DIP Other Function Telecom Interface ICs 268

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Output High Voltage	Maximum Output Low Voltage	Standard	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Reference Point	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Maximum Output Low Current	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
NE570F	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1			4.8 mA	6 V		IN-LINE				70 Cel				0 Cel		DUAL	R-GDIP-T16					Not Qualified
TEA1083	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR	0 V	.004 mA	3.6 V	3.6	IN-LINE	DIP8,.3	Telecom Signaling Circuits	2.54 mm	75 Cel				-25 Cel		DUAL	R-PDIP-T8			4.2 mm	7.62 mm	Not Qualified					9.5 mm
SA5750N	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				5 V		IN-LINE				85 Cel				-40 Cel		DUAL	R-PDIP-T24					Not Qualified
TEA1094AN	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			4.4 mA	5 V		IN-LINE			2.54 mm	75 Cel				-25 Cel		DUAL	R-PDIP-T24			5.1 mm	15.24 mm	Not Qualified					31.7 mm
TEA1094APN	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			4.4 mA	5 V		IN-LINE			2.54 mm	75 Cel				-25 Cel		DUAL	R-PDIP-T24			5.1 mm	15.24 mm	Not Qualified					31.7 mm
NE571N	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			4.8 mA	6 V		IN-LINE			2.54 mm	70 Cel				0 Cel		DUAL	R-PDIP-T16			4.2 mm	7.62 mm	Not Qualified					19.025 mm
TDA8730N	NXP Semiconductors	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				9 V		IN-LINE			2.54 mm	85 Cel				-25 Cel		DUAL	R-PDIP-T16			4.7 mm	7.62 mm	Not Qualified					21.6 mm
NE570N	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			4.8 mA	6 V		IN-LINE			2.54 mm	70 Cel				0 Cel		DUAL	R-PDIP-T16			4.2 mm	7.62 mm	Not Qualified					19.025 mm
NE5751N	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS			5 V		IN-LINE				70 Cel				0 Cel		DUAL	R-PDIP-T24					Not Qualified
SA5212AN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR		.033 mA	5 V	5	IN-LINE	DIP8,.3	Other Telecom ICs	2.54 mm	85 Cel				-40 Cel		DUAL	R-PDIP-T8		1	4.2 mm	7.62 mm	Not Qualified					9.5 mm
TEA1094A	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR			5 V		IN-LINE			2.54 mm	75 Cel				-25 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T24			5.1 mm	15.24 mm	Not Qualified		e3/e4			31.7 mm
933897010112	NXP Semiconductors	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				4 V		IN-LINE			2.54 mm	70 Cel				-25 Cel		DUAL	R-PDIP-T8			4.2 mm	7.62 mm	Not Qualified			40	250	9.5 mm
SA5212AFE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		.033 mA	5 V	5	IN-LINE	DIP8,.3	Other Telecom ICs	2.54 mm	85 Cel				-40 Cel		DUAL	R-GDIP-T8		1	5.08 mm	7.62 mm	Not Qualified					9.955 mm
NE571F	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1			4.8 mA	6 V		IN-LINE				70 Cel				0 Cel		DUAL	R-GDIP-T16					Not Qualified
935030770602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				6 V		IN-LINE			2.54 mm	85 Cel				-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T8			4.2 mm	7.62 mm	Not Qualified		e4			9.5 mm
MC13055P	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	YES	1						IN-LINE	DIP16,.3		2.54 mm	85 Cel				-40 Cel		DUAL	R-PDIP-T16			4.4 mm	7.62 mm						19.175 mm
SA602AN/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				6 V		IN-LINE			2.54 mm	85 Cel				-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T8			4.2 mm	7.62 mm	Not Qualified		e4			9.5 mm
SA602AN,602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				6 V		IN-LINE			2.54 mm	85 Cel				-40 Cel		DUAL	R-PDIP-T8			4.2 mm	7.62 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	9.5 mm
PEB2075PV1.3	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS			5 V		IN-LINE				70 Cel				0 Cel		DUAL	R-PDIP-T28					Not Qualified
PEB2445C	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		CMOS		20 mA	5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T40					Not Qualified		e0
PSB4506	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		60 mA		3.5/9.2	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel				-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28					Not Qualified		e0
PEB2070A3P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS					IN-LINE	DIP24,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T24					Not Qualified		e0
S0280	Infineon Technologies		OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		35 mA	14 V	14	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	85 Cel				-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16					Not Qualified		e0
PSB4506-P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR				3.5/9.2	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel				-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28					Not Qualified		e0
PEB2040	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		MOS					IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T40					Not Qualified		e0
PSB4505	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		60 mA		3.5/9.2	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel				-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28					Not Qualified		e0
S042P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		2.9 mA	12 V	12	IN-LINE	DIP14,.3	Other Telecom ICs	2.54 mm	70 Cel				-15 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T14					Not Qualified		e0
PEB2052C	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		CMOS			5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T40					Not Qualified		e0
PEF2046C	Infineon Technologies		INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		CMOS		10 mA	5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	85 Cel				-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T40					Not Qualified		e0
PEB2045A-2P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T40					Not Qualified		e0
PSB4506A-P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR				3.5/9.2	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel				-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28					Not Qualified		e0
PEB2055-C	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		CMOS		9.5 mA	5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T40					Not Qualified		e0
PEB2055A2P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T40					Not Qualified		e0
PEB2056-P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS					IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28					Not Qualified		e0
PSB4506A	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		60 mA		3.5/9.2	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel				-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28					Not Qualified		e0
PEB2045-PVA3	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T40					Not Qualified		e0
PEB2070B1P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS					IN-LINE	DIP24,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T24					Not Qualified		e0
PEF3035-P	Infineon Technologies	TELECOM CIRCUIT		THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1						IN-LINE			2.54 mm							DUAL	R-PDIP-T28			4.6 mm	15.24 mm	Not Qualified					35.9 mm
PEB20950-C	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		CMOS			5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T40					Not Qualified		e0
PEB2025-P	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	22	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS			5 V	5,-12/-60	IN-LINE	DIP22,.4	Digital Transmission Interfaces	2.54 mm	70 Cel	2.4 V	.45 V	CCITT I.430	0 Cel	TIN LEAD	DUAL	R-PDIP-T22	S		5.1 mm	10.16 mm	Not Qualified	2 Amp	e0			27.8 mm
PEB2052P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T40					Not Qualified		e0
PSB4501-P	Infineon Technologies		OTHER	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		140 mA		1.6/7.5	IN-LINE	DIP20,.3	Other Telecom ICs	2.54 mm	70 Cel				-25 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T20					Not Qualified		e0
PSB4400P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		1.45 mA		1.6/7.5	IN-LINE	DIP18,.3	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T18					Not Qualified		e0
PSB4505A	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		60 mA		3.5/9.2	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel				-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28					Not Qualified		e0
TDA4065	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR			5 V	5	IN-LINE	DIP8,.3	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T8					Not Qualified		e0
PEB2075A1P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			5 V	5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28					Not Qualified		e0
PEF2041P	Infineon Technologies		INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS					IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	85 Cel				-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T40					Not Qualified		e0
PEB2041P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS					IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T40					Not Qualified		e0

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.