6 Other Function Telecom Interface ICs 133

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage	Package Style (Meter)	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BGA7M1N6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V	SMALL OUTLINE, VERY THIN PROFILE	.4 mm	85 Cel	-40 Cel	TIN	DUAL	R-PDSO-N6	1	.4 mm	.7 mm		e3			1.1 mm
BGA7L1N6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V	SMALL OUTLINE, VERY THIN PROFILE	.4 mm	85 Cel	-40 Cel	TIN	DUAL	R-PDSO-N6	1	.4 mm	.7 mm		e3			1.1 mm
BGA729N6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.8 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B6	1	.4 mm	.7 mm					1.1 mm
BGA924N6	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V	SMALL OUTLINE, VERY THIN PROFILE	.4 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6	1	.4 mm	.7 mm					1.1 mm
IRMS5000	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	6		RECTANGULAR	UNSPECIFIED	NO	1	BICMOS	5 V	MICROELECTRONIC ASSEMBLY		85 Cel	-25 Cel		SINGLE	R-XSMA-N6				Not Qualified
BGA924N6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V	SMALL OUTLINE, VERY THIN PROFILE	.4 mm	85 Cel	-40 Cel	TIN	DUAL	R-PDSO-N6	1	.4 mm	.7 mm		e3			1.1 mm
BGA8V1BN6	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		2.8 V	SMALL OUTLINE, VERY THIN PROFILE	.4 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6	1	.4 mm	.7 mm					1.1 mm
SP000892662	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		2.7 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-N6		.77 mm	1.7 mm		e3			2.3 mm
SLE95050H	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		1.55 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.65 mm	110 Cel	-20 Cel		QUAD	S-PQCC-N6		.8 mm	2.5 mm					2.5 mm
BGS12SN6	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.6 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel	Tin (Sn)	BOTTOM	R-XBCC-B6	1	.4 mm	.7 mm		e3	NOT SPECIFIED	NOT SPECIFIED	1.1 mm
BGS12SL6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		3 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B6		.32 mm	.7 mm			NOT SPECIFIED	NOT SPECIFIED	1.1 mm
BGM1032N7	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		2.7 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
BGS12S3N6	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1	MOS	2.6 V	CHIP CARRIER	.35 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B6	1	.4 mm	.65 mm					.98 mm
BGM1033N7E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		2.7 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
BGS12AL7-6	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.8 V	CHIP CARRIER	.48 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6	1	.4 mm	1.4 mm					1.26 mm
BGM1043N7E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		2.7 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
BGM1043N7	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		2.7 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
BGM1033N7E6327	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		2.7 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
BGS12S3N6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1	MOS	2.6 V	CHIP CARRIER	.35 mm	85 Cel	-40 Cel	TIN	BOTTOM	R-XBCC-B6	1	.4 mm	.65 mm		e3			.98 mm
BGS12AL76E6327XTMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.8 V	CHIP CARRIER	.48 mm	85 Cel	-30 Cel	GOLD	BOTTOM	R-XBCC-B6	1	.4 mm	1.4 mm		e4			1.26 mm
BGS12AL7-4	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.8 V	CHIP CARRIER	.55 mm	85 Cel	-30 Cel		BOTTOM	R-XBCC-B6	1	.5 mm	1.5 mm					2.3 mm
BGS12SL6	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		3 V	CHIP CARRIER	.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B6		.32 mm	.7 mm					1.1 mm
IP4047CX6/LF,135	Nexperia	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.7 mm	.99 mm					1.44 mm
MAX2667EWT+TW	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	2.85 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	S-PBGA-B6	1	.69 mm	.865 mm		e2	30	260	1.27 mm
MAX2669EWT+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	2.85 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	S-PBGA-B6	1	.69 mm	.865 mm		e2	30	260	1.27 mm
MAX2473EUT-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm		e0			2.9 mm
MAX2669EWT+T10	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	2.85 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	.4 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B6		.69 mm	.865 mm			30	260	1.27 mm
MAX2667EWT+T10	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	2.85 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	.4 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B6		.69 mm	.865 mm			30	260	1.27 mm
MAX2472EUT-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm		e0			2.9 mm
MAX2669EWT+T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	2.85 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B6	1	.69 mm	.865 mm	Not Qualified	e2	30	260	1.27 mm
TOTX170A	Toshiba	TELECOM CIRCUIT	OTHER	UNSPECIFIED	6		RECTANGULAR	UNSPECIFIED	NO	1		5 V	FIBER OPTIC		70 Cel	-40 Cel		UNSPECIFIED	R-XXFO-X6				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
AGPS-F001-BLK	Broadcom	TELECOM CIRCUIT		NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1		1.8 V	CHIP CARRIER, VERY THIN PROFILE	.54 mm				QUAD	R-XQCC-N6	3	.9 mm	1.7 mm				260	2.3 mm
AGPS-F001-TR1	Broadcom	TELECOM CIRCUIT		NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1		1.8 V	CHIP CARRIER, VERY THIN PROFILE	.54 mm				QUAD	R-XQCC-N6	3	.9 mm	1.7 mm				260	2.3 mm
ALM-GN001-TR1G	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.9 mm	1.7 mm					2.3 mm
ALM-GN001-BLKG	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.9 mm	1.7 mm					2.3 mm
AGPS-L001-BLK	Broadcom	TELECOM CIRCUIT		NO LEAD	6	HSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V	SMALL OUTLINE, HEAT SINK/SLUG	.35 mm			TIN	DUAL	R-PDSO-N6	1	.55 mm	.9 mm		e3		260	1.1 mm
AGPS-L001-TR1	Broadcom	TELECOM CIRCUIT		NO LEAD	6	HSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V	SMALL OUTLINE, HEAT SINK/SLUG	.35 mm			TIN	DUAL	R-PDSO-N6	1	.55 mm	.9 mm		e3		260	1.1 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.