LSSOP Other Function Telecom Interface ICs 113

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SA616DK-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.65 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified	e0			6.5 mm
SA616DK,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified		40	260	6.5 mm
SA607DK,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified		40	260	6.5 mm
SA606D/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
SA616DKY	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
SA606DK/02	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
SA607DK/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
MAX2473EUT-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm		e0			2.9 mm
MAX1472AKA-TG05	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		2.7 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.65 mm	125 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	1.45 mm	1.625 mm		e0			2.9 mm
MAX1472AKA	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		2.7 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8	1	1.45 mm	1.625 mm		e4	30	260	2.9 mm
MAX2472EUT-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm		e0			2.9 mm
TA31133FN-TP1	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		2.6 mA	3.5 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G16		1.6 mm	4.4 mm	Not Qualified				5 mm
TA31133FN-TP2	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		2.6 mA	3.5 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G16		1.6 mm	4.4 mm	Not Qualified				5 mm
TA31133FN(EL)	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		2.6 mA	3.5 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G16		1.6 mm	4.4 mm	Not Qualified				5 mm
TA31133FN(ER)	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		2.6 mA	3.5 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G16		1.6 mm	4.4 mm	Not Qualified				5 mm
TA31133FN	Toshiba	TELECOM CIRCUIT	OTHER	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		2.6 mA	3.5 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.65 mm	85 Cel	-30 Cel	TIN LEAD	DUAL	R-PDSO-G16		1.6 mm	4.4 mm	Not Qualified	e0			5 mm
82V3280EQG8	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	.5 mm	85 Cel	-40 Cel	TIN	DUAL	S-PDSO-G100	3	1.6 mm	14 mm		e3		260	14 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.