24 Other Function Telecom Interface ICs 419

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
HMC566LP4E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
HMC566LP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	3	1 mm	4 mm			e3	30	260	4 mm
ISL32277EIRZ-T	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N24	3	1 mm	4 mm			e3	30	260	4 mm
MAX7060ATG+	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	24	VQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			2.7 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
ADN2915ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		.3774 mA	3.3 V	1.2,1.8/3.3,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified		e3			4 mm
DS100BR111SQE/NOPB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	2				2.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	10300 Mbps	S-XQCC-N24	3	.8 mm	4 mm			e3	30	260	4 mm
NEO-M8L-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	NO	1			AEC-Q100				MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N24							NOT SPECIFIED	NOT SPECIFIED
HMC1122LP4ME	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N24	3	.95 mm	4 mm						4 mm
NEO-M8L-03A	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	NO	1			AEC-Q100		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N24							NOT SPECIFIED	NOT SPECIFIED
ATA5745-PXPW	Atmel	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.01 mA	3 V	3,5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.2SQ,25	Other Telecom ICs	.65 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N24		1 mm	5 mm	Not Qualified					5 mm
AWL9966RS36P8	Ii-vi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N24	2	.6 mm	4 mm	Not Qualified					4 mm
W2SG0084I-B-T	Wi2wi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	QMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel		QUAD		R-XQMA-N24	1	2.3 mm	11.2 mm					245	12 mm
XPD1001000-01	Lantronix	SERIAL DEVICE SERVER		PIN/PEG	24	DMA	RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL	.921 Mbps	R-XDMA-P24		11.7602 mm	31.75 mm						43.2308 mm
ADF7012BRUZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G24	1	1.2 mm	4.4 mm	Not Qualified		e3		260	7.8 mm
ATA5746-PXPW	Atmel	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.01 mA	3 V	3,5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.2SQ,25	Other Telecom ICs	.65 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N24		1 mm	5 mm	Not Qualified					5 mm
SA639DH/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24	1	1.1 mm	4.4 mm	Not Qualified		e4		260	7.8 mm
ENW89823A3KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2.178 Mbps	R-XXMA-N24		2 mm	9 mm				40	250	9.5 mm
L26-M33	Quectel Wireless Solutions	TELECOM CIRCUIT		NO LEAD	24	DMA	RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N24		2.4 mm	12.2 mm		OPERATES FROM 2.8V TO 3.4V SUPPLY				16 mm
SA639DH/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24	1	1.1 mm	4.4 mm			e4	30	260	7.8 mm
SA639DH,512	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR		.01 mA	3 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24		1.1 mm	4.4 mm	Not Qualified			40	260	7.8 mm
SA639DH,518	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24		1.1 mm	4.4 mm	Not Qualified					7.8 mm
ATA5746-PXQW	Atmel	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N24		1 mm	5 mm	Not Qualified					5 mm
SA639DH	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR		.01 mA	3 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24		1.1 mm	4.4 mm	Not Qualified			40	260	7.8 mm
NEO-7N-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	NO	1			AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	SILVER OVER NICKEL	DUAL		R-XDMA-N24		2.6 mm	12.2 mm			e4			16 mm
ENW89829A2KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2.178 Mbps	R-XXMA-N24		2 mm	9 mm				50	250	9.5 mm
LNBH26SPQR	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1					12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel		QUAD		S-XQCC-N24	1	1 mm	4 mm						4 mm
SE2436L-R	Skyworks Solutions	TELECOM CIRCUIT		NO LEAD	24	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1							CHIP CARRIER							QUAD		R-PQCC-N24							NOT SPECIFIED	NOT SPECIFIED
SI4744-C10-GMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	2	.9 mm	4 mm			e3	40	260	4 mm
TFF11145HN/N1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm					260	4 mm
ATA8202C-PXQW-1	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.20SQ,25		.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.02 Mbps	S-XQCC-N24		.9 mm	5 mm			e3			5 mm
ENW89823C3KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2.178 Mbps	R-XXMA-N24		2 mm	9 mm						9.5 mm
ENW89829C3KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.6 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2.178 Mbps	R-XXMA-N24		2 mm	6.5 mm						9 mm
KGL4195KD	Lapis Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	QCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER			.5 mm	95 Cel	-40 Cel		QUAD		S-XQCC-N24		1.65 mm	4 mm	Not Qualified					4 mm
LNBH26LSPQR	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1					12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-XQCC-N24	1	1 mm	4 mm						4 mm
SL869GNS117T001	Telit Communications Plc	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE				85 Cel	-40 Cel		DUAL		R-PDSO-N24		2.4 mm	12.2 mm				NOT SPECIFIED	NOT SPECIFIED	16 mm
SN65LVPE501RGET	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	2	2	CMOS		.12 mA	3.3 V	3.3	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	5 Mbps	S-PQCC-N24	2	1 mm	4 mm	Not Qualified		e4	30	260	4 mm
TFF11139HN/N1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm					260	4 mm
ATBTLC1000-MR110CA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.6 V		MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)		.9 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N24		2.165 mm	12.7 mm						20.157 mm
BH1417FV-E2	ROHM		INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES					28 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.3	Other Telecom ICs	.635 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24				Not Qualified
ENW89823A2KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2.178 Mbps	R-XXMA-N24		2 mm	9 mm				50	250	9.5 mm
LA72912V-MPB-H	Onsemi		OTHER	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES			BIPOLAR		.032 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP24,.3	Other Telecom ICs	.635 mm	70 Cel	-30 Cel	TIN BISMUTH	DUAL		R-PDSO-G24	3			Not Qualified		e6	30	260
LTC5589IUF#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		R-PQCC-N24		.8 mm	6 mm			e3			6 mm
MAX7060ATG/V+	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
W2SG0084I-B-TR	Wi2wi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	QMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel		QUAD		R-XQMA-N24	1	2.3 mm	11.2 mm					260	12 mm
RN4020BCN-V/RM120	Microchip Technology	TELECOM CIRCUIT	OTHER	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)		1.2 mm	85 Cel	-30 Cel	GOLD OVER NICKEL	UNSPECIFIED	1 Mbps	R-XXMA-N24		2.38 mm	11.5 mm			e4			19.5 mm
SE2435L-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					4 V	4	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N24	1	.9 mm	4 mm	Not Qualified		e4		260	4 mm
SKYA21043	Skyworks Solutions	TELECOM CIRCUIT		NO LEAD	24		RECTANGULAR		YES	1			AEC-Q100								105 Cel	-40 Cel		BOTTOM		R-XBGA-N24
SE2432L-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		R-XQCC-N24	1	.9 mm	3 mm						4 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.