 Cel		DUAL		R-PDIP-T18				Not Qualified
MCP2140A-I/SO	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	TS 16949		3 V		SMALL OUTLINE	SOP18,.4		1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G18	2	2.65 mm	7.5 mm	Not Qualified		e3	40	260	11.55 mm
MCP2140A-I/P	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	TS 16949		3 V		IN-LINE	DIP18,.3		2.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDIP-T18		5.334 mm	7.62 mm	Not Qualified		e3			22.86 mm
CYG2031	IXYS Corporation		COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		HYBRID		9 mA	5 V	5	IN-LINE	DIP18(UNSPEC)	Other Telecom ICs		70 Cel	0 Cel		DUAL		R-PDIP-T18				Not Qualified
L70B-M39	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18	DMA	RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N18		2.5 mm	9.7 mm		SEATED HGT-NOM; OPERATED WITH 2.8V TO 4.3V				10.1 mm
CYG2021	IXYS Corporation		COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		HYBRID		9 mA	5 V	5	IN-LINE	DIP18(UNSPEC)	Other Telecom ICs		70 Cel	0 Cel		DUAL		R-PDIP-T18				Not Qualified
MAX-8Q	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949		3 V		SMALL OUTLINE				85 Cel	-40 Cel		DUAL		R-PDSO-N18							NOT SPECIFIED	NOT SPECIFIED
PI3EQX1001XUAEX	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	18	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	70 Cel	0 Cel		QUAD		S-XQCC-N18		.4 mm	2 mm				NOT SPECIFIED	NOT SPECIFIED	2 mm
MAX-8C-0-10	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N18	4	2.7 mm	9.7 mm						10.1 mm
ZM3102AU-CME1R	Silicon Labs	TELECOM CIRCUIT		NO LEAD	18	XMA	RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY							UNSPECIFIED	.04 Mbps	R-XXMA-N18
MCP2150-I/SO	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	TS 16949		3.3 V		SMALL OUTLINE	SOP18,.4		1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G18	2	2.64 mm	7.49 mm	Not Qualified		e3	40	260	17.87 mm
ZM5202AU-CME3R	Silicon Labs	TELECOM CIRCUIT		NO LEAD	18	QMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-10 Cel		QUAD	.1 Mbps	R-XQMA-N18			12.5 mm						13.6 mm
ONET9901TAY	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	18	DIE	RECTANGULAR	UNSPECIFIED	YES	1			.041 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	0 Cel		UPPER		R-XUUC-N18				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
LM1893N	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR			18 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL		R-PDIP-T18		5.08 mm	7.62 mm						21.78 mm
SN76730N	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR					IN-LINE	DIP18,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel		DUAL		R-PDIP-T18				Not Qualified
SPBT3.0DP2	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N18		3 mm	11.6 mm				NOT SPECIFIED	NOT SPECIFIED	13.5 mm
UAA4009	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR			12 V	12	IN-LINE	DIP18,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T18				Not Qualified		e0
LB1010AD	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		22 mA		3/5	IN-LINE	DIP18,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel		DUAL		R-PDIP-T18				Not Qualified
TEA7062DP	STMicroelectronics			THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO					2.5 V	2.5	IN-LINE	DIP18,.3	Other Telecom ICs	2.54 mm			Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T18				Not Qualified		e0
PBL3726/6	STMicroelectronics		OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		100 mA		3.7/13	IN-LINE	DIP18,.4	Other Telecom ICs	2.54 mm	70 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T18				Not Qualified		e0
PBL3726/11	STMicroelectronics		OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		100 mA		3.7/13	IN-LINE	DIP18,.3	Other Telecom ICs	2.54 mm	70 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T18				Not Qualified		e0
PBL3726/12	STMicroelectronics		OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		100 mA		3.7/13	IN-LINE	DIP18,.3	Other Telecom ICs	2.54 mm	70 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T18				Not Qualified		e0
PBL3726/9	STMicroelectronics		OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		100 mA		3.9/13	IN-LINE	DIP18,.3	Other Telecom ICs	2.54 mm	70 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T18				Not Qualified		e0
SPBT2932DM	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	18		RECTANGULAR	UNSPECIFIED	YES	1				2.5 V		MICROELECTRONIC ASSEMBLY				60 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N18		2.9 mm	11.6 mm				NOT SPECIFIED	NOT SPECIFIED	13.5 mm
SPBT4.0DP	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	18	XMA	RECTANGULAR		YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			.5 mm	85 Cel	-40 Cel		TRIPLE	.8 Mbps	R-XXMA-N18		2.9 mm	11.6 mm						13.5 mm
PSB4400P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		1.45 mA		1.6/7.5	IN-LINE	DIP18,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T18				Not Qualified		e0
TDA5660P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		40 mA	11 V	11	IN-LINE	DIP18,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T18				Not Qualified		e0
PT8A983W	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES					3.3 V	3.3	SMALL OUTLINE	SO18(UNSPEC)	Other Telecom ICs		70 Cel	0 Cel		DUAL		R-PDSO-G18				Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.