20 Other Function Telecom Interface ICs 445

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Hybrid	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Battery Supply (V)	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Battery Feed	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD73311LARU	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			.0125 mA	3 V		3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	Modems	.65 mm	105 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e0		240	6.5 mm
AD8320ARPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			105 mA	12 V			SMALL OUTLINE				85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G20	5			Not Qualified		e3		260
AD803-20BR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			.06 mA	5 V		5	SMALL OUTLINE	SOP20,.4	ATM/SONET/SDH ICs	1.27 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G20				Not Qualified		e0
AD73311LARUZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			.0125 mA	3 V		3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	Modems	.65 mm	105 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e3		260	6.5 mm
MAX19996ETP+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified		e3	30	260	5 mm
MAX7036GTP+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	105 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N20	1	.8 mm	5 mm			e3	30	260	5 mm
MAX2031ETP	Analog Devices		INDUSTRIAL	NO LEAD	20	QCCN	SQUARE	PLASTIC/EPOXY	YES		BICMOS			100 mA	5 V		5	CHIP CARRIER	LCC20,.20SQ,25	Other Telecom ICs	.635 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQCC-N20				Not Qualified		e0
MAX7036GTP+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	105 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N20	1	.8 mm	5 mm			e3	30	260	5 mm
MAX7036GTP/V+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100		.0074 mA	3.3 V		3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	Other Telecom ICs	.65 mm	105 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified		e3	30	260	5 mm
MAX7036GTP/V+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100			3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	105 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N20	1	.8 mm	5 mm			e3	30	260	5 mm
MAX19996ETP+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel		QUAD	S-XQCC-N20		.8 mm	5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	5 mm
AMIS-52100-M	Onsemi		COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES					25 mA	3 V		3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Other Telecom ICs	.635 mm	50 Cel		0 Cel		DUAL	R-PDSO-G20				Not Qualified
19293-002-XTD	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V			SMALL OUTLINE, SHRINK PITCH			.65 mm	50 Cel		0 Cel		DUAL	R-PDSO-G20		2 mm	5.3 mm	Not Qualified					7.2 mm
TCC-106B-RT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-30 Cel		BOTTOM	R-PBGA-B20		.65 mm	2.23 mm						2.58 mm
19293-001-XTD	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V			SMALL OUTLINE, SHRINK PITCH			.65 mm	50 Cel		0 Cel		DUAL	R-PDSO-G20		2 mm	5.3 mm	Not Qualified					7.2 mm
AMIS-52050	Onsemi	TELECOM CIRCUIT		GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V			SMALL OUTLINE, SHRINK PITCH			.65 mm					DUAL	R-PDSO-G20		2 mm	5.3 mm	Not Qualified					7.2 mm
LA8515N	Onsemi		OTHER	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR							IN-LINE	DIP20,.3	Other Telecom ICs	2.54 mm	70 Cel		-30 Cel		DUAL	R-PDIP-T20				Not Qualified
TCC-106A-RT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-30 Cel		BOTTOM	R-PBGA-B20		.65 mm	2.23 mm						2.58 mm
AMIS-52150-XTD	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.025 mA	3 V		3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	ATM/SONET/SDH ICs	.65 mm	50 Cel		0 Cel		DUAL	R-PDSO-G20		2 mm	5.3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	7.2 mm
AMIS-52100-A	Onsemi		COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES					25 mA	3 V		3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Other Telecom ICs	.635 mm	50 Cel		0 Cel		DUAL	R-PDSO-G20				Not Qualified
AX5031-1-TW30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20		.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N20	1	1 mm	4 mm			e3	30	260	4 mm
AMIS-52150-XTP	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.025 mA	3 V		3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	ATM/SONET/SDH ICs	.65 mm	50 Cel		0 Cel		DUAL	R-PDSO-G20		2 mm	5.3 mm	Not Qualified					7.2 mm
AX5031-1-TA05	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20		.5 mm	85 Cel		-40 Cel	TIN	QUAD	S-XQCC-N20	1	1 mm	4 mm			e3		260	4 mm
19293-002-XTP	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V			SMALL OUTLINE, SHRINK PITCH			.65 mm	50 Cel		0 Cel		DUAL	R-PDSO-G20		2 mm	5.3 mm	Not Qualified					7.2 mm
AMIS-52100	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V			SMALL OUTLINE, SHRINK PITCH			.65 mm	70 Cel		0 Cel		DUAL	R-PDSO-G20		2 mm	5.3 mm	Not Qualified					7.2 mm
AMIS-52000	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V			SMALL OUTLINE, SHRINK PITCH			.65 mm	50 Cel		0 Cel		DUAL	R-PDSO-G20		2 mm	5.3 mm	Not Qualified					7.2 mm
FSA9280AUMX	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1								CHIP CARRIER			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	R-XQCC-N20	1	.55 mm	3 mm	Not Qualified		e4	30	260	4 mm
AMIS-52100-I	Onsemi		COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES					25 mA	3 V		3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Other Telecom ICs	.635 mm	50 Cel		0 Cel		DUAL	R-PDSO-G20				Not Qualified
AMIS-52150	Onsemi		COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES					25 mA	3 V		3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Other Telecom ICs	.635 mm	50 Cel		0 Cel		DUAL	R-PDSO-G20				Not Qualified
19293-001-XTP	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V			SMALL OUTLINE, SHRINK PITCH			.65 mm	50 Cel		0 Cel		DUAL	R-PDSO-G20		2 mm	5.3 mm	Not Qualified					7.2 mm
STHVDAC-256MTGF3	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-30 Cel		BOTTOM	R-PBGA-B20		.64 mm	1.94 mm				NOT SPECIFIED	NOT SPECIFIED	2.23 mm
L4969MD	STMicroelectronics	TELECOM CIRCUIT		GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					14 V			SMALL OUTLINE			1.27 mm				NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified		e4			12.8 mm
L4969	STMicroelectronics	TELECOM CIRCUIT		GULL WING	20	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					14 V			SMALL OUTLINE, HEAT SINK/SLUG			1.27 mm				MATTE TIN	DUAL	R-PDSO-G20		3.6 mm	11 mm	Not Qualified		e3			15.9 mm
L3845-20	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1								SMALL OUTLINE	SOP20,.4	Analog Transmission Interfaces	1.27 mm	70 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified		e4			12.8 mm
LS656D1	STMicroelectronics		OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR			2 mA	2.5 V		2.5	SMALL OUTLINE	SOP20,.4	Other Telecom ICs	1.27 mm	70 Cel		-45 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G20				Not Qualified		e0
L3000NSOT	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			-5 V		5 V			SMALL OUTLINE, HEAT SINK/SLUG			1.27 mm	70 Cel		0 Cel		DUAL	R-PDSO-G20		3.6 mm	11 mm	Not Qualified					15.9 mm
L3000NSO	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		-5 V		5 V	2-4 CONVERSION	+-5	SMALL OUTLINE, HEAT SINK/SLUG	SOP20,.56	Analog Transmission Interfaces	1.27 mm	70 Cel	-48 AND +72	0 Cel	TIN LEAD	DUAL	R-PDSO-G20		3.6 mm	11 mm	Not Qualified	RESISTIVE	e0			15.9 mm
TEA7053DP	STMicroelectronics			THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO						3.3 V		3.3	IN-LINE	DIP20,.3	Other Telecom ICs	2.54 mm				Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T20				Not Qualified		e0
STS39230	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	20		RECTANGULAR	PLASTIC/EPOXY	YES	1									BGA20(UNSPEC)			85 Cel		-25 Cel		BOTTOM	R-PBGA-B20
UAA3202M-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4.7 mA	3.5 V			SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		2 mm	5.3 mm	Not Qualified		e4			7.2 mm
TDA8010AM-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	80 Cel		-20 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified					6.5 mm
935059610118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	6.5 mm
SA5217D-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				13.5 mA	5 V			SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified			40	250	12.8 mm
UAA2077BM-T	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			33.5 mA	4 V			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel		-30 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified					6.5 mm
PCA5075-T	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				5 V			SMALL OUTLINE				70 Cel		-40 Cel		DUAL	R-PDSO-G20				Not Qualified
NE5217D-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				13.3 mA	5 V			SMALL OUTLINE			1.27 mm	70 Cel		0 Cel		DUAL	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified					12.8 mm
NE575AN	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					5 V			IN-LINE				70 Cel		0 Cel		DUAL	R-PDIP-T20				Not Qualified
UAA2077CM	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			47.5 mA	3.75 V		3.75	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25	Other Telecom ICs	.65 mm	75 Cel		-30 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified		e4			6.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.