LSSOP Other Function Telecom Interface ICs 113

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

UAA2077BM

NXP Semiconductors

TELECOM CIRCUIT

OTHER

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

33.5 mA

4 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

e4

6.5 mm

935051650112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

e0

6.5 mm

935185240518

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

UAA2077CM-T

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

47.5 mA

3.75 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

75 Cel

-30 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

TDA8012AM-T

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

80 Cel

-10 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

SA5753DK

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

SSOP20,.25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

SA5753K-T

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

TDA8010AM

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

80 Cel

-20 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

PCF5075TDK-T

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

PCF5077T

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

1.5 mm

4.4 mm

Not Qualified

5.2 mm

TDA8010M-T

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

80 Cel

-20 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

PCF5075-T

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

e4

6.5 mm

PCF5077T-T

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

1.5 mm

4.4 mm

Not Qualified

5.2 mm

TDA8010MDK-T

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

80 Cel

-20 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

935051650118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

e0

6.5 mm

NE575K

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

70 Cel

0 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

935059610112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

6.5 mm

TDA8012AM

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

80 Cel

-10 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

e4

6.5 mm

PCF5075T/F2

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

935166750118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

6.5 mm

935054340112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

6.5 mm

SA575K-T

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

NE575K-T

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

70 Cel

0 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

UAA2072M

NXP Semiconductors

TELECOM CIRCUIT

OTHER

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

4.8 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

SA5753DK-T

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

PCF5075

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

e4

6.5 mm

935166750112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

6.5 mm

SA575K

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

TDA8010M

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

80 Cel

-20 Cel

TIN LEAD

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

e0

6.5 mm

TDA8012AM/C1

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

80 Cel

-10 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

e4

6.5 mm

UAA2072M-T

NXP Semiconductors

TELECOM CIRCUIT

OTHER

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

4.8 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

SA5753K

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

935241000118

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

80 Cel

-10 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

SA606DK/03,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

6.5 mm

SA607DK-T

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

Tin/Lead (Sn85Pb15)

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

e0

6.5 mm

SA636DK,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

SA636DK

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

40

260

6.5 mm

SA607DK

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

40

260

6.5 mm

SA606DK/03

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

6.5 mm

SA636DK/02

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

SSOP20,.25

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

6.5 mm

SA636DK,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

40

260

6.5 mm

SA606DK/02,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

6.5 mm

SA607DK,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

e4

6.5 mm

SA636DK-T

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

SA616DK,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1

1.5 mm

4.4 mm

Not Qualified

6.5 mm

SA607DK/01

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

6.5 mm

SA607DK/01,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1

1.5 mm

4.4 mm

Not Qualified

e4

6.5 mm

SA606DK-T

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

Tin/Lead (Sn85Pb15)

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

e0

6.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.