32 Other Function Telecom Interface ICs 507

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

BGT24MTR12E6327XUSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

R-PQCC-N32

.9 mm

4.5 mm

NOT SPECIFIED

NOT SPECIFIED

5.5 mm

BGT24ATR11

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

R-PQCC-N32

3

.9 mm

4.5 mm

5.5 mm

BGT24AR2E6327

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

R-PQCC-N32

.9 mm

4.5 mm

5.5 mm

BGT24ATR11E6433XUMA1

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

TIN

QUAD

R-PQCC-N32

3

.9 mm

4.5 mm

e3

5.5 mm

BGT24AT2

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

R-PQCC-N32

.9 mm

4.3 mm

NOT SPECIFIED

NOT SPECIFIED

5.5 mm

BGT24ATR12E6433XUMA1

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

TIN

QUAD

R-PQCC-N32

3

.9 mm

4.5 mm

e3

5.5 mm

BGT24MTR11

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

R-PQCC-N32

3

.9 mm

4.5 mm

5.5 mm

BCM20736A0KML2G

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

QUAD

S-XQCC-N32

1 mm

5 mm

5 mm

CYW20730A1KML2G

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

0 Cel

QUAD

S-XQCC-N32

1 mm

5 mm

5 mm

CYW20730A2KML2G

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

0 Cel

QUAD

S-XQCC-N32

1 mm

5 mm

5 mm

CYW20732A0KML2G

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

QUAD

S-XQCC-N32

1 mm

5 mm

5 mm

CYBLE-224110-00

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

.76 mm

105 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N32

1.9 mm

9.5 mm

15.4 mm

DS21372T+

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, THIN PROFILE

.8 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G32

1

1.2 mm

7 mm

Not Qualified

e3

30

260

7 mm

DS21372TN

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, THIN PROFILE

.8 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

1.2 mm

7 mm

Not Qualified

e0

7 mm

DS2172TN+T&R

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

FLATPACK, THIN PROFILE

.8 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G32

1

1.2 mm

7 mm

Not Qualified

e3

7 mm

PHY2078QS-RR

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

95 Cel

-40 Cel

QUAD

S-XQCC-N32

.8 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

MAX3670ETJ+T

Maxim Integrated

INDUSTRIAL

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

72 mA

3.3/5

CHIP CARRIER

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N32

1

Not Qualified

e3

30

260

DS21372TN+

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, THIN PROFILE

.8 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G32

1

1.2 mm

7 mm

Not Qualified

e3

30

260

7 mm

DS2172T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

5

FLATPACK, THIN PROFILE

TQFP32,.35SQ,32

Other Telecom ICs

.8 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

1.2 mm

7 mm

Not Qualified

e0

7 mm

DS2172TN

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

5

FLATPACK, THIN PROFILE

TQFP32,.35SQ,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

1.2 mm

7 mm

Not Qualified

e0

7 mm

DS2172T+

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

5

FLATPACK, THIN PROFILE

TQFP32,.35SQ,32

Other Telecom ICs

.8 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G32

1

1.2 mm

7 mm

Not Qualified

e3

30

260

7 mm

PHY2078QT-BR

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

95 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1

.8 mm

5 mm

e3

30

260

5 mm

DS2172

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

5

FLATPACK, THIN PROFILE

TQFP32,.35SQ,32

Other Telecom ICs

.8 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

1.2 mm

7 mm

Not Qualified

e0

7 mm

PHY1078-01QS-RR

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

95 Cel

-40 Cel

QUAD

S-XQCC-N32

.8 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

PHY2078QS-BR

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

95 Cel

-40 Cel

QUAD

S-XQCC-N32

.8 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

DS2172T+T&R

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

5

FLATPACK, THIN PROFILE

TQFP32,.35SQ,32

Other Telecom ICs

.8 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G32

1

1.2 mm

7 mm

Not Qualified

e3

30

260

7 mm

DS21372

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, THIN PROFILE

.8 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

1.2 mm

7 mm

Not Qualified

e0

7 mm

DS2172T/T&R

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

5

FLATPACK, THIN PROFILE

TQFP32,.35SQ,32

Other Telecom ICs

.8 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

1.2 mm

7 mm

Not Qualified

e0

7 mm

DS21372N

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, THIN PROFILE

.8 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

1.2 mm

7 mm

Not Qualified

e0

7 mm

PHY1078-01QS-BR

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

95 Cel

-40 Cel

QUAD

S-XQCC-N32

.8 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

DS2172TN+

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

5

FLATPACK, THIN PROFILE

TQFP32,.35SQ,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G32

1

1.2 mm

7 mm

Not Qualified

e3

30

260

7 mm

DS21372T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, THIN PROFILE

.8 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

1.2 mm

7 mm

Not Qualified

e0

7 mm

DS2172TN/T&R

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

5

FLATPACK, THIN PROFILE

TQFP32,.35SQ,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

1.2 mm

7 mm

Not Qualified

e0

7 mm

MAX7031HATJ17-T

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

2.7 V

2.5/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

.8 mm

5 mm

Not Qualified

e0

5 mm

MAX5980UTJ+

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

54 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1

.8 mm

5 mm

e3

30

260

5 mm

MAX7031HATJ51+

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

2.7 V

2.5/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e3

30

260

5 mm

MAX7031LATJ+

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

.0204 mA

2.7 V

2.5/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

TIN

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e3

5 mm

MAX1471ATJ

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

.0086 mA

3 V

2.4/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e0

245

5 mm

MAX5980UTJ+T

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

54 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

S-XQCC-N32

.8 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

MAX7033ETJ+

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

.00688 mA

3.3 V

3.3/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

105 Cel

-40 Cel

TIN

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e3

5 mm

MAX7030HATJ

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

.0204 mA

2.7 V

2.5/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e0

5 mm

MAX7031LATJ-T

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

2.7 V

2.5/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

.8 mm

5 mm

Not Qualified

e0

5 mm

MAX1471AGJ/VY+

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

AEC-Q100

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1

.8 mm

5 mm

e3

30

260

5 mm

MAX7032ATJ+WC6L

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1

.8 mm

5 mm

e3

30

260

5 mm

MAX7032ATJ+TWC6L

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

S-XQCC-N32

.8 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

MAX7031HATJ51-T

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

2.7 V

2.5/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

.8 mm

5 mm

Not Qualified

e0

5 mm

MAX7031MATJ50+T

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

.0204 mA

2.7 V

2.5/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

QUAD

S-XQCC-N32

.8 mm

5 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

5 mm

MAX1471ATJ-T

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

.0086 mA

3 V

2.4/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e0

245

5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.