Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
BUTT |
6 |
BCC |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
2.6 V |
CHIP CARRIER |
.4 mm |
85 Cel |
-30 Cel |
TIN |
BOTTOM |
R-XBCC-B6 |
1 |
.4 mm |
.7 mm |
e3 |
1.1 mm |
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|
STMicroelectronics |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
6 |
LGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1.8 V |
GRID ARRAY |
85 Cel |
-30 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-XBGA-N6 |
3 |
1.35 mm |
3.76 mm |
e4 |
260 |
4.72 mm |
||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
SMALL OUTLINE, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-N6 |
1 |
.4 mm |
.7 mm |
e3 |
1.1 mm |
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|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
BUTT |
6 |
BCC |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
2.8 V |
CHIP CARRIER |
.55 mm |
85 Cel |
-30 Cel |
GOLD |
BOTTOM |
R-XBCC-B6 |
1 |
.5 mm |
1.5 mm |
e4 |
2.3 mm |
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|
Maxim Integrated |
TELECOM CIRCUIT |
INDUSTRIAL |
C BEND |
6 |
SOC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-C6 |
1 |
1.5 mm |
3.81 mm |
Not Qualified |
e3 |
30 |
260 |
3.937 mm |
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Maxim Integrated |
TELECOM CIRCUIT |
INDUSTRIAL |
C BEND |
6 |
SOC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-C6 |
1 |
1.5 mm |
3.76 mm |
Not Qualified |
e0 |
3.94 mm |
||||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N6 |
.63 mm |
2 mm |
e4 |
30 |
260 |
2 mm |
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|
Diodes Incorporated |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N6 |
.63 mm |
2 mm |
e4 |
30 |
260 |
2 mm |
|||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N6 |
.63 mm |
2 mm |
e4 |
30 |
260 |
2 mm |
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|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
BUTT |
6 |
BCC |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1.8 V |
CHIP CARRIER |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-XBCC-B6 |
1 |
.4 mm |
.7 mm |
1.1 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
6 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B6 |
1 |
.675 mm |
.95 mm |
Not Qualified |
e1 |
40 |
260 |
1.45 mm |
|||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
BUTT |
6 |
BCC |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1.8 V |
CHIP CARRIER |
.4 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-XBCC-B6 |
1 |
.4 mm |
.7 mm |
1.1 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2.7 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-N6 |
.77 mm |
1.7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
2.3 mm |
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|
Maxim Integrated |
TELECOM CIRCUIT |
INDUSTRIAL |
C BEND |
6 |
SOC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-C6 |
1 |
1.5 mm |
3.76 mm |
Not Qualified |
e3 |
30 |
260 |
3.94 mm |
|||||||||||||||||||||||||||||||||||||
Maxim Integrated |
TELECOM CIRCUIT |
INDUSTRIAL |
C BEND |
6 |
SOC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-C6 |
1 |
1.5 mm |
3.76 mm |
Not Qualified |
e0 |
3.94 mm |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
6 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B6 |
1 |
.675 mm |
.95 mm |
Not Qualified |
e1 |
40 |
260 |
1.45 mm |
|||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N6 |
.63 mm |
2 mm |
e4 |
30 |
260 |
2 mm |
|||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
6 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
2.8 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-30 Cel |
TIN |
DUAL |
R-PDSO-N6 |
1 |
.4 mm |
1.3 mm |
e3 |
2 mm |
|||||||||||||||||||||||||||||||||||||||
|
Skyworks Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.8 V |
CHIP CARRIER |
90 Cel |
-40 Cel |
QUAD |
S-XQCC-N6 |
1 |
.5 mm |
1 mm |
260 |
1 mm |
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NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-N6 |
.5 mm |
1 mm |
1.45 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
6 |
HQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG |
1 mm |
85 Cel |
-55 Cel |
GOLD OVER NICKEL |
QUAD |
S-PQCC-N6 |
1 |
1.14 mm |
5.08 mm |
Not Qualified |
e4 |
250 |
5.08 mm |
|||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.95 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
1 mm |
1.6 mm |
Not Qualified |
e3 |
2.9 mm |
|||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
6 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,16 |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B6 |
1 |
.56 mm |
.79 mm |
e1 |
30 |
260 |
1.19 mm |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2.7 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.54 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-N6 |
.77 mm |
1.7 mm |
e3 |
2.3 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Skyworks Solutions |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
6 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-55 Cel |
DUAL |
R-PDSO-N6 |
.8 mm |
1.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
NO LEAD |
6 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE |
.65 mm |
DUAL |
S-PDSO-N6 |
.8 mm |
2 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.95 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
1 mm |
1.6 mm |
Not Qualified |
e3 |
30 |
260 |
2.9 mm |
|||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.95 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G6 |
1 |
1 mm |
1.6 mm |
Not Qualified |
e0 |
2.9 mm |
||||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.95 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G6 |
1 |
1 mm |
1.6 mm |
Not Qualified |
e0 |
2.9 mm |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.95 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G6 |
1 |
1 mm |
1.6 mm |
Not Qualified |
e3 |
30 |
260 |
2.9 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.95 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
1 mm |
1.6 mm |
Not Qualified |
e3 |
30 |
260 |
2.9 mm |
|||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.95 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G6 |
1 |
1 mm |
1.6 mm |
Not Qualified |
e0 |
2.9 mm |
||||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.95 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G6 |
1 |
1 mm |
1.6 mm |
Not Qualified |
e0 |
2.9 mm |
||||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.95 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G6 |
1 |
1 mm |
1.6 mm |
Not Qualified |
e0 |
2.9 mm |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.95 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
1 mm |
1.6 mm |
Not Qualified |
e3 |
30 |
260 |
2.9 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.95 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G6 |
1 |
1 mm |
1.6 mm |
Not Qualified |
e3 |
30 |
260 |
2.9 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
6 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
5 V |
UNCASED CHIP |
85 Cel |
-55 Cel |
UPPER |
R-XUUC-N6 |
Not Qualified |
NOT APPLICABLE |
NOT APPLICABLE |
||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
6 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
AEC-Q100 |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,16 |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B6 |
1 |
.56 mm |
.79 mm |
e1 |
30 |
260 |
1.19 mm |
|||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.95 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G6 |
1 |
1 mm |
1.6 mm |
Not Qualified |
e0 |
2.9 mm |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
6 |
VFBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
.0129 mA |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B6 |
1 |
.675 mm |
.95 mm |
Not Qualified |
e1 |
30 |
260 |
1.45 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
6 |
VFBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-XBGA-B6 |
.675 mm |
.95 mm |
Not Qualified |
e1 |
40 |
260 |
1.45 mm |
||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
1 mm |
1.25 mm |
Not Qualified |
e3 |
30 |
260 |
2 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
1 mm |
1.25 mm |
Not Qualified |
e3 |
30 |
260 |
2 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
6 |
VFBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
.0129 mA |
3 V |
3/5 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-XBGA-B6 |
1 |
.675 mm |
.95 mm |
Not Qualified |
e1 |
40 |
260 |
1.45 mm |
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|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
6 |
HQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG |
1 mm |
85 Cel |
-55 Cel |
MATTE TIN |
QUAD |
S-PQCC-N6 |
1 |
1.14 mm |
5.08 mm |
e3 |
250 |
5.08 mm |
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|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
6 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
UNCASED CHIP |
85 Cel |
-55 Cel |
GOLD |
UPPER |
R-XUUC-N6 |
Not Qualified |
e4 |
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Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G6 |
1 |
1 mm |
1.25 mm |
Not Qualified |
e0 |
2 mm |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
6 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
UNCASED CHIP |
85 Cel |
-55 Cel |
GOLD |
UPPER |
R-XUUC-N6 |
Not Qualified |
e4 |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.