40 Other Function Telecom Interface ICs 173

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

BM20SPKS1NBC-0001AA

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

40

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.7 V

MICROELECTRONIC ASSEMBLY

MODULE,40LEAD(UNSPEC)

1.2 mm

70 Cel

-20 Cel

UNSPECIFIED

R-XXMA-N40

2.5 mm

15 mm

29 mm

RN52-I/RM

Microchip Technology

TELECOM CIRCUIT

NO LEAD

40

XMA

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

MODULE,40LEAD(UNSPEC)

UNSPECIFIED

3 Mbps

R-XXMA-N40

2.7 mm

13.5 mm

NOT SPECIFIED

NOT SPECIFIED

26 mm

PN5321A3HN/C106;55

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.4 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

QUAD

S-PQCC-N40

2

1 mm

6 mm

6 mm

PN5321A3HN/C106,51

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

QUAD

S-PQCC-N40

2

1 mm

6 mm

260

6 mm

CC2530F256RHAR

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

3

1 mm

6 mm

Not Qualified

e4

30

260

6 mm

BT832F

Fanstel

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

XMA

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

1 Mbps

R-XXMA-N40

14 mm

20.8 mm

BT832AF

Fanstel

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

XMA

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

1 Mbps

R-XXMA-N40

14 mm

20.8 mm

BT832A

Fanstel

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

XMA

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

1 Mbps

R-XXMA-N40

14 mm

16 mm

BT832

Fanstel

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

XMA

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

1 Mbps

R-XXMA-N40

14 mm

16 mm

CC2530F256RHAT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

3

1 mm

6 mm

Not Qualified

e4

30

260

6 mm

CC2541F256TRHATQ1

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

2 Mbps

S-PQCC-N40

3

1 mm

6 mm

e4

30

260

6 mm

PN5321A3HN/C106

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

2

1 mm

6 mm

e4

30

260

6 mm

CC2531F256RHAT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

12 Mbps

S-PQCC-N40

3

1 mm

6 mm

Not Qualified

e4

30

260

6 mm

UBX-M8030-KT

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

QCCN

SQUARE

UNSPECIFIED

YES

1

AEC-Q100

3 V

CHIP CARRIER

85 Cel

-40 Cel

QUAD

S-XQCC-N40

1

WLR089U0-I/RM

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

QMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

QUAD

12 Mbps

R-XQMA-N40

2.8 mm

13.5 mm

HEAT SINK IS PRESENT

17 mm

AX-SFEU-1-01-TB05

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.2X.27,20

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

R-PQCC-N40

1

1 mm

5 mm

e4

260

7 mm

PN7160B1HN/C100Y

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.23SQ,20

.5 mm

85 Cel

-25 Cel

QUAD

.848 Mbps

S-PQCC-N40

3

1 mm

6 mm

ALSO AVAILABLE WTH 3.3 SUPPLY

260

6 mm

PN5120A0HN/C2,551

NXP Semiconductors

OTHER

NO LEAD

40

QCCN

SQUARE

PLASTIC/EPOXY

YES

1.8/3.3,2.5/3.3

CHIP CARRIER

LCC40,.24SQ,20

Other Telecom ICs

.5 mm

85 Cel

-30 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

3

Not Qualified

e4

30

260

AX-SFEU-1-03-TX30

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.2X.27,20

.5 mm

85 Cel

-40 Cel

QUAD

R-PQCC-N40

1 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

CC2530F32RHAT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

3

1 mm

6 mm

Not Qualified

e4

30

260

6 mm

PN5120A0HN/C2,557

NXP Semiconductors

OTHER

NO LEAD

40

QCCN

SQUARE

PLASTIC/EPOXY

YES

1.8/3.3,2.5/3.3

CHIP CARRIER

LCC40,.24SQ,20

Other Telecom ICs

.5 mm

85 Cel

-30 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

3

Not Qualified

e4

30

260

CC2531F256RHAR

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

12 Mbps

S-PQCC-N40

3

1 mm

6 mm

Not Qualified

e4

30

260

6 mm

CC8521RHAR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

5 Mbps

S-PQCC-N40

3

1 mm

6 mm

Not Qualified

e4

NOT SPECIFIED

260

6 mm

CC8521RHAT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

5 Mbps

S-PQCC-N40

3

1 mm

6 mm

Not Qualified

e4

NOT SPECIFIED

260

6 mm

WGM110E1MV2R

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.25 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N40

2.1 mm

14.4 mm

21 mm

PN5120A0HN/C2,518

NXP Semiconductors

OTHER

NO LEAD

40

QCCN

SQUARE

PLASTIC/EPOXY

YES

1.8/3.3,2.5/3.3

CHIP CARRIER

LCC40,.24SQ,20

Other Telecom ICs

.5 mm

85 Cel

-30 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

3

Not Qualified

e4

30

260

CC2530F64RHAT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

3

1 mm

6 mm

Not Qualified

e4

30

260

6 mm

MRF24J40-I/ML

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N40

1

1 mm

6 mm

Not Qualified

e3

260

6 mm

CYRF7936-40LFXC

Cypress Semiconductor

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

1

2.4 V

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N40

3

1 mm

6 mm

Not Qualified

e3

20

260

6 mm

CC8520RHAR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

5 Mbps

S-PQCC-N40

3

1 mm

6 mm

Not Qualified

e4

NOT SPECIFIED

260

6 mm

SI4777-A20-GMR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N40

.9 mm

6 mm

NOT SPECIFIED

NOT SPECIFIED

6 mm

SN761633RTAR

Texas Instruments

TELECOM CIRCUIT

OTHER

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-20 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

2

.8 mm

6 mm

Not Qualified

e4

30

260

6 mm

ADF7030-1BCPZN-RL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N40

3

.8 mm

6 mm

30

260

6 mm

IS1678SM-151-TRAY

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

.5 mm

70 Cel

-20 Cel

QUAD

S-XQCC-N40

.9 mm

6 mm

6 mm

PN5120A0HN/C2

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER

.5 mm

QUAD

S-PQCC-N40

1 mm

6 mm

Not Qualified

6 mm

TC35678FSG-002

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N40

.9 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

CC2530F128RHAR

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

3

1 mm

6 mm

Not Qualified

e4

30

260

6 mm

CMX994Q4

Cml Microcircuits

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.08 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N40

1 mm

6 mm

Not Qualified

6 mm

MRF24J40-I/MLVAO

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N40

1 mm

6 mm

6 mm

CC2541F256TRHARQ1

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

2 Mbps

S-PQCC-N40

3

1 mm

6 mm

e4

30

260

6 mm

CC2531F128RHAT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

3

1 mm

6 mm

Not Qualified

e4

30

260

6 mm

MRF24J40T-I/ML

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N40

1

1 mm

6 mm

Not Qualified

e3

40

260

6 mm

HMC743LP6CETR

Hittite Microwave

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N40

.9 mm

6 mm

6 mm

WGM110A1MV2

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.25 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N40

2.1 mm

14.4 mm

21 mm

CYRF6936-40LTXC

Cypress Semiconductor

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N40

3

1 mm

6 mm

Not Qualified

e4

20

260

6 mm

SR040HN/B02BY

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.23SQ,20

.5 mm

85 Cel

-30 Cel

QUAD

S-PQCC-N40

2A

1 mm

6 mm

260

6 mm

BC63B239A04-IQD-E4

Qualcomm

TELECOM CIRCUIT

NO LEAD

40

QCCN

SQUARE

UNSPECIFIED

YES

1

1.5 V

CHIP CARRIER

QUAD

S-XQCC-N40

WGM110A1MV2R

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.25 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N40

2.1 mm

14.4 mm

21 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.