24 Other Function Telecom Interface ICs 419

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

DS4000G0N/WBGA

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000KI/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000A0/WBGA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000GF/WBGA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

20

240

11 mm

DS4000A0N/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000GWN/WBGA

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

MAX2180ETG+

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

10 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn)

QUAD

S-XQCC-N24

1

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

MAX7060ATG/V+T

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

1

.8 mm

4 mm

e3

30

260

4 mm

MAX7060ATG+T

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

S-XQCC-N24

1

.8 mm

4 mm

4 mm

TA1243BF

Toshiba

COMMERCIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

BIPOLAR

83.5 mA

5,33

SMALL OUTLINE, SHRINK PITCH

SOP24,.3,40

Other Telecom ICs

1 mm

70 Cel

-20 Cel

DUAL

R-PDSO-G24

Not Qualified

TA31080F-TP2

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

6 V

SMALL OUTLINE, SHRINK PITCH

1 mm

75 Cel

-25 Cel

TIN LEAD

DUAL

R-PDSO-G24

2.2 mm

6 mm

Not Qualified

e0

13 mm

TA31051N

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

THROUGH-HOLE

24

SDIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

12 mA

5 V

IN-LINE, SHRINK PITCH

1.778 mm

75 Cel

-20 Cel

DUAL

R-PDIP-T24

4.5 mm

7.62 mm

Not Qualified

22 mm

TA31080F-TP1

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

6 V

SMALL OUTLINE, SHRINK PITCH

1 mm

75 Cel

-25 Cel

TIN LEAD

DUAL

R-PDSO-G24

2.2 mm

6 mm

Not Qualified

e0

13 mm

TA1243BFN

Toshiba

COMMERCIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

BIPOLAR

83.5 mA

5,33

SMALL OUTLINE, SHRINK PITCH

SSOP24,.3

Other Telecom ICs

.635 mm

70 Cel

-20 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G24

Not Qualified

e0

TA31080F

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

6 V

SMALL OUTLINE, SHRINK PITCH

1 mm

75 Cel

-25 Cel

TIN LEAD

DUAL

R-PDSO-G24

2.2 mm

6 mm

Not Qualified

e0

13 mm

TA31080N

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

THROUGH-HOLE

24

SDIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

18 mA

5 V

IN-LINE, SHRINK PITCH

1.778 mm

75 Cel

-25 Cel

DUAL

R-PDIP-T24

4.5 mm

7.62 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

22 mm

X9470V24I

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.025 mA

5 V

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP24,.25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G24

1

1.2 mm

4.4 mm

Not Qualified

e0

7.8 mm

UPC3250T7L-E1-A

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

.6 mm

4 mm

4 mm

F1650NLGI8

Renesas Electronics

TELECOM CIRCUIT

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

MATTE TIN

QUAD

S-XQCC-N24

1

1 mm

4 mm

e3

260

4 mm

F1423NBGI8

Renesas Electronics

TELECOM CIRCUIT

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

Matte Tin (Sn)

QUAD

S-XQCC-N24

1

.8 mm

4 mm

e3

NOT SPECIFIED

260

4 mm

IDTF1653NLGI8

Renesas Electronics

TELECOM CIRCUIT

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

QUAD

S-XQCC-N24

1 mm

4 mm

4 mm

F1958NBGK

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

Tin (Sn)

QUAD

S-XQCC-N24

1

.8 mm

4 mm

e3

NOT SPECIFIED

260

4 mm

F1650NLGI

Renesas Electronics

TELECOM CIRCUIT

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

MATTE TIN

QUAD

S-XQCC-N24

1

1 mm

4 mm

e3

260

4 mm

UPC3250T7L-E1

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

.6 mm

4 mm

4 mm

LUCL7583CF

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

5 V

IN-LINE

2.54 mm

110 Cel

-40 Cel

TIN LEAD

DUAL

R-PDIP-T24

5.49 mm

15.24 mm

Not Qualified

e0

NOT SPECIFIED

NOT SPECIFIED

31.75 mm

LUCL7583AF

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

5 V

IN-LINE

2.54 mm

110 Cel

-40 Cel

TIN LEAD

DUAL

R-PDIP-T24

5.49 mm

15.24 mm

Not Qualified

e0

NOT SPECIFIED

NOT SPECIFIED

31.75 mm

1320C

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

24

RECTANGULAR

UNSPECIFIED

NO

1

5 V

FIBER OPTIC

85 Cel

-40 Cel

TIN LEAD

UNSPECIFIED

R-XXFO-X

Not Qualified

e0

NOT SPECIFIED

NOT SPECIFIED

ATTL7583DF

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

5 V

IN-LINE

2.54 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDIP-T24

5.49 mm

15.24 mm

Not Qualified

e0

NOT SPECIFIED

NOT SPECIFIED

HDMP-0421

Broadcom

TELECOM CIRCUIT

COMMERCIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

BIPOLAR

3.3 V

3.3

SMALL OUTLINE, SHRINK PITCH

SSOP24,.3

Other Telecom ICs

.635 mm

70 Cel

0 Cel

DUAL

R-PDSO-G24

Not Qualified

1320D

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

24

RECTANGULAR

UNSPECIFIED

NO

1

5 V

FIBER OPTIC

85 Cel

-40 Cel

TIN LEAD

UNSPECIFIED

R-XXFO-X

Not Qualified

e0

NOT SPECIFIED

NOT SPECIFIED

HDMP-0422

Broadcom

TELECOM CIRCUIT

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

BIPOLAR

3.3 V

3.3

SMALL OUTLINE, SHRINK PITCH

SSOP24,.3

Other Telecom ICs

.635 mm

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G24

Not Qualified

e0

LUCL7583DF

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

5 V

IN-LINE

2.54 mm

110 Cel

-40 Cel

TIN LEAD

DUAL

R-PDIP-T24

5.49 mm

15.24 mm

Not Qualified

e0

NOT SPECIFIED

NOT SPECIFIED

31.75 mm

ATTL7583AF

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

5 V

IN-LINE

2.54 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDIP-T24

5.49 mm

15.24 mm

Not Qualified

e0

NOT SPECIFIED

NOT SPECIFIED

LUCL7583BF

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

5 V

IN-LINE

2.54 mm

110 Cel

-40 Cel

TIN LEAD

DUAL

R-PDIP-T24

5.49 mm

15.24 mm

Not Qualified

e0

NOT SPECIFIED

NOT SPECIFIED

31.75 mm

ATTL7583CF

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

5 V

IN-LINE

2.54 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDIP-T24

5.49 mm

15.24 mm

Not Qualified

e0

NOT SPECIFIED

NOT SPECIFIED

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.