40 Other Function Telecom Interface ICs 173

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Output High Voltage	Maximum Output Low Voltage	Standard	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Reference Point	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-1	Width	Qualification	Maximum Output Low Current	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AX-SFAZ-1-01-TX30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.27,20		.5 mm	85 Cel				-40 Cel	NICKEL GOLD PALLADIUM	QUAD	.0006 Mbps	R-PQCC-N40		1	1 mm		5 mm				30	260	7 mm
AX-SFAZ-API-1-01-TX30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.20X.28,20		.5 mm	85 Cel				-40 Cel	NICKEL GOLD PALLADIUM	QUAD	.0006 Mbps	R-XQCC-N40		1	1 mm		5 mm				30	260	7 mm
AX-SFEU-API-1-01-TB05	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.27,20		.5 mm	85 Cel				-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		R-PQCC-N40		1	1 mm		5 mm			e4		260	7 mm
AX-SFAZ-1-01-TB05	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.27,20		.5 mm	85 Cel				-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.0006 Mbps	R-PQCC-N40			1 mm		5 mm			e4			7 mm
STRADA431	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	40		SQUARE	UNSPECIFIED	YES	1		AEC-Q100		3.3 V			LCC40,.24SQ,20									QUAD		S-XQCC-N40					6 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
M088F1	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		MOS		180 mA	5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T40						Not Qualified		e0
STRADA431-TR	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	40		SQUARE	UNSPECIFIED	YES	1		AEC-Q100		3.3 V			LCC40,.24SQ,20									QUAD		S-XQCC-N40					6 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
MK2180AN	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		10 mA	5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T40				T-1(DS1)		Not Qualified		e0
M3488F1	STMicroelectronics			THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		CMOS			5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm						Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T40						Not Qualified		e0
PN7150B0HN/C11004Y	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	85 Cel				-30 Cel		QUAD		S-PQCC-N40			1 mm		6 mm						6 mm
PN7150B0HN/C11003	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	85 Cel				-30 Cel		QUAD		S-PQCC-N40			1 mm		6 mm						6 mm
PN7150B0HN/C11005Y	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	85 Cel				-30 Cel		QUAD		S-PQCC-N40			1 mm		6 mm						6 mm
PN7150B0HN/C11005E	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	85 Cel				-30 Cel		QUAD		S-PQCC-N40			1 mm		6 mm						6 mm
QN9022	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel				-40 Cel		QUAD		S-PQCC-N40			.9 mm		5 mm						5 mm
935408659518	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.23SQ,20		.5 mm	85 Cel				-30 Cel		QUAD		S-PQCC-N40			1 mm		6 mm						6 mm
PN7150B0HN/C11004E	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	85 Cel				-30 Cel		QUAD		S-PQCC-N40			1 mm		6 mm						6 mm
PN5321A3HN/C1XX	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel				-30 Cel		QUAD		S-PQCC-N40			1 mm		6 mm						6 mm
PN5120A0HN/C1,557	NXP Semiconductors		OTHER	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES						1.8/3.3,2.5/3.3	CHIP CARRIER	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel				-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40		3				Not Qualified		e4	30	260
PN5180A0HN/C1,518	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel				-30 Cel		QUAD		S-PQCC-N40			1 mm		6 mm						6 mm
PN5180A0HN/C1,551	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel				-30 Cel		QUAD		S-PQCC-N40			1 mm		6 mm						6 mm
PN5120A0HN/C1,518	NXP Semiconductors		OTHER	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES						1.8/3.3,2.5/3.3	CHIP CARRIER	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel				-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40		3				Not Qualified		e4	30	260
PN5110A0HN/C2	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.1 mA	3 V	1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel				-30 Cel	TIN/NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40			1 mm		6 mm	Not Qualified		e3/e4			6 mm
PN5120A0HN/C1,551	NXP Semiconductors		OTHER	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES						1.8/3.3,2.5/3.3	CHIP CARRIER	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel				-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40		3				Not Qualified		e4	30	260
PN5180A0HN/C2,551	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel				-30 Cel		QUAD		S-PQCC-N40			1 mm		6 mm						6 mm
PN5321A3HN/C101	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel				-30 Cel		QUAD		S-PQCC-N40			1 mm		6 mm	Not Qualified					6 mm
PN5120A0HN/C1	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.3,2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel				-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40		3	1 mm		6 mm	Not Qualified		e4	30	260	6 mm
PN5320A3HN/C101	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel				-30 Cel		QUAD		S-PQCC-N40			1 mm		6 mm	Not Qualified					6 mm
PN5320A3HN/C1XX	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel				-30 Cel		QUAD		S-PQCC-N40			1 mm		6 mm						6 mm
PEB2445C	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		CMOS		20 mA	5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T40						Not Qualified		e0
PEB2040	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		MOS					IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T40						Not Qualified		e0
PEB2052C	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		CMOS			5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T40						Not Qualified		e0
PEF2046C	Infineon Technologies		INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		CMOS		10 mA	5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	85 Cel				-40 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T40						Not Qualified		e0
PEB2045A-2P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T40						Not Qualified		e0
PEB2055-C	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		CMOS		9.5 mA	5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T40						Not Qualified		e0
PEB2055A2P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T40						Not Qualified		e0
PEB2045-PVA3	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T40						Not Qualified		e0
PEB20950-C	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		CMOS			5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T40						Not Qualified		e0
PEB2052P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T40						Not Qualified		e0
PEF2041P	Infineon Technologies		INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS					IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	85 Cel				-40 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T40						Not Qualified		e0
PEB2041P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS					IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T40						Not Qualified		e0
SLE5002K	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL		40				YES		CMOS			5 V	5		TAB,40PINS,.04	Other Telecom ICs		85 Cel				-40 Cel										Not Qualified
PEB2055-P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		9.5 mA	5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T40						Not Qualified		e0
SLE5002	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	85 Cel				-40 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T40						Not Qualified		e0
PSB2110-P	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS			5 V	5	IN-LINE	DIP40,.6	Digital Transmission Interfaces	2.54 mm	70 Cel	4.5 V	.45 V	CCITT I.411	0 Cel	TIN LEAD	DUAL	.064 Mbps	R-PDIP-T40	R		5.1 mm		15.24 mm	Not Qualified	7 Amp	e0			50.9 mm
PEB2045C	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		CMOS		10 mA	5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T40						Not Qualified		e0
PEB2046C	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		CMOS		10 mA	5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T40						Not Qualified		e0
PEF2045C	Infineon Technologies		INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		CMOS		10 mA	5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	85 Cel				-40 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T40						Not Qualified		e0
BCM20730A2KMLG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel				0 Cel		QUAD		S-XQCC-N40			1 mm		6 mm						6 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.