HVQCCN Other Function Telecom Interface ICs 1,394

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Supply Voltage	Package Style (Meter)	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CYW89035CWMLG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	60	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100	3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N60		.9 mm	7 mm					7 mm
BCM43236KMLG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	65 Cel	0 Cel		QUAD	S-XQCC-N88		.9 mm	10 mm					10 mm
BCM20730A2KMLG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	70 Cel	0 Cel		QUAD	S-XQCC-N40		1 mm	6 mm					6 mm
BCM20736A0KML2G	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-30 Cel		QUAD	S-XQCC-N32		1 mm	5 mm					5 mm
SLE95050H	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			1.55 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.65 mm	110 Cel	-20 Cel		QUAD	S-PQCC-N6		.8 mm	2.5 mm					2.5 mm
BGS16MN14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-30 Cel	Tin (Sn)	QUAD	S-PQCC-N14	1	.77 mm	2 mm		e3	NOT SPECIFIED	NOT SPECIFIED	2 mm
BGM15HA12E6327	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	85 Cel	-40 Cel		QUAD	R-XQCC-N12		.65 mm	1.1 mm					1.9 mm
BGS15BN14	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	85 Cel	-30 Cel		QUAD	S-XQCC-N14		.77 mm	1.6 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
BGS13BN14	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	85 Cel	-30 Cel	MATTE TIN	QUAD	S-XQCC-N14		.77 mm	1.6 mm		e3			1.6 mm
BGS18MN14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-30 Cel	TIN	QUAD	S-PQCC-N14	1	.77 mm	2 mm		e3			2 mm
BGS18MN14	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-30 Cel	Tin (Sn)	QUAD	S-PQCC-N14	1	.77 mm	2 mm		e3	NOT SPECIFIED	NOT SPECIFIED	2 mm
BGM15MA12	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	85 Cel	-40 Cel		QUAD	R-XQCC-N12	1	.65 mm	1.1 mm					1.9 mm
BGS16MN14	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-30 Cel		QUAD	S-PQCC-N14	1	.77 mm	2 mm					2 mm
BGS14BN14	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	85 Cel	-30 Cel	MATTE TIN	QUAD	S-XQCC-N14		.77 mm	1.6 mm		e3			1.6 mm
BGS15MA12E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	12	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		2.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N12	1	.65 mm	1.1 mm					1.9 mm
BGS15MA12	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	12	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		2.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N12	1	.65 mm	1.1 mm					1.9 mm
BGM15HA12	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	85 Cel	-40 Cel		QUAD	R-XQCC-N12	1	.65 mm	1.1 mm					1.9 mm
BGM15MA12E6327	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	85 Cel	-40 Cel		QUAD	R-XQCC-N12		.65 mm	1.1 mm			NOT SPECIFIED	NOT SPECIFIED	1.9 mm
CYW20733A3KML1G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	70 Cel	0 Cel		QUAD	S-XQCC-N56		1 mm	7 mm					7 mm
CYBL21571-56LQXI	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.6 mm	7 mm					7 mm
CYBL21171-56LQXI	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.6 mm	7 mm					7 mm
CYW20730A1KML2G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	70 Cel	0 Cel		QUAD	S-XQCC-N32		1 mm	5 mm					5 mm
CYBL21573-56LQXI	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.6 mm	7 mm					7 mm
CYW43143KMLG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	65 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N56	3	.9 mm	7 mm		e4	30	260	7 mm
CYW20719B1KUMLG	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	85 Cel	-30 Cel	PURE TIN	QUAD	S-XQCC-N40	3	.6 mm	5 mm			30	260	5 mm
CYW20730A1KMLG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	70 Cel	0 Cel		QUAD	S-XQCC-N40		1 mm	6 mm					6 mm
CYBL21173-56LQXI	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.6 mm	7 mm					7 mm
CYBL21572-56LQXI	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.6 mm	7 mm					7 mm
CYW20730A2KML2G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	70 Cel	0 Cel		QUAD	S-XQCC-N32		1 mm	5 mm					5 mm
CYW20738A2KML3G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	70 Cel	0 Cel		QUAD	S-XQCC-N40		1 mm	6 mm					6 mm
CYBL21573-56LQXQ	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N56		.6 mm	7 mm					7 mm
CYW20732A0KML2G	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-30 Cel		QUAD	S-XQCC-N32		1 mm	5 mm					5 mm
CYW43143KMLGT	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	65 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N56	3	.9 mm	7 mm		e4	30	260	7 mm
CYW20730A2KMLG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	70 Cel	0 Cel		QUAD	S-XQCC-N40		1 mm	6 mm					6 mm
CYBL21172-56LQXI	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.6 mm	7 mm					7 mm
CYW20735PKML1G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	60	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	70 Cel	0 Cel		QUAD	S-XQCC-N60		.9 mm	7 mm					7 mm
CS5519AJI3FNTR-G1	Diodes Incorporated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	80 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N68	3	.8 mm	8 mm		e3	30	260	8 mm
AP3891FN-G1	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	95 Cel	-40 Cel		QUAD	S-XQCC-N68		.8 mm	8 mm					8 mm
AP3890FNTR-G1	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	95 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	.8 mm	7 mm		e3	30	260	7 mm
AP3861FNTR-G1	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N48		.8 mm	6 mm				260	6 mm
ZABG4002JA16TC	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N16	1	.65 mm	3 mm	Not Qualified	e4	30	260	3 mm
CS5519AJI1FN-G1	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	95 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N68	3	.8 mm	8 mm		e3	30	260	8 mm
PI3EQX1002B1ZLEX	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	30	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	70 Cel	0 Cel		QUAD	R-XQCC-N30		.8 mm	2.5 mm			30	260	4.5 mm
CS5519CJI2FNTR-G1	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	.8 mm	7 mm		e3	30	260	7 mm
AP3892FNTR-G1	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	95 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N68	3	.8 mm	8 mm		e3	30	260	8 mm
PI3PCIE3242ZLEX	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	85 Cel	-40 Cel		QUAD	R-XQCC-N30		.8 mm	2.5 mm			30	260	4.5 mm
CS5519CJI3FN-G1	Diodes Incorporated	TELECOM CIRCUIT	OTHER	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	80 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	.8 mm	7 mm		e3	30	260	7 mm
AUR3852GQU	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.8 mm	7 mm				260	7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.