40 Other Function Telecom Interface ICs 173

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TDA7255VXUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	R-PQCC-N40		.9 mm		5.5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6.5 mm
TDA7255V	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		3 V	2.5/5	CHIP CARRIER, VERY THIN PROFILE	LCC40,.22X.26,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	R-PQCC-N40		.9 mm		5.5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6.5 mm
CYW20719B1KUMLG	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel	PURE TIN	QUAD	S-XQCC-N40	3	.6 mm		5 mm			30	260	5 mm
CYW20730A1KMLG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD	S-XQCC-N40		1 mm		6 mm					6 mm
CYW20738A2KML3G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD	S-XQCC-N40		1 mm		6 mm					6 mm
CYW20730A2KMLG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD	S-XQCC-N40		1 mm		6 mm					6 mm
PT7A8980PE	Diodes Incorporated		INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			10 mA	5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	85 Cel	-40 Cel		DUAL	R-PDIP-T40					Not Qualified
AP3860FNTR-G1	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N40		.8 mm		5 mm				260	5 mm
PI3USB30532ZLE	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	R-XQCC-N40		.8 mm		3 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
DS2181	Maxim Integrated		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T40			CEPT PCM-30/E-1		Not Qualified	e0
MAX24003TL+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	95 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N40	1	.8 mm		5 mm		e3	30	260	5 mm
MAX24003TL+T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	95 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N40	1	.8 mm		5 mm		e3	30	260	5 mm
TC35679FSG-002	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			1.1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N40		.9 mm		5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
TC35670FTG-006	Toshiba	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	S-PQCC-N40		.9 mm		6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
TC3567CFSG	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N40		.9 mm		5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
TC3567DFSG	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N40		.9 mm		5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
TC35667IFTG-006	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N40		.9 mm		6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
TC35678FSG001	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER				85 Cel	-40 Cel		QUAD	S-PQCC-N40
TC35667FSG-006	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N40		.9 mm		5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
TC35678FXG-002	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N40		.9 mm		7 mm			NOT SPECIFIED	NOT SPECIFIED	7 mm
TC35680FSG-002(ELG	Toshiba	TELECOM CIRCUIT		NO LEAD	40	HVQCCN	SQUARE		YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N40		.9 mm		5 mm					5 mm
TC35680FSG-002	Toshiba	TELECOM CIRCUIT		NO LEAD	40	HVQCCN	SQUARE		YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N40		.9 mm		5 mm					5 mm
TC35680FSG-002(E1C	Toshiba	TELECOM CIRCUIT		NO LEAD	40	HVQCCN	SQUARE		YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N40		.9 mm		5 mm					5 mm
TC35667FTG-006	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N40		.9 mm		6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
TC35679IFTG-002	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			1.1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N40		1 mm		6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
P9027LP-RAWGI8	Renesas Electronics	TELECOM CIRCUIT	OTHER	BALL	40	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B40	1	.65 mm		2.24 mm		e1		260	3.62 mm
DA14581-00AT1	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N40	3	.9 mm		5 mm					5 mm
DA14581-00AT2	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N40	1	.9 mm		5 mm					5 mm
BCM3419	Broadcom	TELECOM CIRCUIT		NO LEAD	40	QCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER							QUAD	S-XQCC-N40	1				Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.