20 Other Function Telecom Interface ICs 445

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Input Type	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
RN42XVP-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DMA	RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,20LEAD(UNSPEC)		2 mm	85 Cel	-40 Cel		Nickel/Gold (Ni/Au)	DUAL	.3 Mbps	R-XDMA-T20				24.4 mm			e4			29.9 mm
RN41XVC-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			DUAL		R-XDMA-T20	1	2 mm		24.4 mm						29.9 mm
NRF24L01P-R7	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD		S-XQCC-N20		.95 mm		4 mm	Not Qualified					4 mm
RN42XVU-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		Nickel/Gold (Ni/Au)	DUAL		R-XDMA-T20		2 mm		24.4 mm			e4			29.9 mm
NRF24L01P-R	Nordic Semiconductor Asa		INDUSTRIAL	NO LEAD	20	QCCN	SQUARE	PLASTIC/EPOXY	YES					3 V	3	CHIP CARRIER	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		TIN	QUAD		S-PQCC-N20					Not Qualified		e3	30	260
NRF24L01P-T	Nordic Semiconductor Asa		INDUSTRIAL	NO LEAD	20	QCCN	SQUARE	PLASTIC/EPOXY	YES					3 V	3	CHIP CARRIER	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD		S-PQCC-N20					Not Qualified
XB3-24Z8PT-J	Digi International	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		UNSPECIFIED	UNSPECIFIED	NO	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			DUAL		X-XDMA-T20								NOT SPECIFIED	NOT SPECIFIED
RN41XVU-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		Nickel/Gold (Ni/Au)	DUAL		R-XDMA-T20		2 mm		24.4 mm			e4			29.9 mm
XB3-24Z8UT-J	Digi International	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		UNSPECIFIED	UNSPECIFIED	NO	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			DUAL		X-XDMA-T20								NOT SPECIFIED	NOT SPECIFIED
CC2500RGP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.25 Mbps	S-PQCC-N20	3	1 mm		4 mm	Not Qualified		e4	NOT SPECIFIED	260	4 mm
BLUENRG-M2SP	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N20		2.5 mm		11.5 mm				20	240	13.5 mm
XB3-24Z8ST-J	Digi International	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		UNSPECIFIED	UNSPECIFIED	NO	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			DUAL		X-XDMA-T20								NOT SPECIFIED	NOT SPECIFIED
SA636DK/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25		.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm		4.4 mm	Not Qualified		e4	30	260	6.5 mm
SA602AD/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL		R-PDSO-G20	1	1.5 mm		4.4 mm	Not Qualified		e4	30	260	6.5 mm
BQ51013BRHLT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.002 Mbps	R-PQCC-N20	2	1 mm		3.5 mm			e4	NOT SPECIFIED	260	4.5 mm
SA602AD/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G20	1	1.5 mm		4.4 mm	Not Qualified		e4	30	260	6.5 mm
BQ51013BRHLR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.002 Mbps	R-PQCC-N20	2	1 mm		3.5 mm			e4	NOT SPECIFIED	260	4.5 mm
XB3-24Z8PT	Digi International	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		UNSPECIFIED	UNSPECIFIED	NO	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			DUAL		X-XDMA-T20
XB3-24Z8ST	Digi International	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		UNSPECIFIED	UNSPECIFIED	NO	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			DUAL		X-XDMA-T20
TSC2000IPW	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.2 mm		4.4 mm	Not Qualified	SINGLE-ENDED	e4	30	260	6.5 mm
BQ51013ARHLT	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	0 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.002 Mbps	R-PQCC-N20	2	1 mm		3.5 mm			e4	NOT SPECIFIED	260	4.5 mm
TSC2000IPWR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.2 mm		4.4 mm	Not Qualified	SINGLE-ENDED	e4	30	260	6.5 mm
SA636DK/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25		.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm		4.4 mm	Not Qualified		e4	30	260	6.5 mm
SA606DK/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm		4.4 mm	Not Qualified		e4	30	260	6.5 mm
TSC2000IPWRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G20	1	1.2 mm		4.4 mm	Not Qualified	SINGLE-ENDED	e4	NOT SPECIFIED	260	6.5 mm
SX1502I087TRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-PQCC-N20		.6 mm		3 mm	Not Qualified		e3			3 mm
XB3-24Z8UT	Digi International	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		UNSPECIFIED	UNSPECIFIED	NO	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			DUAL		X-XDMA-T20
TSC2000IPWG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G20	1	1.2 mm		4.4 mm	Not Qualified	SINGLE-ENDED	e4	NOT SPECIFIED	260	6.5 mm
SA616DK/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm		4.4 mm	Not Qualified		e4		260	6.5 mm
PE4312C-Z	Psemi	TELECOM CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	-3.3 V		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-55 Cel		NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N20	1	.9 mm		4 mm			e4	30	260	4 mm
CC2500RGPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.25 Mbps	S-PQCC-N20	3	1 mm		4 mm	Not Qualified		e4	NOT SPECIFIED	260	4 mm
AX5243-1-TW30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N20	1	1 mm		4 mm			e3	30	260	4 mm
SA606DK/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G20	1	1.5 mm		4.4 mm	Not Qualified		e4	30	260	6.5 mm
SI4432-B1-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD		S-XQCC-N20		.9 mm		4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	4 mm
BGSF18DM20E6327XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	20	HLGA	RECTANGULAR	UNSPECIFIED	YES	1	CMOS			3.5 V		GRID ARRAY, HEAT SINK/SLUG			.4 mm	85 Cel	-30 Cel		GOLD NICKEL	BOTTOM		R-XBGA-B20	3	.98 mm		2.8 mm			e4			3.2 mm
AD73311ARSZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Codecs	.65 mm	85 Cel	-40 Cel	1 dB	MATTE TIN	DUAL		R-PDSO-G20	1	2 mm	16-BIT	5.3 mm	Not Qualified		e3		260	7.2 mm	YES
SA616DK/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm		4.4 mm	Not Qualified		e4		260	6.5 mm
SA636DK/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25		.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm		4.4 mm	Not Qualified		e4	30	260	6.5 mm
BQ51013ARHLR	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	0 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.002 Mbps	R-PQCC-N20	2	1 mm		3.5 mm			e4	NOT SPECIFIED	260	4.5 mm
HT12D(20SOP)	Holtek Semiconductor	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS				2.4/12	SMALL OUTLINE	SOP20(UNSPEC)	Other Telecom ICs		70 Cel	-20 Cel			DUAL		R-PDSO-G20					Not Qualified
SA606DK/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G20	1	1.5 mm		4.4 mm			e4	30	260	6.5 mm
LM2893M	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			18 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G20		2.642 mm		7.49 mm						12.8 mm
LM2893MX	National Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			79 mA	18 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified					12.8 mm
AX5243-1-TA05	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		TIN	QUAD		S-XQCC-N20	1	1 mm		4 mm			e3		260	4 mm
SA616DK/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G20		1.5 mm		4.4 mm	Not Qualified					6.5 mm
SKY66111-11	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.25 mm	85 Cel	-40 Cel			QUAD		R-XQCC-N20	3	.9 mm		3 mm					260	3.3 mm
AD73311ARS-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Codecs	.65 mm	85 Cel	-40 Cel	1 dB	TIN LEAD	DUAL		R-PDSO-G20	1	2 mm	16-BIT	5.3 mm	Not Qualified		e0		240	7.2 mm	YES
AD630JN/+	Analog Devices		COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR	-15 V	.005 mA	15 V	+-15	IN-LINE	DIP20,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel		Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T20							e0

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.