32 Other Function Telecom Interface ICs 507

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SLRC61002HN/TRAYB	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32		1 mm	5 mm					5 mm
OL2311AHN/C0B,515	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			21.5 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32	2A	.85 mm	5 mm	Not Qualified			260	5 mm
TDA18250BHN/C1,518	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER							QUAD		S-PQCC-N32
TDA8751T	NXP Semiconductors		COMMERCIAL	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR			5 V	5	SMALL OUTLINE	SOP32,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		DUAL		R-PDSO-G32				Not Qualified
TDA18275HN/C1,518	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER					-20 Cel		QUAD		S-PQCC-N32
SLRC61002HN/TRAYBM	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32		1 mm	5 mm					5 mm
TEF6657HN/V101	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		3.3 V		CHIP CARRIER				85 Cel	-40 Cel		QUAD		S-PQCC-N32
TDA8051T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			5 V	5	SMALL OUTLINE	SOP32,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		DUAL		R-PDSO-G32		2.65 mm	7.5 mm	Not Qualified				20.5 mm
PT5010A0HN/C1	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N32		1 mm	5 mm					5 mm
NCF3320AHN/0Y	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	RECTANGULAR	UNSPECIFIED	YES	1						CHIP CARRIER, HEAT SINK/SLUG				85 Cel	-40 Cel		QUAD		R-XQCC-N32
TDA18250BHN/C1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER							QUAD		S-PQCC-N32
TDA18250BHN/C1Y	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-PQCC-N32	3	.85 mm	5 mm				260	5 mm
OL2381AHN/C0CZ	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32		.85 mm	5 mm					5 mm
P5DF081HN/T1AD2060	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG				85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32					e4
UAA3559HN	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN/NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32		1 mm	5 mm	Not Qualified	e3/e4			5 mm
UAA3558HN	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3 V		CHIP CARRIER				50 Cel	-10 Cel	TIN/NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32				Not Qualified	e3/e4
SLRC61002HN/T/R	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32		1 mm	5 mm					5 mm
UAA3558HL	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3 V	3	FLATPACK	QFP32,.28SQ,20	Other Telecom ICs	.5 mm	50 Cel	-10 Cel	TIN	QUAD		S-PQFP-G32				Not Qualified	e3
TEF6657HN/V101,518	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		3.3 V		CHIP CARRIER				85 Cel	-40 Cel		QUAD		S-PQCC-N32
MC33596FCER2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm					5 mm
MC33596FJE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-PQFP-G32	3	1.6 mm	5 mm		e3	40	260	5 mm
MC33696FJER2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32		1.6 mm	5 mm			40	260	5 mm
MC33696FCAER2	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD		S-XQCC-N32		1 mm	5 mm			40	260	5 mm
935297333118	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-25 Cel		QUAD	1 Mbps	S-PQCC-N32		1 mm	5 mm					5 mm
MC33596FCAE	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD		S-XQCC-N32	3	1 mm	5 mm			40	260	5 mm
MMDS25254HT1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.23,20		.5 mm	150 Cel		TIN	QUAD		S-PQCC-N32	3	.9 mm	6 mm		e3	40	260	6 mm
MC33696FCAE	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD		S-XQCC-N32		1 mm	5 mm			40	260	5 mm
MC33596FJAER2	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-20 Cel		QUAD		S-PQFP-G32		1.6 mm	5 mm			40	260	5 mm
MC33696FJE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-PQFP-G32	3	1.6 mm	5 mm		e3	40	260	5 mm
MC33596FCE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm			40	260	5 mm
MC33696FCE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32	3	1 mm	5 mm			40	260	5 mm
935297333157	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-25 Cel		QUAD	1 Mbps	S-PQCC-N32		1 mm	5 mm					5 mm
MC33696FJAER2	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-20 Cel		QUAD		S-PQFP-G32		1.6 mm	5 mm			40	260	5 mm
MMDS09254HT1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.23,20		.5 mm	150 Cel		TIN	QUAD		S-PQCC-N32	3	.9 mm	6 mm		e3	40	260	6 mm
935297333151	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-25 Cel		QUAD	1 Mbps	S-PQCC-N32		1 mm	5 mm					5 mm
MC33596FJER2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-PQFP-G32	3	1.6 mm	5 mm		e3	40	260	5 mm
MC33696FCER2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm					5 mm
MMDS36254HT1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.23,20		.5 mm	150 Cel		TIN	QUAD		S-PQCC-N32	3	.9 mm	6 mm		e3	40	260	6 mm
MC33596FCAER2	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD		S-XQCC-N32	3	1 mm	5 mm			40	260	5 mm
MC33596FJAE	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-20 Cel	TIN	QUAD		S-PQFP-G32	3	1.6 mm	5 mm		e3	40	260	5 mm
MKW30Z160VHM4R	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	UNSPECIFIED	YES	1						CHIP CARRIER				85 Cel	-40 Cel		QUAD		S-XQCC-N32	3					40	260
MMDS20254HT1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm			TIN	QUAD		S-PQCC-N32	3	.9 mm	6 mm		e3	40	260	6 mm
MC33696FJAE	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-20 Cel	TIN	QUAD		S-PQFP-G32	3	1.6 mm	5 mm		e3	40	260	5 mm
MKW30Z160VHM4	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	UNSPECIFIED	YES	1						CHIP CARRIER				85 Cel	-40 Cel		QUAD		S-XQCC-N32	3					40	260
CLRC66303HN/T/R	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32		1 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
CLRC66302HN/T/R	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32		1 mm	5 mm					5 mm
MFRC52301HN1/TRAYBM	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32		1 mm	5 mm	Not Qualified				5 mm
CLRC66301HN/TRAYB	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32		1 mm	5 mm					5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.