6 Other Function Telecom Interface ICs 133

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

BGS12SN6E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

2.6 V

CHIP CARRIER

.4 mm

85 Cel

-30 Cel

TIN

BOTTOM

R-XBCC-B6

1

.4 mm

.7 mm

e3

1.1 mm

MP45DT02TR-M

STMicroelectronics

TELECOM CIRCUIT

OTHER

NO LEAD

6

LGA

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

GRID ARRAY

85 Cel

-30 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-XBGA-N6

3

1.35 mm

3.76 mm

e4

260

4.72 mm

BGA524N6E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.8 V

SMALL OUTLINE, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

TIN

DUAL

R-PDSO-N6

1

.4 mm

.7 mm

e3

1.1 mm

BGS12AL74E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER

.55 mm

85 Cel

-30 Cel

GOLD

BOTTOM

R-XBCC-B6

1

.5 mm

1.5 mm

e4

2.3 mm

DS2409P+

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

C BEND

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-C6

1

1.5 mm

3.81 mm

Not Qualified

e3

30

260

3.937 mm

DS2409P

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

C BEND

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-C6

1

1.5 mm

3.76 mm

Not Qualified

e0

3.94 mm

AP22804ASN-7

Diodes Incorporated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-N6

.63 mm

2 mm

e4

30

260

2 mm

AP22814BSN-7

Diodes Incorporated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-N6

.63 mm

2 mm

e4

30

260

2 mm

AP22804BSN-7

Diodes Incorporated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-N6

.63 mm

2 mm

e4

30

260

2 mm

BGA5H1BN6E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

R-XBCC-B6

1

.4 mm

.7 mm

1.1 mm

AD8312ACBZ-P7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B6

1

.675 mm

.95 mm

Not Qualified

e1

40

260

1.45 mm

BGA5M1BN6E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

R-XBCC-B6

1

.4 mm

.7 mm

1.1 mm

BGM1032N7E6327XUSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.7 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.54 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N6

.77 mm

1.7 mm

NOT SPECIFIED

NOT SPECIFIED

2.3 mm

DS2409P+T&R

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

C BEND

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-C6

1

1.5 mm

3.76 mm

Not Qualified

e3

30

260

3.94 mm

DS2409P/T&R

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

C BEND

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-C6

1

1.5 mm

3.76 mm

Not Qualified

e0

3.94 mm

AD8312ACBZ-P2

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B6

1

.675 mm

.95 mm

Not Qualified

e1

40

260

1.45 mm

AP22814ASN-7

Diodes Incorporated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-N6

.63 mm

2 mm

e4

30

260

2 mm

BGA751N7E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

6

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

2.8 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

TIN

DUAL

R-PDSO-N6

1

.4 mm

1.3 mm

e3

2 mm

SKY13453-385LF

Skyworks Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

QCCN

SQUARE

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER

90 Cel

-40 Cel

QUAD

S-XQCC-N6

1

.5 mm

1 mm

260

1 mm

SL3S1003FTB0,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N6

.5 mm

1 mm

1.45 mm

HMC560LM3

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

6

HQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG

1 mm

85 Cel

-55 Cel

GOLD OVER NICKEL

QUAD

S-PQCC-N6

1

1.14 mm

5.08 mm

Not Qualified

e4

250

5.08 mm

LTC4400-1ES6#TRMPBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

6

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

.95 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

1 mm

1.6 mm

Not Qualified

e3

2.9 mm

ADL5506ACBZ-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA6,2X3,16

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B6

1

.56 mm

.79 mm

e1

30

260

1.19 mm

BGM1033N7

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.7 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.54 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-N6

.77 mm

1.7 mm

e3

2.3 mm

SKY16406-381LF

Skyworks Solutions

TELECOM CIRCUIT

OTHER

NO LEAD

6

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-55 Cel

DUAL

R-PDSO-N6

.8 mm

1.5 mm

NOT SPECIFIED

NOT SPECIFIED

2 mm

TRF1600DRVR

Texas Instruments

TELECOM CIRCUIT

NO LEAD

6

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE

.65 mm

DUAL

S-PDSO-N6

.8 mm

2 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

2 mm

LTC4401-1ES6#TRPBF

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

6

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

.95 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

1 mm

1.6 mm

Not Qualified

e3

30

260

2.9 mm

LTC4400-1ES6#TRM

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

6

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

.95 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G6

1

1 mm

1.6 mm

Not Qualified

e0

2.9 mm

LTC4401-1ES6#TR

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

6

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

.95 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G6

1

1 mm

1.6 mm

Not Qualified

e0

2.9 mm

LTC4400-1ES6#PBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

6

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

.95 mm

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G6

1

1 mm

1.6 mm

Not Qualified

e3

30

260

2.9 mm

LTC4401-1ES6#TRMPBF

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

6

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

.95 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

1 mm

1.6 mm

Not Qualified

e3

30

260

2.9 mm

LTC4401-1ES6

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

6

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

.95 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G6

1

1 mm

1.6 mm

Not Qualified

e0

2.9 mm

LTC4401-1ES6#TRM

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

6

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

.95 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G6

1

1 mm

1.6 mm

Not Qualified

e0

2.9 mm

LTC4400-1ES6#TR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

6

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

.95 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G6

1

1 mm

1.6 mm

Not Qualified

e0

2.9 mm

LTC4400-1ES6#TRPBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

6

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

.95 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

1 mm

1.6 mm

Not Qualified

e3

30

260

2.9 mm

LTC4401-1ES6#PBF

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

6

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

.95 mm

70 Cel

0 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G6

1

1 mm

1.6 mm

Not Qualified

e3

30

260

2.9 mm

HMC-ABH264

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

6

DIE

RECTANGULAR

UNSPECIFIED

YES

1

5 V

UNCASED CHIP

85 Cel

-55 Cel

UPPER

R-XUUC-N6

Not Qualified

NOT APPLICABLE

NOT APPLICABLE

ADL5506WACBZ-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

AEC-Q100

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA6,2X3,16

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B6

1

.56 mm

.79 mm

e1

30

260

1.19 mm

LTC4400-1ES6

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

6

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

.95 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G6

1

1 mm

1.6 mm

Not Qualified

e0

2.9 mm

AD8311ACBZ-P7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

.0129 mA

3 V

3/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA6,2X3,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B6

1

.675 mm

.95 mm

Not Qualified

e1

30

260

1.45 mm

AD8312ACPZ-REEL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-XBGA-B6

.675 mm

.95 mm

Not Qualified

e1

40

260

1.45 mm

LTC5509ESC6#TRPBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

6

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

1 mm

1.25 mm

Not Qualified

e3

30

260

2 mm

LTC5509ESC6#TRMPBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

6

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

1 mm

1.25 mm

Not Qualified

e3

30

260

2 mm

AD8311ACBZ-P2

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

.0129 mA

3 V

3/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA6,2X3,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-XBGA-B6

1

.675 mm

.95 mm

Not Qualified

e1

40

260

1.45 mm

HMC560LM3TR

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

6

HQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG

1 mm

85 Cel

-55 Cel

MATTE TIN

QUAD

S-PQCC-N6

1

1.14 mm

5.08 mm

e3

250

5.08 mm

HMC556

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

6

DIE

RECTANGULAR

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-55 Cel

GOLD

UPPER

R-XUUC-N6

Not Qualified

e4

LTC5509ESC6

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

6

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G6

1

1 mm

1.25 mm

Not Qualified

e0

2 mm

HMC555

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

6

DIE

RECTANGULAR

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-55 Cel

GOLD

UPPER

R-XUUC-N6

Not Qualified

e4

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.