24 Other Function Telecom Interface ICs 419

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

SN65LVPE502RGER

Texas Instruments

TELECOM CIRCUIT

OTHER

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

2

2

CMOS

.12 mA

3.3 V

3.3

CHIP CARRIER

LCC24,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

0 Cel

NICKEL PALLADIUM GOLD

QUAD

5 Mbps

S-PQCC-N24

2

1 mm

4 mm

Not Qualified

e4

30

260

4 mm

ADL5390ACPZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N24

1 mm

4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

4 mm

HMC914LP4ETR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N24

1

1 mm

4 mm

Not Qualified

e3

30

260

4 mm

HMC705LP4E

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN OVER NICKEL

QUAD

S-PQCC-N24

1

1 mm

4 mm

Not Qualified

e3

40

260

4 mm

ADF5709BEZ

Analog Devices

TELECOM CIRCUIT

NO LEAD

24

QCCN

SQUARE

CERAMIC

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-CQCC-N24

1.2 mm

3.9 mm

3.9 mm

AD7010ARS-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP24,.3

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G24

2 mm

5.3 mm

Not Qualified

e0

8.2 mm

ADL5390ACPZ-REEL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

3

1 mm

4 mm

Not Qualified

e3

30

260

4 mm

ADM1041ARQ-REEL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G24

1

1.7526 mm

3.9116 mm

Not Qualified

e0

240

8.6614 mm

ADM1041AARQZ-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G24

1

1.7526 mm

3.9116 mm

Not Qualified

e3

30

260

8.6614 mm

LT5500EGN#TRPBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G24

1

1.727 mm

3.899 mm

Not Qualified

e3

260

8.649 mm

HMC737LP4E

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

4.2 V

CHIP CARRIER

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N24

1

1 mm

4 mm

Not Qualified

e3

30

260

4 mm

ADA4961ACPZN-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N24

3

.8 mm

4 mm

e4

30

260

4 mm

HMC739LP4ETR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N24

1

1 mm

4 mm

e3

30

260

4 mm

HMC737LP4TR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

4.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1 mm

4 mm

4 mm

HMC705LP4ETR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N24

1

1 mm

4 mm

e3

30

260

4 mm

ADM1041ARQZ-REEL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G24

1

1.7526 mm

3.9116 mm

Not Qualified

e3

260

8.6614 mm

HMC305BLP4E

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1 mm

4 mm

4 mm

LT5500EGN

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G24

1

1.727 mm

3.899 mm

Not Qualified

e0

8.649 mm

LT5500EGN#PBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G24

1

1.727 mm

3.899 mm

Not Qualified

e3

30

260

8.649 mm

ADP5589ACPZ-01-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

3

.8 mm

3.5 mm

e3

30

260

3.5 mm

MAX3966CEG+

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

70 Cel

0 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G24

1

1.73 mm

3.9 mm

Not Qualified

e3

8.65 mm

MAX3946ETG+

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

3.3 V

CHIP CARRIER

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

1

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

V62/12649-01XE

Analog Devices

OTHER

NO LEAD

24

QCCN

SQUARE

PLASTIC/EPOXY

YES

BIPOLAR

5 V

5

CHIP CARRIER

LCC24,.16SQ,20

Other Telecom ICs

.5 mm

105 Cel

-55 Cel

QUAD

S-PQCC-N24

ADM1041ARQZ-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G24

1

1.7526 mm

3.9116 mm

Not Qualified

e3

30

260

8.6614 mm

ADP5589ACPZ-02-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

3

.8 mm

3.5 mm

e3

30

260

3.5 mm

HMC738LP4ETR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N24

1

1 mm

4 mm

e3

30

260

4 mm

ADA4961ACPZ-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N24

.8 mm

4 mm

4 mm

AD7011ARS

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP24,.3

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G24

2 mm

5.3 mm

Not Qualified

e0

8.2 mm

AD1803JRU-REEL

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP24,.25

Modems

.65 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G24

1.2 mm

4.4 mm

Not Qualified

e0

7.8 mm

LT5500EGN#TR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G24

1

1.727 mm

3.899 mm

Not Qualified

e0

8.649 mm

HMC737LP4

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

4.2 V

CHIP CARRIER

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQCC-N24

1

1 mm

4 mm

Not Qualified

e0

4 mm

ADM1041AARQZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G24

1

1.7526 mm

3.9116 mm

Not Qualified

e3

260

8.6614 mm

HMC736LP4TR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

4.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1 mm

4 mm

4 mm

ADM1041ARQ-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G24

1

1.7526 mm

3.9116 mm

Not Qualified

e0

240

8.6614 mm

AD1803JRUZ-REEL

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP24,.25

Modems

.65 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G24

1.2 mm

4.4 mm

Not Qualified

e3

260

7.8 mm

HMC736LP4

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

4.2 V

CHIP CARRIER

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQCC-N24

1

1 mm

4 mm

Not Qualified

e0

4 mm

ADF5709BEZ-R7

Analog Devices

TELECOM CIRCUIT

NO LEAD

24

QCCN

SQUARE

CERAMIC

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-CQCC-N24

1.2 mm

3.9 mm

3.9 mm

ADM1041ARQZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G24

1

1.7526 mm

3.9116 mm

Not Qualified

e3

30

260

8.6614 mm

HMC738LP4

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

VQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

QUAD

S-XQCC-N24

1

1 mm

4 mm

Not Qualified

e0

4 mm

HMC700LP4E

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N24

1

1 mm

4 mm

Not Qualified

e3

260

4 mm

HMC736LP4ETR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

4.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-PQCC-N24

1

1 mm

4 mm

e3

30

260

4 mm

ADL5380ACPZ-R2

Analog Devices

INDUSTRIAL

NO LEAD

24

QCCN

SQUARE

PLASTIC/EPOXY

YES

BIPOLAR

5 V

5

CHIP CARRIER

LCC24,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn)

QUAD

S-PQCC-N24

Not Qualified

e3

HMC738LP4TR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1 mm

4 mm

4 mm

ADM1041ARQ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G24

1

1.7526 mm

3.9116 mm

Not Qualified

e0

240

8.6614 mm

HMC914LP4E

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N24

1

1 mm

4 mm

Not Qualified

e3

30

260

4 mm

HMC700LP4

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQCC-N24

1

1 mm

4 mm

Not Qualified

e0

235

4 mm

ADL5375-05SCPZEPWP

Analog Devices

OTHER

NO LEAD

24

QCCN

SQUARE

PLASTIC/EPOXY

YES

BIPOLAR

5 V

5

CHIP CARRIER

LCC24,.16SQ,20

Other Telecom ICs

.5 mm

105 Cel

-55 Cel

QUAD

S-PQCC-N24

HMC705LP4TRE

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-PQCC-N24

1

1 mm

4 mm

e3

4 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.