32 Other Function Telecom Interface ICs 507

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
FIN212ACMLX	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.775 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	.8 mm	5 mm	Not Qualified		e4	30	260	5 mm
FIN210ACMLX	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					2.775 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	-30 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified		e4	30	260	5 mm
AMIS-53000-I	Onsemi		INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			70 mA		2.2/3.3	FLATPACK	QFP32,.35SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32				Not Qualified
19608-001-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified		e0			7 mm
AMIS-53050-I/A-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK	QFP32(UNSPEC)			85 Cel	-40 Cel		QUAD	.128 Mbps	R-PQFP-G32
19608-004-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified					7 mm
19608-004-XTD	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified					7 mm
AMIS-5300-A	Onsemi		INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			70 mA		2.2/3.3	FLATPACK	QFP32,.35SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32				Not Qualified
AMIS-53000-M	Onsemi		INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			70 mA		2.2/3.3	FLATPACK	QFP32,.35SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32				Not Qualified
19637-001-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32			7 mm	Not Qualified					7 mm
AMIS-53050-I/A-XTD	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK	QFP32(UNSPEC)			85 Cel	-40 Cel		QUAD	.128 Mbps	R-PQFP-G32
FIN212ACGFX	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	-30 Cel		QUAD		S-XQCC-N32		.8 mm	5 mm						5 mm
19608-003-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified					7 mm
19608-002-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified		e0			7 mm
19637-002-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G32			7 mm	Not Qualified					7 mm
19608-002-XTD	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified		e0			7 mm
ST95HF-VMD5T	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N32	1	1 mm	5 mm			e4		260	5 mm
STA5620TR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			.019 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	5 mm
STB3300	STMicroelectronics	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1				.06 mA	5 V	5	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	Other Telecom ICs	.8 mm	125 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified		e0			7 mm
STB6100T	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	32	VQCCN	SQUARE	UNSPECIFIED	YES	1							CHIP CARRIER			.5 mm			Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	3	1 mm	5 mm	Not Qualified		e3	30	260	5 mm
STA5630ATR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	5 mm
STB5701TR	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N32		1 mm	5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	5 mm
STB5701	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N32		1 mm	5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	5 mm
ST952	STMicroelectronics		INDUSTRIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES		HYBRID						FLATPACK	QFP32,.35SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G32				Not Qualified		e0
STA5630TR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Silver (Ag)	QUAD		S-XQCC-N32	3	1 mm	5 mm			e4	30	260	5 mm
STB6100	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	32	VQCCN	SQUARE	UNSPECIFIED	YES	1							CHIP CARRIER			.5 mm			Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	3	1 mm	5 mm	Not Qualified		e3	30	260	5 mm
BLUENRG-355AT	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	105 Cel	-40 Cel		QUAD	2 Mbps	S-PQCC-N32		1 mm	5 mm						5 mm
BLUENRG-355AC	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel		QUAD	2 Mbps	S-PQCC-N32		1 mm	5 mm						5 mm
BLUENRGQTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	5 mm
MWCT1011CFM	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER				85 Cel	-40 Cel	TIN	QUAD		S-XQCC-N32	3					e3	40	260
TEF6659HN/V101	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			3.3 V		CHIP CARRIER				85 Cel	-40 Cel		QUAD		S-PQCC-N32
TDA8050A	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		0 V		5 V	5	SMALL OUTLINE	SOP32,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G32				Not Qualified		e4
TDA18250AHN/C1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER							QUAD		S-PQCC-N32
TDA18250BHN/C1K	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-PQCC-N32	3	.85 mm	5 mm					260	5 mm
PT5010A0HN/C1,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N32		1 mm	5 mm						5 mm
OL2381AHN	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.7 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	3		5 mm			e4			5 mm
TZA3040HL-T	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1							FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD		S-PQFP-G32		1.6 mm	5 mm	Not Qualified					5 mm
TDA18250BHN/C1E	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-PQCC-N32	3	.85 mm	5 mm					260	5 mm
P5DF081HN/T1AD2060,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER				85 Cel	-25 Cel		QUAD		S-PQCC-N32
TDA8050TD-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	Tin/Lead (Sn85Pb15)	DUAL		R-PDSO-G32		2.65 mm	7.5 mm	Not Qualified		e0			20.5 mm
QN9021	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N32		.8 mm	5 mm						5 mm
OL2311AHN	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32	3	.85 mm	5 mm						5 mm
TDA8051TD-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL		R-PDSO-G32		2.65 mm	7.5 mm	Not Qualified					20.5 mm
MWCT1200CFM	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER				85 Cel	-40 Cel	TIN	QUAD		S-XQCC-N32	3					e3	40	260
TDA8050T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR				5 V	5	SMALL OUTLINE	SOP32,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	Tin/Lead (Sn85Pb15)	DUAL		R-PDSO-G32		2.65 mm	7.5 mm	Not Qualified		e0			20.5 mm
P5DF081HN/T1AR1070	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD	1.5 Mbps	S-PQCC-N32	1	.85 mm	5 mm		ALSO AVAILABLE WITH 5V NOMINAL SUPPLY	e4		260	5 mm
TDA18275HN/C1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER					-20 Cel		QUAD		S-PQCC-N32
TZA3040HL	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1							FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD		S-PQFP-G32		1.6 mm	5 mm	Not Qualified					5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.