Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
260 |
4.9 mm |
||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
|||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SSOP20,.25 |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
1 |
1.5 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
6.5 mm |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
DUAL |
R-PDSO-G20 |
1 |
1.5 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
6.5 mm |
|||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-G20 |
1 |
1.5 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
6.5 mm |
|||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SSOP20,.25 |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
1 |
1.5 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
6.5 mm |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
1 |
1.5 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
6.5 mm |
|||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.95 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G5 |
1.4 mm |
1.6 mm |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
1 |
1.5 mm |
4.4 mm |
Not Qualified |
e4 |
260 |
6.5 mm |
||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.95 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G5 |
1.4 mm |
1.6 mm |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.95 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G5 |
1.4 mm |
1.6 mm |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G20 |
1 |
1.5 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
6.5 mm |
|||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.95 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G5 |
1.4 mm |
1.6 mm |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
1 |
1.5 mm |
4.4 mm |
Not Qualified |
e4 |
260 |
6.5 mm |
||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SSOP20,.25 |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
1 |
1.5 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
6.5 mm |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G20 |
1 |
1.5 mm |
4.4 mm |
e4 |
30 |
260 |
6.5 mm |
||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0257 mA |
2.7 V |
2.7 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSSOP8,.1 |
Other Telecom ICs |
.65 mm |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
1.45 mm |
1.625 mm |
Not Qualified |
e0 |
2.9 mm |
|||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0257 mA |
2.7 V |
2.7 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSSOP8,.1 |
Other Telecom ICs |
.65 mm |
125 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
DUAL |
R-PDSO-G8 |
1 |
1.45 mm |
1.625 mm |
Not Qualified |
30 |
260 |
2.9 mm |
|||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.95 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G5 |
1.4 mm |
1.6 mm |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
1.5 mm |
4.4 mm |
Not Qualified |
6.5 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.95 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G5 |
1.4 mm |
1.6 mm |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.0091 mA |
5 V |
5 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SSOP20,.25 |
Other Telecom ICs |
.65 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
1 |
1.35 mm |
4.4 mm |
Not Qualified |
e3 |
6.75 mm |
|||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
1.5 mm |
4.4 mm |
Not Qualified |
6.5 mm |
|||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0164 mA |
2.7 V |
2.7 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSSOP8,.1 |
Other Telecom ICs |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.45 mm |
1.625 mm |
Not Qualified |
e4 |
245 |
2.9 mm |
||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0166 mA |
2.7 V |
2.7 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSSOP8,.1 |
Other Telecom ICs |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.45 mm |
1.625 mm |
Not Qualified |
e4 |
30 |
260 |
2.9 mm |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
1.5 mm |
4.4 mm |
Not Qualified |
40 |
260 |
6.5 mm |
||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SSOP20,.25 |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
1 |
1.5 mm |
4.4 mm |
e4 |
30 |
260 |
6.5 mm |
|||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
1 |
1.5 mm |
4.4 mm |
Not Qualified |
e4 |
6.5 mm |
|||||||||||||||||||||||||||||||||||||||
|
Atmel |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.0125 mA |
3 V |
2.2/5.5 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SSOP16,.25 |
Other Telecom ICs |
.635 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
1.7 mm |
Not Qualified |
e3 |
260 |
4.9 mm |
|||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
1.5 mm |
4.4 mm |
Not Qualified |
40 |
260 |
6.5 mm |
||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
1.5 mm |
4.4 mm |
Not Qualified |
40 |
260 |
6.5 mm |
|||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
16 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.635 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G16 |
1.42 mm |
3.9 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2.7 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
DUAL |
R-PDSO-G8 |
1 |
1.45 mm |
1.625 mm |
30 |
260 |
2.9 mm |
||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2.7 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.45 mm |
1.625 mm |
e4 |
30 |
260 |
2.9 mm |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
30 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
TIN BISMUTH |
DUAL |
R-PDSO-G30 |
4 |
1.5 mm |
5.6 mm |
e6 |
30 |
260 |
9.75 mm |
||||||||||||||||||||||||||||||||||||||
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
30 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
TIN BISMUTH |
DUAL |
R-PDSO-G30 |
4 |
1.5 mm |
5.6 mm |
e6 |
30 |
260 |
9.75 mm |
||||||||||||||||||||||||||||||||||||||
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SSOP24,.3 |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
1.5 mm |
5.6 mm |
7.8 mm |
||||||||||||||||||||||||||||||||||||||||||
Onsemi |
TELECOM CIRCUIT |
OTHER |
GULL WING |
24 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3.3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.5 mm |
85 Cel |
-10 Cel |
DUAL |
R-PDSO-G24 |
1.5 mm |
4.4 mm |
6.5 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
30 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
TIN BISMUTH |
DUAL |
R-PDSO-G30 |
4 |
1.5 mm |
5.6 mm |
e6 |
30 |
260 |
9.75 mm |
||||||||||||||||||||||||||||||||||||||
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
1.5 mm |
4.4 mm |
5.2 mm |
||||||||||||||||||||||||||||||||||||||||||||
Onsemi |
TELECOM CIRCUIT |
OTHER |
GULL WING |
16 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
-20 Cel |
DUAL |
R-PDSO-G16 |
1.5 mm |
4.4 mm |
5.2 mm |
|||||||||||||||||||||||||||||||||||||||||||
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3.3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SSOP24,.25 |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
1.5 mm |
4.4 mm |
6.5 mm |
||||||||||||||||||||||||||||||||||||||||||
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3.3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SSOP24,.25 |
.2 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
1.5 mm |
4.4 mm |
6.5 mm |
||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
80 Cel |
-20 Cel |
DUAL |
R-PDSO-G20 |
1.5 mm |
4.4 mm |
Not Qualified |
6.5 mm |
|||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
1.5 mm |
4.4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
6.5 mm |
|||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
OTHER |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
33.5 mA |
4 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-30 Cel |
DUAL |
R-PDSO-G20 |
1.5 mm |
4.4 mm |
Not Qualified |
6.5 mm |
|||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
47.5 mA |
3.75 V |
3.75 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SSOP20,.25 |
Other Telecom ICs |
.65 mm |
75 Cel |
-30 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
1.5 mm |
4.4 mm |
Not Qualified |
e4 |
6.5 mm |
||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
1.5 mm |
4.4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
6.5 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.