Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N32 |
3 |
.9 mm |
5 mm |
Not Qualified |
e4 |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
UNSPECIFIED |
R-XXMA-N32 |
2.4 mm |
13.4 mm |
e4 |
25.8 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N32 |
1 |
1 mm |
5 mm |
e3 |
30 |
260 |
5 mm |
|||||||||||||||||||||||||||||||||||||
|
Telit Communications Plc |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
2.6 mm |
11 mm |
NOT SPECIFIED |
NOT SPECIFIED |
11 mm |
||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.0012 mA |
2.7 V |
2.7 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-25 Cel |
QUAD |
S-PQCC-N32 |
2A |
.85 mm |
5 mm |
Not Qualified |
260 |
5 mm |
||||||||||||||||||||||||||||||||||||
|
Qorvo |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
1 mm |
5 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
|||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e0 |
240 |
5 mm |
|||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e0 |
240 |
5 mm |
|||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
TELECOM CIRCUIT |
NO LEAD |
32 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
2 Mbps |
S-PQCC-N32 |
3 |
1 mm |
5 mm |
e4 |
260 |
5 mm |
|||||||||||||||||||||||||||||||||||||||
Microchip Technology |
TELECOM CIRCUIT |
NO LEAD |
32 |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
LCC32(UNSPEC) |
85 Cel |
-40 Cel |
QUAD |
.08 Mbps |
S-XQCC-N32 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N32 |
.8 mm |
6 mm |
e3 |
6 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
2 Mbps |
S-XQCC-N32 |
.9 mm |
5 mm |
5 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
2/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N32 |
3 |
.8 mm |
5 mm |
Not Qualified |
e4 |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
QUAD |
.0006 Mbps |
S-XQCC-N32 |
.9 mm |
5 mm |
e3 |
5 mm |
|||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
1 mm |
5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
INDUSTRIAL |
NO LEAD |
32 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.2,3.3 |
CHIP CARRIER |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N32 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
1.8/3.3,2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-30 Cel |
TIN/NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N32 |
1 mm |
5 mm |
Not Qualified |
e3/e4 |
5 mm |
|||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
MODULE,32LEAD(UNSPEC) |
1 mm |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
UNSPECIFIED |
3 Mbps |
R-XXMA-N32 |
2.4 mm |
13.4 mm |
e4 |
25.8 mm |
||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2.7 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N32 |
2 |
1 mm |
5 mm |
Not Qualified |
SINGLE-ENDED |
e4 |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
2/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N32 |
3 |
.8 mm |
5 mm |
Not Qualified |
e4 |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
.8 mm |
5 mm |
e3 |
260 |
5 mm |
|||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
DUAL |
R-PDSO-G32 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
OTHER |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-25 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G32 |
1 |
2.65 mm |
7.5 mm |
Not Qualified |
e4 |
30 |
250 |
20.5 mm |
|||||||||||||||||||||||||||||||||||||
Cml Microcircuits |
INDUSTRIAL |
NO LEAD |
32 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
20 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N32 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||
|
Espressif Systems (Shanghai) |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
72.2 Mbps |
S-XQCC-N32 |
3 |
.9 mm |
5 mm |
e3 |
30 |
250 |
5 mm |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N32 |
3 |
1 mm |
5 mm |
e3 |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
OTHER |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-25 Cel |
DUAL |
R-PDSO-G32 |
2.65 mm |
7.5 mm |
Not Qualified |
20.5 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Abracon |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.2 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N32 |
3 |
2.2 mm |
13.4 mm |
25.8 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
1.25 Mbps |
S-PQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
5 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
32 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.5 V |
CHIP CARRIER, HEAT SINK/SLUG |
.5 mm |
85 Cel |
-55 Cel |
QUAD |
S-XQCC-N32 |
1.12 mm |
5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
54 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N32 |
1 |
.8 mm |
5 mm |
e3 |
30 |
260 |
5 mm |
|||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
INDUSTRIAL |
NO LEAD |
32 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3 V |
3 |
CHIP CARRIER |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N32 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-30 Cel |
PURE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
5 mm |
|||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N32 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-XQCC-N32 |
2 |
.9 mm |
5 mm |
e3 |
NOT SPECIFIED |
260 |
5 mm |
||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
3 |
.9 mm |
5 mm |
40 |
260 |
5 mm |
|||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.16SQ,16 |
.4 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
2 Mbps |
S-XQCC-N32 |
2 |
.9 mm |
4 mm |
e3 |
40 |
260 |
4 mm |
||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
2 |
.9 mm |
5 mm |
e3 |
40 |
260 |
5 mm |
||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
2 |
.9 mm |
5 mm |
e3 |
40 |
260 |
5 mm |
||||||||||||||||||||||||||||||||||||||
Cypress Semiconductor |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-30 Cel |
QUAD |
S-XQCC-N32 |
1 mm |
5 mm |
5 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
.66 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
S-XXMA-N32 |
1.8 mm |
11 mm |
NOT SPECIFIED |
NOT SPECIFIED |
11 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
3 |
.9 mm |
5 mm |
40 |
260 |
5 mm |
|||||||||||||||||||||||||||||||||||||||
|
Skyworks Solutions |
TELECOM CIRCUIT |
OTHER |
BUTT |
32 |
TFLGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
0 Cel |
BOTTOM |
S-PBGA-B32 |
1.1 mm |
5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.16SQ,16 |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1 Mbps |
S-XQCC-N32 |
1 mm |
4 mm |
e3 |
4 mm |
|||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
32 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.5 V |
CHIP CARRIER, HEAT SINK/SLUG |
.5 mm |
85 Cel |
-55 Cel |
GOLD OVER NICKEL |
QUAD |
S-XQCC-N32 |
1.12 mm |
5 mm |
Not Qualified |
e4 |
5 mm |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
3 |
1.12 mm |
4.9 mm |
30 |
260 |
4.9 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N32 |
2 |
1 mm |
5 mm |
Not Qualified |
e4 |
30 |
260 |
5 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.