6 Other Function Telecom Interface ICs 133

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD8312ACPZ-WP	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1			3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-XBGA-B6		.675 mm	.95 mm	Not Qualified	e1			1.45 mm
LTC5509ESC6#TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1 mm	1.25 mm	Not Qualified	e0			2 mm
LTC5509ESC6#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6	1	1 mm	1.25 mm	Not Qualified	e3	30	260	2 mm
LTC5509ESC6#TRM	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1 mm	1.25 mm	Not Qualified	e0			2 mm
MAX2667EWT+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		2.85 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	R-PBGA-B6	1	.69 mm	.865 mm	Not Qualified	e2	30	260	1.27 mm
MAX2667EWT+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		2.85 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	S-PBGA-B6	1	.69 mm	.865 mm		e2	30	260	1.27 mm
TCP-3033H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
TCP-3027H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
TCP-3027N-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm					1.6 mm
TCP-3033N-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm					1.6 mm
TCP-3047H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
TCP-3082H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
TCP-3068H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
TCP-3068N-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm					1.6 mm
TCP-3047N-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm					1.6 mm
TCP-3056H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
TCP-3012H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VSON	RECTANGULAR	UNSPECIFIED	YES	1					SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		DUAL	R-XDSO-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
TCP-3027HA-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm					1.6 mm
TCP-3056N-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm					1.6 mm
MDC5001T1	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		2.75 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1.1 mm	1.25 mm	Not Qualified	e0		235	2 mm
TCP-3082N-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm					1.6 mm
TCP-3039H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
TCP-3039NQT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm					1.6 mm
XRAG2-MATG/1GI	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.08,20	Other Telecom ICs	.5 mm	55 Cel	-20 Cel		DUAL	R-PDSO-N6		.6 mm	1.7 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	1.9 mm
XRAG2-MATG/1GE	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC6,.08,20	Other Telecom ICs	.5 mm	55 Cel	-20 Cel		DUAL	R-PDSO-N6		.6 mm	1.8 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	2 mm
SL3S1003FTB0	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	DUAL	R-PDSO-N6	1	.5 mm	1 mm		e3			1.45 mm
SL3S1213FTB0,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.265 mA	1.8 V	1.8	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN	DUAL	R-PDSO-N6	1	.5 mm	1 mm	Not Qualified	e3	30	260	1.45 mm
SL3S1203FTB0	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	DUAL	R-PDSO-N6	1	.5 mm	1 mm	Not Qualified	e3			1.45 mm
SL3S1013FTB0	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	PURE TIN	DUAL	R-PDSO-N6	1	.5 mm	1 mm					1.45 mm
SL3S1204FTB0X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE	SOLCC6,.04,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6				Not Qualified
SL3S1013FTB0,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6	1	.5 mm	1 mm				260	1.45 mm
SL3S1213FTB0	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	DUAL	R-PDSO-N6	1	.5 mm	1 mm	Not Qualified	e3			1.45 mm
BGU8006	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.85 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.22 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.32 mm	.44 mm					.65 mm
SL3S1203FTB0,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.265 mA	1.8 V	1.8	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN	DUAL	R-PDSO-N6	1	.5 mm	1 mm	Not Qualified	e3	30	260	1.45 mm
BGU8004X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.22 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6	1	.32 mm	.44 mm				260	.65 mm
BGU8004	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.22 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.32 mm	.44 mm					.65 mm
BGU8010	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.5 mm	.9 mm					1.1 mm
BGU8004Z	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.22 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6	1	.32 mm	.44 mm				260	.65 mm
BGA8V1BN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6	1	.4 mm	.7 mm					1.1 mm
BGA711N7E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	DUAL	R-PDSO-N6	1	.4 mm	1.3 mm		e3			2 mm
BGA8U1BN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B6	1	.4 mm	.7 mm					1.1 mm
BGA7H1N6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	TIN	DUAL	R-PDSO-N6	1	.4 mm	.7 mm		e3			1.1 mm
BGA711N7	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		DUAL	R-PDSO-N6	1	.4 mm	1.3 mm					2 mm
BGA7L1N6	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-N6	1	.4 mm	.7 mm		e3			1.1 mm
BGA7H1N6	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	TIN	DUAL	R-PDSO-N6	1	.4 mm	.7 mm		e3			1.1 mm
BGA751N7	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		DUAL	R-PDSO-N6	1	.4 mm	1.3 mm					2 mm
BGA7M1N6	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	TIN	DUAL	R-PDSO-N6	1	.4 mm	.7 mm		e3			1.1 mm
BGA5L1BN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B6	1	.4 mm	.7 mm					1.1 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.