Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
40 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.7 V |
MICROELECTRONIC ASSEMBLY |
MODULE,40LEAD(UNSPEC) |
1.2 mm |
70 Cel |
-20 Cel |
UNSPECIFIED |
R-XXMA-N40 |
2.5 mm |
15 mm |
29 mm |
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|
Microchip Technology |
TELECOM CIRCUIT |
NO LEAD |
40 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
MODULE,40LEAD(UNSPEC) |
UNSPECIFIED |
3 Mbps |
R-XXMA-N40 |
2.7 mm |
13.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
26 mm |
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|
NXP Semiconductors |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.4 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-30 Cel |
QUAD |
S-PQCC-N40 |
2 |
1 mm |
6 mm |
6 mm |
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|
NXP Semiconductors |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-30 Cel |
QUAD |
S-PQCC-N40 |
2 |
1 mm |
6 mm |
260 |
6 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
30 |
260 |
6 mm |
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Fanstel |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
1 Mbps |
R-XXMA-N40 |
14 mm |
20.8 mm |
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Fanstel |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
1 Mbps |
R-XXMA-N40 |
14 mm |
20.8 mm |
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Fanstel |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
1 Mbps |
R-XXMA-N40 |
14 mm |
16 mm |
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Fanstel |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
1 Mbps |
R-XXMA-N40 |
14 mm |
16 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
30 |
260 |
6 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
2 Mbps |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
e4 |
30 |
260 |
6 mm |
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|
NXP Semiconductors |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-30 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N40 |
2 |
1 mm |
6 mm |
e4 |
30 |
260 |
6 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
12 Mbps |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
30 |
260 |
6 mm |
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|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
AEC-Q100 |
3 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N40 |
1 |
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Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
QMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
12 Mbps |
R-XQMA-N40 |
2.8 mm |
13.5 mm |
HEAT SINK IS PRESENT |
17 mm |
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|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2X.27,20 |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-PQCC-N40 |
1 |
1 mm |
5 mm |
e4 |
260 |
7 mm |
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|
NXP Semiconductors |
TELECOM CIRCUIT |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.23SQ,20 |
.5 mm |
85 Cel |
-25 Cel |
QUAD |
.848 Mbps |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
ALSO AVAILABLE WTH 3.3 SUPPLY |
260 |
6 mm |
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|
NXP Semiconductors |
OTHER |
NO LEAD |
40 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.8/3.3,2.5/3.3 |
CHIP CARRIER |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-30 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N40 |
3 |
Not Qualified |
e4 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2X.27,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQCC-N40 |
1 mm |
5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
30 |
260 |
6 mm |
|||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
OTHER |
NO LEAD |
40 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.8/3.3,2.5/3.3 |
CHIP CARRIER |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-30 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N40 |
3 |
Not Qualified |
e4 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
12 Mbps |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
30 |
260 |
6 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
5 Mbps |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
6 mm |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
5 Mbps |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
6 mm |
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|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.25 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N40 |
2.1 mm |
14.4 mm |
21 mm |
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|
NXP Semiconductors |
OTHER |
NO LEAD |
40 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.8/3.3,2.5/3.3 |
CHIP CARRIER |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-30 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N40 |
3 |
Not Qualified |
e4 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
30 |
260 |
6 mm |
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|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N40 |
1 |
1 mm |
6 mm |
Not Qualified |
e3 |
260 |
6 mm |
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|
Cypress Semiconductor |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.4 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N40 |
3 |
1 mm |
6 mm |
Not Qualified |
e3 |
20 |
260 |
6 mm |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
5 Mbps |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
6 mm |
|||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N40 |
.9 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-20 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N40 |
2 |
.8 mm |
6 mm |
Not Qualified |
e4 |
30 |
260 |
6 mm |
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|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N40 |
3 |
.8 mm |
6 mm |
30 |
260 |
6 mm |
||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
.5 mm |
70 Cel |
-20 Cel |
QUAD |
S-XQCC-N40 |
.9 mm |
6 mm |
6 mm |
||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER |
.5 mm |
QUAD |
S-PQCC-N40 |
1 mm |
6 mm |
Not Qualified |
6 mm |
||||||||||||||||||||||||||||||||||||||||||||||
|
Toshiba |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N40 |
.9 mm |
5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
30 |
260 |
6 mm |
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|
Cml Microcircuits |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.08 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N40 |
1 mm |
6 mm |
Not Qualified |
6 mm |
||||||||||||||||||||||||||||||||||||||
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N40 |
1 mm |
6 mm |
6 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
2 Mbps |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
e4 |
30 |
260 |
6 mm |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
30 |
260 |
6 mm |
|||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N40 |
1 |
1 mm |
6 mm |
Not Qualified |
e3 |
40 |
260 |
6 mm |
||||||||||||||||||||||||||||||||||
Hittite Microwave |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N40 |
.9 mm |
6 mm |
6 mm |
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|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.25 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N40 |
2.1 mm |
14.4 mm |
21 mm |
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|
Cypress Semiconductor |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N40 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
20 |
260 |
6 mm |
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|
NXP Semiconductors |
TELECOM CIRCUIT |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.23SQ,20 |
.5 mm |
85 Cel |
-30 Cel |
QUAD |
S-PQCC-N40 |
2A |
1 mm |
6 mm |
260 |
6 mm |
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|
Qualcomm |
TELECOM CIRCUIT |
NO LEAD |
40 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.5 V |
CHIP CARRIER |
QUAD |
S-XQCC-N40 |
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|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.25 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N40 |
2.1 mm |
14.4 mm |
21 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.