QFP Other Function Telecom Interface ICs 305

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

PSB2115

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

FLATPACK

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G64

2.45 mm

14 mm

Not Qualified

14 mm

PSB21383HV1.3

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G44

3

2.45 mm

10 mm

260

10 mm

PSB2115HV1.1

Infineon Technologies

TELECOM CIRCUIT

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

FLATPACK

QUAD

S-PQFP-G64

Not Qualified

PMB2411V1.1

Infineon Technologies

INDUSTRIAL

GULL WING

48

QFP

SQUARE

PLASTIC/EPOXY

YES

BIPOLAR

51.3 mA

2.7/4.5

FLATPACK

TQFP48,.35SQ

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G48

Not Qualified

e0

PSB21373

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

FLATPACK

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G44

2.45 mm

10 mm

Not Qualified

10 mm

PEB8090H

Infineon Technologies

TELECOM CIRCUIT

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

FLATPACK

QUAD

S-PQFP-G64

Not Qualified

PEB31664

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

FLATPACK

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G64

2.45 mm

14 mm

Not Qualified

14 mm

PEB3465

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

80

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

3.3/5,+-5

FLATPACK

QFP80,.68SQ

Codecs

.65 mm

70 Cel

0 Cel

.1 dB

TIN LEAD

QUAD

S-PQFP-G80

2.45 mm

16-BIT

14 mm

Not Qualified

A/MU-LAW

e0

14 mm

YES

PSF21150H

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

BASIC

FLATPACK

QFP64,.66SQ,32

Digital Transmission Interfaces

.8 mm

70 Cel

2.4 V

.45 V

CCITT I.430

0 Cel

QUAD

.144 Mbps

S-PQFP-G64

S/T

2.45 mm

14 mm

Not Qualified

4.5 Amp

14 mm

PEB22712

Infineon Technologies

TELECOM CIRCUIT

GULL WING

144

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

FLATPACK

QUAD

R-PQFP-G144

Not Qualified

PSB21384

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3/5

FLATPACK

QFP64,.66SQ,32

Other Telecom ICs

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G64

2.45 mm

14 mm

Not Qualified

14 mm

PSB2110-H

Infineon Technologies

TELECOM CIRCUIT

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

1

FLATPACK

QUAD

S-PQFP-G44

Not Qualified

PEB31666V1.3

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.125 mA

3.3 V

3.3

FLATPACK

QFP64,.66SQ,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G64

2.45 mm

14 mm

Not Qualified

e0

14 mm

PSB21525-H

Infineon Technologies

TELECOM CIRCUIT

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

1

FLATPACK

.8 mm

QUAD

S-PQFP-G44

2.45 mm

10 mm

Not Qualified

10 mm

PSF2115H

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

FLATPACK

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G64

2.45 mm

14 mm

Not Qualified

14 mm

PMB2900-H

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

FLATPACK

85 Cel

-25 Cel

QUAD

S-PQFP-G64

Not Qualified

PEB3554

Infineon Technologies

TELECOM CIRCUIT

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

FLATPACK

.65 mm

QUAD

R-PQFP-G100

3.4 mm

14 mm

Not Qualified

20 mm

PEB8191H

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

5

BASIC

FLATPACK

QFP64,.66SQ,32

Digital Transmission Interfaces

.8 mm

70 Cel

2.4 V

.45 V

ANSI T1.601

0 Cel

TIN LEAD

QUAD

.192 Mbps

S-PQFP-G64

S/T TO U (NT-1)

Not Qualified

7 Amp

e0

PSB21381

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3/5

FLATPACK

QFP44,.5SQ,32

Other Telecom ICs

.8 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G44

2.45 mm

10 mm

Not Qualified

e0

10 mm

PSB4860

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

80

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK

.65 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G80

2.45 mm

14 mm

Not Qualified

e0

14 mm

PXB4230

Infineon Technologies

TELECOM CIRCUIT

GULL WING

160

QFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK

.65 mm

QUAD

S-PQFP-G160

2.75 mm

28 mm

Not Qualified

28 mm

PSB7280-H

Infineon Technologies

TELECOM CIRCUIT

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK

QUAD

S-PQFP-G100

Not Qualified

PMB2240V1.6

Infineon Technologies

OTHER

GULL WING

48

QFP

SQUARE

PLASTIC/EPOXY

YES

BIPOLAR

29 mA

2.7/4.5

FLATPACK

TQFP48,.35SQ

Other Telecom ICs

.5 mm

85 Cel

-30 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G48

Not Qualified

e0

PMB2728-H

Infineon Technologies

TELECOM CIRCUIT

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

FLATPACK

.65 mm

QUAD

R-PQFP-G100

3.4 mm

14 mm

Not Qualified

20 mm

PMB2708_1-F(GOLD-SXH)

Infineon Technologies

TELECOM CIRCUIT

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

FLATPACK

QUAD

S-PQFP-G64

Not Qualified

PEB8091H

Infineon Technologies

TELECOM CIRCUIT

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

FLATPACK

QUAD

S-PQFP-G64

Not Qualified

PSB7115F

Infineon Technologies

COMMERCIAL

GULL WING

144

QFP

SQUARE

PLASTIC/EPOXY

YES

CMOS

.153 mA

3.3,5

FLATPACK

QFP144,.87SQ,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G144

Not Qualified

e0

PMB2706-F

Infineon Technologies

TELECOM CIRCUIT

GULL WING

144

QFP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

FLATPACK

QUAD

S-PQFP-G144

Not Qualified

PSB21393HV1.3

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G44

3

2.45 mm

10 mm

260

10 mm

PSB2115H

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

5

BASIC

FLATPACK

QFP64,.66SQ,32

Digital Transmission Interfaces

.8 mm

70 Cel

2.4 V

.45 V

CCITT I.430

0 Cel

TIN LEAD

QUAD

.192 Mbps

S-PQFP-G64

S/T

2.45 mm

14 mm

Not Qualified

7 Amp

e0

14 mm

PSB21382

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3/5

FLATPACK

QFP64,.66SQ,32

Other Telecom ICs

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G64

2.45 mm

14 mm

Not Qualified

14 mm

PEF2256HV2.2-G

Infineon Technologies

INDUSTRIAL

GULL WING

80

QFP

SQUARE

PLASTIC/EPOXY

YES

CMOS

145 mA

1.8,3.3

FLATPACK

QFP80,.68SQ

Other Telecom ICs

.635 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G80

T-1(DS1)

CEPT PCM-30/E-1

Not Qualified

PSB21383

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3/5

FLATPACK

QFP44,.5SQ,32

Other Telecom ICs

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G44

2.45 mm

10 mm

Not Qualified

10 mm

MAX2101

Maxim Integrated

COMMERCIAL

GULL WING

100

QFP

METAL

YES

BIPOLAR

5 V

5

FLATPACK

QFP100(UNSPEC)

Other Telecom ICs

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

Not Qualified

e0

MAX2742ECM-T

Maxim Integrated

INDUSTRIAL

GULL WING

48

QFP

SQUARE

PLASTIC/EPOXY

YES

CMOS

20 mA

2.5/3.3

FLATPACK

TQFP48,.35SQ

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G48

Not Qualified

e0

TB31301F(EL)

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

20 mA

5 V

FLATPACK

.65 mm

75 Cel

-20 Cel

QUAD

S-PQFP-G64

3.15 mm

12 mm

Not Qualified

12 mm

TB31301F-TP2

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

20 mA

5 V

FLATPACK

.65 mm

75 Cel

-20 Cel

QUAD

S-PQFP-G64

3.15 mm

12 mm

Not Qualified

12 mm

TC35191F

Toshiba

TELECOM CIRCUIT

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

FLATPACK

QUAD

R-PQFP-G100

Not Qualified

NOT SPECIFIED

240

TB31301F

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

20 mA

5 V

FLATPACK

.65 mm

75 Cel

-20 Cel

QUAD

S-PQFP-G64

3.15 mm

12 mm

Not Qualified

12 mm

TB31301F-TP1

Toshiba

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

20 mA

5 V

FLATPACK

.65 mm

75 Cel

-20 Cel

QUAD

S-PQFP-G64

3.15 mm

12 mm

Not Qualified

12 mm

82V3285DQ8

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G100

3

e0

20

240

82V3380EQG8

Renesas Electronics

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

528 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G100

3

Not Qualified

e3

30

260

82V3385PF

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

1

.528 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn85Pb15)

QUAD

S-PQFP-G100

3

1.6 mm

14 mm

Not Qualified

e0

20

240

14 mm

82V3385PFGI8

Renesas Electronics

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

528 mA

3.3 V

3.3

FLATPACK

QFP100,.63SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G100

3

Not Qualified

e3

30

260

ICS9536-01

Renesas Electronics

TELECOM CIRCUIT

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK

.8 mm

TIN LEAD

QUAD

S-PQFP-G64

2.45 mm

14 mm

Not Qualified

e0

14 mm

82V3255TF8

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G64

3

e0

30

240

PHS6903

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

32

QFP

SQUARE

PLASTIC/EPOXY

YES

1

-5.2 V

FLATPACK

1.27 mm

80 Cel

-10 Cel

QUAD

S-PQFP-G32

2.85 mm

12 mm

Not Qualified

12 mm

HSP50214BVCZ

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

GULL WING

120

QFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

FLATPACK

.8 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G120

3

4.07 mm

28 mm

Not Qualified

e3

30

245

28 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.