HVQCCN Other Function Telecom Interface ICs 1,394

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

PN5180A0HN/C1,518

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

QUAD

S-PQCC-N40

1 mm

6 mm

6 mm

MFRC63003HN/TRAYB

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

.5 mm

85 Cel

-25 Cel

QUAD

1 Mbps

S-PQCC-N32

1 mm

5 mm

5 mm

PN5110A0HN1/C2,157

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.1 mA

3 V

1.8/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-30 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

S-PQCC-N32

1

1 mm

5 mm

Not Qualified

e4

30

260

5 mm

PN5180A0HN/C1,551

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

QUAD

S-PQCC-N40

1 mm

6 mm

6 mm

CLRC66302HN/TRAYBM

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

5 mm

PN5110A0HN/C2

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.1 mA

3 V

1.8/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

Other Telecom ICs

.5 mm

85 Cel

-30 Cel

TIN/NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

1 mm

6 mm

Not Qualified

e3/e4

6 mm

PN512AA0HN1/C2,518

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

100 mA

3 V

1.8/3.3,2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

90 Cel

-40 Cel

QUAD

S-PQCC-N32

3

1 mm

5 mm

Not Qualified

260

5 mm

PN5110A0HN1/C2,151

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

1

1 mm

5 mm

Not Qualified

e4

5 mm

CLRC66301HN1/TRAYB

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

Not Qualified

5 mm

PN5180A0HN/C2,551

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

QUAD

S-PQCC-N40

1 mm

6 mm

6 mm

CLRC66301HN1/TRAYBM

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

Not Qualified

5 mm

MFRC52301HN1/TRAYB

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

Not Qualified

5 mm

MFRC63002HN/T/R

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

.5 mm

85 Cel

-25 Cel

QUAD

1 Mbps

S-PQCC-N32

1 mm

5 mm

5 mm

MFRC63002HN/TRAYBM

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

.5 mm

85 Cel

-25 Cel

QUAD

1 Mbps

S-PQCC-N32

1 mm

5 mm

5 mm

PN5321A3HN/C101

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

QUAD

S-PQCC-N40

1 mm

6 mm

Not Qualified

6 mm

PN5120A0HN/C1

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

1.8/3.3,2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

Other Telecom ICs

.5 mm

85 Cel

-30 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

3

1 mm

6 mm

Not Qualified

e4

30

260

6 mm

MFRC63001HN/T/R

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

.5 mm

85 Cel

-25 Cel

QUAD

1 Mbps

S-PQCC-N32

1 mm

5 mm

5 mm

MFRC63102HN/TRAYB

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

5 mm

PN5110A0HN1/C2

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.1 mA

3 V

1.8/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-30 Cel

TIN/NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

1 mm

5 mm

Not Qualified

e3/e4

5 mm

PN5110A0HN1/C2,118

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

1

1 mm

5 mm

Not Qualified

e4

5 mm

MFRC63003HN/T/R

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

.5 mm

85 Cel

-25 Cel

QUAD

1 Mbps

S-PQCC-N32

1 mm

5 mm

5 mm

MFRC63102HN,157

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

.5 mm

85 Cel

-25 Cel

QUAD

.4 Mbps

S-PQCC-N32

1

1 mm

5 mm

30

260

5 mm

PN5320A3HN/C101

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

QUAD

S-PQCC-N40

1 mm

6 mm

Not Qualified

6 mm

PN5320A3HN/C1XX

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

QUAD

S-PQCC-N40

1 mm

6 mm

6 mm

CLRC66302HN/TRAYB

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

5 mm

MFRC63102HN/T/R

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

5 mm

MFRC63002HN/TRAYB

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

.5 mm

85 Cel

-25 Cel

QUAD

1 Mbps

S-PQCC-N32

1 mm

5 mm

5 mm

BGT24ATR11E6433

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

R-XQCC-N32

.9 mm

4.5 mm

5.5 mm

BGT24MR2

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

R-PQCC-N32

3

.9 mm

4.5 mm

5.5 mm

BGT24ATR12

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

R-PQCC-N32

3

.9 mm

4.5 mm

5.5 mm

BGT24MR2E6327FUSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

R-PQCC-N32

.9 mm

4.5 mm

NOT SPECIFIED

NOT SPECIFIED

5.5 mm

BGT24AR4

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

R-PQCC-N32

.9 mm

4.3 mm

NOT SPECIFIED

NOT SPECIFIED

5.5 mm

BGT24ATR12E6433

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

R-XQCC-N32

.9 mm

4.5 mm

5.5 mm

BGT24AR2

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

R-PQCC-N32

3

.9 mm

4.5 mm

5.5 mm

BGT24AR2E6433XUMA1

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

TIN

QUAD

R-PQCC-N32

3

.9 mm

4.5 mm

e3

5.5 mm

BGT24AR4E6433XUMA1

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

R-PQCC-N32

3

.9 mm

4.5 mm

5.5 mm

BGT24AT2E6433XUMA1

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

TIN

QUAD

R-PQCC-N32

3

.9 mm

4.5 mm

e3

5.5 mm

BGT24MTR12

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

R-PQCC-N32

3

.9 mm

4.5 mm

5.5 mm

BGSF110GN26

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

26

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-30 Cel

QUAD

R-PQCC-N26

1

.77 mm

2.6 mm

3.4 mm

BGT24MTR11E6327XUSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

R-PQCC-N32

.9 mm

4.5 mm

NOT SPECIFIED

NOT SPECIFIED

5.5 mm

BGT24MTR12E6327XUSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

R-PQCC-N32

.9 mm

4.5 mm

NOT SPECIFIED

NOT SPECIFIED

5.5 mm

BGT24ATR11

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

R-PQCC-N32

3

.9 mm

4.5 mm

5.5 mm

BGT24ATR11E6433XUMA1

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

TIN

QUAD

R-PQCC-N32

3

.9 mm

4.5 mm

e3

5.5 mm

BGT24AT2

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

R-PQCC-N32

.9 mm

4.3 mm

NOT SPECIFIED

NOT SPECIFIED

5.5 mm

BGA735N16E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

TIN

QUAD

S-XQCC-N16

1

.4 mm

2.3 mm

e3

2.3 mm

BGT24ATR12E6433XUMA1

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

TIN

QUAD

R-PQCC-N32

3

.9 mm

4.5 mm

e3

5.5 mm

BGT24MTR11

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

R-PQCC-N32

3

.9 mm

4.5 mm

5.5 mm

BGA771N16

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

2.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

QUAD

S-PQCC-N16

.625 mm

2.3 mm

NOT SPECIFIED

NOT SPECIFIED

2.3 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.