STMicroelectronics - TEA7052DP

TEA7052DP by STMicroelectronics

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Manufacturer	STMicroelectronics
Manufacturer's Part Number	TEA7052DP
Description	Other Telecom ICs; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Supply Current: 26 mA;
Datasheet	TEA7052DP Datasheet
In Stock	3,665

TEA7052DP Technical Details

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	4 V
Sub-Category:	Other Telecom ICs
Surface Mount:	NO
Maximum Supply Current:	26 mA
Terminal Finish:	Tin/Lead (Sn/Pb)
JESD-609 Code:	e0
No. of Terminals:	24
Qualification:	Not Qualified
Package Equivalence Code:	DIP24,.6
Terminal Position:	DUAL
Package Style (Meter):	IN-LINE
JESD-30 Code:	R-PDIP-T24
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Package Code:	DIP
Terminal Pitch:	2.54 mm
Power Supplies (V):	4

Pricing (USD)

Qty.	Unit Price	Ext. Price
3,665	-	-

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