400 Other Function Telecom Interface ICs 34

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

AFE7903IALK

Texas Instruments

TELECOM CIRCUIT

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.925 V

GRID ARRAY

BGA400,20X20,32

.8 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

29500 Mbps

S-PBGA-B400

3

2.65 mm

17 mm

ALSO VNOM IS 1.2V & 1.8V; RF Frequency Max is 7400 MHz; RF Frequency Min is 5 MHz

e0

220

17 mm

AFE7903IABJ

Texas Instruments

TELECOM CIRCUIT

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.925 V

GRID ARRAY

BGA400,20X20,32

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

29500 Mbps

S-PBGA-B400

3

2.65 mm

17 mm

ALSO VNOM IS 1.2V & 1.8V; RF Frequency Max is 7400 MHz; RF Frequency Min is 5 MHz

e1

260

17 mm

AFE8092IABJ

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

400

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY, FINE PITCH

BGA400,20X20,32

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

32500 Mbps

S-PBGA-B400

3

2.65 mm

17 mm

RF frequency(Min)(MHz) : 600, RF frequency(Max)(MHz) : 5500

e1

30

260

17 mm

PAFE7700IABJ

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

400

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B400

2.65 mm

17 mm

17 mm

AFE8092HIABJ

Texas Instruments

TELECOM CIRCUIT

BALL

400

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY, FINE PITCH

BGA400,20X20,32

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

32500 Mbps

S-PBGA-B400

3

2.65 mm

17 mm

RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500

e1

260

17 mm

AFE8000IABJ

Texas Instruments

TELECOM CIRCUIT

BALL

400

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY, FINE PITCH

BGA400,20X20,32

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

32500 Mbps

S-PBGA-B400

3

2.65 mm

17 mm

RF frequency(Max)(MHz) : 7000

e1

260

17 mm

AFE7700IABJ

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

400

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY, FINE PITCH

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

3

2.65 mm

17 mm

RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000

e1

30

260

17 mm

AFE7952IABJ

Texas Instruments

TELECOM CIRCUIT

BALL

400

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY, FINE PITCH

BGA400,20X20,32

.8 mm

TIN SILVER COPPER

BOTTOM

29500 Mbps

S-PBGA-B400

3

2.65 mm

17 mm

RF frequency(Min)(MHz) : 0; RF frequency(Max)(MHz) : 12000

e1

260

17 mm

AFE7901IALK

Texas Instruments

TELECOM CIRCUIT

BALL

400

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

.925 V

GRID ARRAY, FINE PITCH

BGA400,20X20,32

.8 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

29500 Mbps

S-PBGA-B400

3

2.65 mm

17 mm

e0

220

17 mm

AFE7901IABJ

Texas Instruments

TELECOM CIRCUIT

BALL

400

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

.925 V

GRID ARRAY, FINE PITCH

BGA400,20X20,32

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

29500 Mbps

S-PBGA-B400

3

2.65 mm

17 mm

e1

260

17 mm

80HCPS1616CHMGI

Renesas Electronics

TELECOM CIRCUIT

BALL

400

HBGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, HEAT SINK/SLUG

BGA400,20X20,40

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

80000 Mbps

S-PBGA-B400

4

2.83 mm

21 mm

245

21 mm

80HCPS1616RMI

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

4730 mA

1 V

1,2.5/3.3

GRID ARRAY

BGA400,20X20,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

4

2.83 mm

21 mm

Not Qualified

e1

245

21 mm

80HCPS1616CRM

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

4730 mA

1 V

1,2.5/3.3

GRID ARRAY

BGA400,20X20,40

Other Telecom ICs

1 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

4

2.83 mm

21 mm

Not Qualified

e1

30

245

21 mm

80HCPS1616HRI

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B400

3.34 mm

21 mm

21 mm

80HCPS1616CHRI

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

4730 mA

1 V

1,2.5/3.3

GRID ARRAY

BGA400,20X20,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

4

3.34 mm

21 mm

Not Qualified

e1

245

21 mm

80HCPS1616CRMI

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

4730 mA

1 V

1,2.5/3.3

GRID ARRAY

BGA400,20X20,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

4

2.83 mm

21 mm

Not Qualified

e1

30

245

21 mm

80HCPS1616HR

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

1 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B400

3.34 mm

21 mm

21 mm

80HCPS1616RM

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

4730 mA

1 V

1,2.5/3.3

GRID ARRAY

BGA400,20X20,40

Other Telecom ICs

1 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

4

2.83 mm

21 mm

Not Qualified

e1

245

21 mm

80HCPS1616CHR

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

4730 mA

1 V

1,2.5/3.3

GRID ARRAY

BGA400,20X20,40

Other Telecom ICs

1 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

4

3.34 mm

21 mm

Not Qualified

e1

245

21 mm

BCM5322M

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

R-PBGA-B400

Not Qualified

BCM53212M

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY

BOTTOM

Not Qualified

BCM5384

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

BOTTOM

X-PBGA-B400

1

Not Qualified

BCM5706

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

S-PBGA-B400

1

Not Qualified

BCM53202M

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY

BOTTOM

Not Qualified

BCM5321M

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

R-PBGA-B400

Not Qualified

BCM5320M

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

R-PBGA-B400

Not Qualified

BCM5324M

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

R-PBGA-B400

Not Qualified

BCM5825

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B400

1

Not Qualified

BCM5320MIPBG

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

R-PBGA-B400

NOT SPECIFIED

NOT SPECIFIED

BCM5682

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

PLASTIC/EPOXY

YES

1

2.5 V

GRID ARRAY

BOTTOM

X-PBGA-B400

1

Not Qualified

BCM5703

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B400

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

BCM53242M

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY

BOTTOM

Not Qualified

BCM5680

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

GRID ARRAY

BOTTOM

X-PBGA-B400

1

Not Qualified

HDMP-3268

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

2.5 V

GRID ARRAY

1.27 mm

BOTTOM

S-PBGA-B400

3.23 mm

37.5 mm

Not Qualified

37.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.