Infineon Technologies - BGSF110GN26

BGSF110GN26 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number BGSF110GN26
Description TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 26; Package Code: HVQCCN; Package Shape: RECTANGULAR;
Datasheet BGSF110GN26 Datasheet
In Stock836
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3 V
Telecom IC Type: TELECOM CIRCUIT
Maximum Seated Height: .77 mm
Surface Mount: YES
Minimum Operating Temperature: -30 Cel
No. of Functions: 1
No. of Terminals: 26
Terminal Position: QUAD
Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Length: 3.4 mm
JESD-30 Code: R-PQCC-N26
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Maximum Operating Temperature: 85 Cel
Package Code: HVQCCN
Width: 2.6 mm
Terminal Pitch: .4 mm
Temperature Grade: OTHER
Moisture Sensitivity Level (MSL): 1
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