Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
STMicroelectronics |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
5 V |
5 |
IN-LINE |
DIP28,.6 |
Other Telecom ICs |
2.54 mm |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5 V |
5 |
IN-LINE |
DIP48,.6 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T48 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
TELECOM CIRCUIT |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
5 V |
5 |
IN-LINE |
DIP24,.6 |
Other Telecom ICs |
2.54 mm |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T24 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
TELECOM CIRCUIT |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
5 V |
5 |
IN-LINE |
DIP28,.6 |
Other Telecom ICs |
2.54 mm |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
OTHER |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
IN-LINE |
DIP16,.3 |
Other Telecom ICs |
2.54 mm |
70 Cel |
-45 Cel |
DUAL |
R-PDIP-T16 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
180 mA |
5 V |
5 |
IN-LINE |
DIP40,.6 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T40 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
OTHER |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
BIPOLAR |
100 mA |
3.7/13 |
IN-LINE |
DIP18,.3 |
Other Telecom ICs |
2.54 mm |
70 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T18 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
10 mA |
5 V |
5 |
IN-LINE |
DIP40,.6 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T40 |
T-1(DS1) |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
OTHER |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
BIPOLAR |
IN-LINE |
DIP16,.3 |
Other Telecom ICs |
2.54 mm |
70 Cel |
-45 Cel |
DUAL |
R-PDIP-T16 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
5 V |
5 |
IN-LINE |
DIP28,.6 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
26 mA |
4 V |
4 |
IN-LINE |
DIP24,.6 |
Other Telecom ICs |
2.54 mm |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T24 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
5 V |
5 |
IN-LINE |
DIP40,.6 |
Other Telecom ICs |
2.54 mm |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T40 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
OTHER |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
BIPOLAR |
150 mA |
IN-LINE |
DIP16,.3 |
Other Telecom ICs |
2.54 mm |
70 Cel |
-45 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T16 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
-6 V |
9 mA |
6 V |
+-6 |
IN-LINE |
DIP24,.6 |
Other Telecom ICs |
2.54 mm |
DUAL |
R-PDIP-T24 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
40 mA |
5 V |
5 |
IN-LINE |
DIP16,.3 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T16 |
T-1(DS1) |
CEPT PCM-30/E-1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
TELECOM CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
BIPOLAR |
1 mA |
2/15 |
IN-LINE |
DIP8,.3 |
Other Telecom ICs |
2.54 mm |
50 Cel |
0 Cel |
DUAL |
R-PDIP-T8 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
5 V |
5 |
IN-LINE |
DIP48,.6 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) |
DUAL |
R-PDIP-T48 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
OTHER |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
BIPOLAR |
2 mA |
2.5 V |
2.5 |
IN-LINE |
DIP16,.3 |
Other Telecom ICs |
2.54 mm |
70 Cel |
-45 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T16 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
BIPOLAR |
.9 mA |
TIP-RING VOLTAGE |
IN-LINE |
DIP8,.3 |
Other Telecom ICs |
2.54 mm |
70 Cel |
-20 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T8 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
40 mA |
5 V |
5 |
IN-LINE |
DIP16,.3 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T16 |
T-1(DS1) |
CEPT PCM-30/E-1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
5 V |
5 |
IN-LINE |
DIP48,.6 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) |
DUAL |
R-PDIP-T48 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
3.3 V |
3.3 |
IN-LINE |
DIP20,.3 |
Other Telecom ICs |
2.54 mm |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T20 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
OTHER |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
BIPOLAR |
100 mA |
3.9/13 |
IN-LINE |
DIP18,.3 |
Other Telecom ICs |
2.54 mm |
70 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T18 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
TELECOM CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
-5 V |
5 V |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T28 |
15.24 mm |
Not Qualified |
36.83 mm |
|||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
BIPOLAR |
-5 V |
5 V |
+-5 |
IN-LINE |
DIP28,.6 |
Other Telecom ICs |
2.54 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
TELECOM CIRCUIT |
OTHER |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
3 V |
IN-LINE |
2.54 mm |
85 Cel |
-20 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
5.08 mm |
7.62 mm |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
0 V |
.004 mA |
3.6 V |
3.6 |
IN-LINE |
DIP16,.3 |
Telecom Signaling Circuits |
2.54 mm |
75 Cel |
-25 Cel |
DUAL |
R-PDIP-T16 |
4.7 mm |
7.62 mm |
Not Qualified |
21.6 mm |
|||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
4 mA |
5 V |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T16 |
4.2 mm |
7.62 mm |
Not Qualified |
19.025 mm |
|||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T20 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
.0001 mA |
5 V |
3/5 |
IN-LINE |
DIP24,.6 |
Telephone Circuits |
2.54 mm |
60 Cel |
-10 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
4.4 mA |
5 V |
IN-LINE |
2.54 mm |
75 Cel |
-25 Cel |
DUAL |
R-PDIP-T28 |
5.1 mm |
15.24 mm |
Not Qualified |
35.5 mm |
||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
0 V |
4.2 V |
IN-LINE |
2.54 mm |
75 Cel |
-25 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T24 |
5.1 mm |
15.24 mm |
Not Qualified |
e3/e4 |
31.7 mm |
|||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
4.4 mA |
5 V |
IN-LINE |
2.54 mm |
75 Cel |
-25 Cel |
DUAL |
R-PDIP-T28 |
5.1 mm |
15.24 mm |
Not Qualified |
35.5 mm |
||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
140 mA |
3.6 V |
3.6 |
IN-LINE |
DIP28,.6 |
Telephone Circuits |
2.54 mm |
75 Cel |
-25 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T28 |
5.1 mm |
15.24 mm |
Not Qualified |
e3/e4 |
35.5 mm |
||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
MILITARY |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-GDIP-T8 |
5.08 mm |
15.24 mm |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
6 V |
IN-LINE |
2.54 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T8 |
4.2 mm |
7.62 mm |
Not Qualified |
e4 |
9.5 mm |
||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T20 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
4.8 mA |
6 V |
IN-LINE |
85 Cel |
-40 Cel |
DUAL |
R-GDIP-T16 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5.5 mA |
5 V |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T20 |
4.2 mm |
7.62 mm |
Not Qualified |
26.73 mm |
||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
0 V |
4.2 V |
IN-LINE |
2.54 mm |
75 Cel |
-25 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T24 |
5.1 mm |
15.24 mm |
Not Qualified |
e3/e4 |
31.7 mm |
|||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
OTHER |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
9 V |
IN-LINE |
85 Cel |
-25 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T16 |
Not Qualified |
e3/e4 |
|||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
4 V |
IN-LINE |
2.54 mm |
75 Cel |
-25 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T8 |
4.2 mm |
7.62 mm |
Not Qualified |
e3/e4 |
9.5 mm |
|||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
MILITARY |
DIP |
1 |
BIPOLAR |
6 V |
125 Cel |
-55 Cel |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
5 V |
IN-LINE |
2.54 mm |
75 Cel |
-25 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T28 |
5.1 mm |
15.24 mm |
Not Qualified |
e3/e4 |
35.5 mm |
||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
5 V |
IN-LINE |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
OTHER |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
4 V |
IN-LINE |
2.54 mm |
70 Cel |
-25 Cel |
DUAL |
R-PDIP-T8 |
4.2 mm |
7.62 mm |
Not Qualified |
9.5 mm |
|||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
OTHER |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
4 V |
IN-LINE |
2.54 mm |
70 Cel |
-25 Cel |
DUAL |
R-PDIP-T8 |
4.2 mm |
7.62 mm |
Not Qualified |
9.5 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.