24 Other Function Telecom Interface ICs 419

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

TEA1085

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

BIPOLAR

0 V

4.2 V

IN-LINE

2.54 mm

75 Cel

-25 Cel

TIN/NICKEL PALLADIUM GOLD

DUAL

R-PDIP-T24

5.1 mm

15.24 mm

Not Qualified

e3/e4

31.7 mm

935261032118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

2 mm

5.3 mm

Not Qualified

40

260

8.2 mm

TEA1094ATD

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

4.4 mA

5 V

SMALL OUTLINE

1.27 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G24

2.65 mm

7.5 mm

Not Qualified

15.4 mm

TEA1094AM

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

4.4 mA

5 V

SMALL OUTLINE, SHRINK PITCH

.65 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G24

2 mm

5.3 mm

Not Qualified

8.2 mm

PCA1070T

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.0001 mA

5 V

3/5

SMALL OUTLINE

SOP24,.4

Telephone Circuits

1.27 mm

60 Cel

-10 Cel

DUAL

R-PDSO-G24

2.65 mm

7.5 mm

Not Qualified

15.4 mm

TFF11115HN

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1 mm

4 mm

Not Qualified

4 mm

NE5750D

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

DUAL

R-PDSO-G24

2.65 mm

7.5 mm

Not Qualified

15.4 mm

TFF11139HN/N1X

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1

1 mm

4 mm

260

4 mm

NE5750N

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

5 V

IN-LINE

70 Cel

0 Cel

DUAL

R-PDIP-T24

Not Qualified

TEA1085T-T

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

0 V

4.2 V

SMALL OUTLINE

1.27 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G24

2.65 mm

7.5 mm

Not Qualified

15.4 mm

SA5751N

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

5 V

IN-LINE

85 Cel

-40 Cel

DUAL

R-PDIP-T24

Not Qualified

SA5750D-T

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

2.65 mm

7.5 mm

Not Qualified

15.4 mm

TDA8003TS/C2

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G24

2 mm

5.3 mm

Not Qualified

e4

8.2 mm

TFF11086HN/N1,111

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1

1 mm

4 mm

260

4 mm

TFF11094HN/N1,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1 mm

4 mm

4 mm

TEA1094AT

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

4.4 mA

5 V

SMALL OUTLINE

1.27 mm

75 Cel

-25 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G24

2.65 mm

7.5 mm

Not Qualified

e4

15.4 mm

TEA1094AM-T

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

4.4 mA

5 V

SMALL OUTLINE, SHRINK PITCH

.65 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G24

2 mm

5.3 mm

Not Qualified

8.2 mm

TFF11092HN/N1

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1

1 mm

4 mm

260

4 mm

TFF11142HN/N1X

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1

1 mm

4 mm

260

4 mm

SA5750N

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

5 V

IN-LINE

85 Cel

-40 Cel

DUAL

R-PDIP-T24

Not Qualified

935260674518

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-G24

Not Qualified

PCA1070T-T

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

60 Cel

-10 Cel

DUAL

R-PDSO-G24

2.65 mm

7.5 mm

Not Qualified

15.4 mm

TEA1094AN

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

4.4 mA

5 V

IN-LINE

2.54 mm

75 Cel

-25 Cel

DUAL

R-PDIP-T24

5.1 mm

15.24 mm

Not Qualified

31.7 mm

UAA3220TS/V1S,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

1

2 mm

5.3 mm

260

8.2 mm

TFF11092HN/N1X

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N24

1

1 mm

4 mm

e4

30

260

4 mm

TEA1094APN

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

4.4 mA

5 V

IN-LINE

2.54 mm

75 Cel

-25 Cel

DUAL

R-PDIP-T24

5.1 mm

15.24 mm

Not Qualified

31.7 mm

BGX7100HN/1,115

NXP Semiconductors

NO LEAD

24

QCCN

SQUARE

PLASTIC/EPOXY

YES

5 V

5

CHIP CARRIER

LCC24,.16SQ,20

Other Telecom ICs

.5 mm

QUAD

S-PQCC-N24

1

Not Qualified

260

TFF11142HN

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1 mm

4 mm

4 mm

NE5750D-T

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

DUAL

R-PDSO-G24

2.65 mm

7.5 mm

Not Qualified

15.4 mm

TFF11101HN/N1X

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1

1 mm

4 mm

260

4 mm

TFF11115HN/N1,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1 mm

4 mm

4 mm

TDA8003TSDB-T

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

2 mm

5.3 mm

Not Qualified

40

260

8.2 mm

SA3600DH

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

1.1 mm

4.4 mm

Not Qualified

7.8 mm

TFF11086HN

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1 mm

4 mm

4 mm

TFF1007HN

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1 mm

4 mm

4 mm

SA3600

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G24

1.1 mm

4.4 mm

Not Qualified

e4

7.8 mm

BGX7100HN/1,118

NXP Semiconductors

NO LEAD

24

QCCN

SQUARE

PLASTIC/EPOXY

YES

5 V

5

CHIP CARRIER

LCC24,.16SQ,20

Other Telecom ICs

.5 mm

QUAD

S-PQCC-N24

1

Not Qualified

260

NE5751N

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

5 V

IN-LINE

70 Cel

0 Cel

DUAL

R-PDIP-T24

Not Qualified

935263632518

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

2 mm

5.3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

8.2 mm

TFF11094HN

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1 mm

4 mm

Not Qualified

4 mm

935263906518

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

1.1 mm

4.4 mm

Not Qualified

7.8 mm

935263906512

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

1.1 mm

4.4 mm

Not Qualified

7.8 mm

TFF11115HN/N1,111

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1 mm

4 mm

4 mm

TDA8003TS/C1

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-G24

Not Qualified

TFF11145HN/N1X

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1

1 mm

4 mm

260

4 mm

TEA1085AT

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

0 V

4.2 V

SMALL OUTLINE

1.27 mm

75 Cel

-25 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G24

2.65 mm

7.5 mm

Not Qualified

e4

15.4 mm

TEA1094A

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

BIPOLAR

5 V

IN-LINE

2.54 mm

75 Cel

-25 Cel

TIN/NICKEL PALLADIUM GOLD

DUAL

R-PDIP-T24

5.1 mm

15.24 mm

Not Qualified

e3/e4

31.7 mm

TFF11145HN

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1 mm

4 mm

4 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.