Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
4 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
||||||||||||||||||||||||||||||||||||||||
|
Murata Manufacturing |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER |
1.02 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQCC-N20 |
9.65 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
10.9 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
2 |
e3 |
40 |
260 |
||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
5 |
SMALL OUTLINE |
SOP20,.4 |
Other Telecom ICs |
1.27 mm |
105 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
2.6 mm |
7.4 mm |
Not Qualified |
e0 |
12.825 mm |
||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
4 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
2 |
e3 |
40 |
260 |
||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
2 |
.9 mm |
3 mm |
e3 |
40 |
260 |
3 mm |
||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-20 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
3 |
.6 mm |
3 mm |
e3 |
40 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||||
|
Skyworks Solutions |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
20 |
HQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N20 |
3 |
1.05 mm |
3 mm |
e4 |
4 mm |
||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
5 |
SMALL OUTLINE |
SOP20,.4 |
Other Telecom ICs |
1.27 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
2 |
2.6 mm |
7.4 mm |
Not Qualified |
e3 |
12.825 mm |
|||||||||||||||||||||||||||||||||||||
Atmel |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.0099 mA |
5 V |
5 |
SMALL OUTLINE |
SOP20,.4 |
Other Telecom ICs |
1.27 mm |
105 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
1 |
7.4 mm |
Not Qualified |
e0 |
12.825 mm |
|||||||||||||||||||||||||||||||||||||
|
Skyworks Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
3 |
.9 mm |
4 mm |
260 |
4 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
1 |
.9 mm |
4 mm |
e3 |
40 |
260 |
4 mm |
||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.15SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
1 |
.9 mm |
4 mm |
e3 |
40 |
260 |
4 mm |
|||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
3 mm |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
4 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-20 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
3 |
.6 mm |
3 mm |
e3 |
40 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
4 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
1 |
.9 mm |
4 mm |
Not Qualified |
e3 |
40 |
260 |
4 mm |
|||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
3 mm |
3 mm |
|||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
350 mA |
4.8 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
1.2 mm |
4.4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
6.5 mm |
|||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N20 |
3 |
1 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
|||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
107 mA |
5 V |
IN-LINE |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T20 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
18 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T20 |
5.08 mm |
7.62 mm |
26.07 mm |
|||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
350 mA |
4.8 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
1.2 mm |
4.4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
6.5 mm |
|||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
DUAL |
R-PDSO-G20 |
1.2 mm |
4.4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
6.5 mm |
||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
IN-LINE |
DIP20,.3 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T20 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
90 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
11300 Mbps |
S-PQCC-N20 |
3 |
1 mm |
4 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
4 mm |
|||||||||||||||||||||||||||||||||||
Texas Instruments |
INDUSTRIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
19 mA |
5 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP20(UNSPEC) |
Other Telecom ICs |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
IN-LINE |
DIP20,.3 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-XDIP-T20 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
QUAD |
R-PQCC-N20 |
1 mm |
3.5 mm |
4.5 mm |
||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
INDUSTRIAL |
NO LEAD |
20 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
3 V |
3 |
CHIP CARRIER |
LCC20,.20SQ,25 |
Other Telecom ICs |
.635 mm |
105 Cel |
-40 Cel |
QUAD |
S-PQCC-N20 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.015 mA |
1.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
3.6 V |
QUAD |
50 Mbps |
R-PQCC-N20 |
2 |
1 mm |
3.5 mm |
Not Qualified |
16 Amp |
e4 |
30 |
260 |
4.5 mm |
|||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-25 Cel |
DUAL |
R-PDSO-G20 |
1.2 mm |
4.4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
6.5 mm |
|||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
NO LEAD |
20 |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
3.3 V |
UNCASED CHIP |
UPPER |
X-XUUC-N20 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
INDUSTRIAL |
NO LEAD |
20 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
3 V |
3 |
CHIP CARRIER |
LCC20,.20SQ,25 |
Other Telecom ICs |
.635 mm |
105 Cel |
-40 Cel |
QUAD |
S-PQCC-N20 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
107 mA |
5 V |
5 |
IN-LINE |
SOP20,.4 |
ATM/SONET/SDH ICs |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T20 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
20 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.015 mA |
1.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
3.6 V |
BOTTOM |
50 Mbps |
R-PBGA-B20 |
1 |
.61 mm |
2.5 mm |
Not Qualified |
e1 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
2 mm |
5.3 mm |
7.2 mm |
|||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
2.65 mm |
7.5 mm |
Not Qualified |
12.8 mm |
|||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
20 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
UNCASED CHIP |
85 Cel |
-25 Cel |
UPPER |
R-XUUC-N20 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.015 mA |
1.5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
3.6 V |
DUAL |
50 Mbps |
R-PDSO-G20 |
1 |
1.2 mm |
4.4 mm |
Not Qualified |
16 Amp |
e4 |
30 |
260 |
6.5 mm |
|||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
50 mA |
5 V |
IN-LINE |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T20 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
90 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
11300 Mbps |
S-PQCC-N20 |
3 |
1 mm |
4 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
4 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.