TELECOM CIRCUIT Other Function Telecom Interface ICs 2,400+

Reset All
Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

BLUENRG-M0A

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

11

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N11

2.5 mm

11.5 mm

20

240

13.5 mm

ST7580TR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.03 mA

13 V

13

CHIP CARRIER

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N48

3

1 mm

7 mm

Not Qualified

e4

30

260

7 mm

BGM220SC12WGA2

Silicon Labs

TELECOM CIRCUIT

3

40

260

450-0177C

Laird Technologies

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

SA602AD/01,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

R-PDSO-G20

1

1.5 mm

4.4 mm

Not Qualified

e4

30

260

6.5 mm

MAX-M8Q

U-blox Ag

TELECOM CIRCUIT

BLUENRG-M0L

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

11

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N11

2.5 mm

11.5 mm

20

240

13.5 mm

BQ51013BRHLR

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

20

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

.002 Mbps

R-PQCC-N20

2

1 mm

3.5 mm

e4

NOT SPECIFIED

260

4.5 mm

CC3235MODSM2MOBR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BUTT

63

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

NICKEL GOLD

QUAD

R-XQMA-B63

3

2.4 mm

17.5 mm

e4

30

260

20.5 mm

SARA-R510M8S-01B

U-blox Ag

TELECOM CIRCUIT

BT840

Fanstel

TELECOM CIRCUIT

NO LEAD

61

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

2 Mbps

R-XXMA-N61

14 mm

16 mm

CC2642R1FRGZT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N48

3

1 mm

7 mm

e4

30

260

7 mm

RS9116W-SB00-B00-B2A

Silicon Labs

TELECOM CIRCUIT

ADRV9002BBCZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA196,14X14,32

.8 mm

110 Cel

-40 Cel

BOTTOM

S-PBGA-B196

3

1.19 mm

12 mm

30

260

12 mm

SPBTLE-RF0TR

STMicroelectronics

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

BG96MATEA-128-SGN

Quectel Wireless Solutions

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

102

RECTANGULAR

UNSPECIFIED

YES

1

3.8 V

MICROELECTRONIC ASSEMBLY

75 Cel

-35 Cel

UNSPECIFIED

.375 Mbps

R-XXMA-N102

2.3 mm

22.5 mm

26.5 mm

TRF7970ARHBR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

110 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.848 Mbps

S-PQCC-N32

2

1 mm

5 mm

Not Qualified

e4

30

260

5 mm

ANNA-B112-00B

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

52

XMA

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

2 Mbps

S-XXMA-N52

3

1.25 mm

6.5 mm

6.5 mm

ISP1507-AC-ST

Insight Sip

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

62

XMA

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

2 Mbps

R-XXMA-N62

3

8 mm

30

260

8 mm

CC2592RGVT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N16

2

1 mm

4 mm

e4

30

260

4 mm

CYBLE-222014-01

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

22

SQUARE

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

.762 mm

85 Cel

-40 Cel

UNSPECIFIED

S-XXMA-N22

3

1.9 mm

10 mm

10 mm

NEO-M8P-2

U-blox Ag

TELECOM CIRCUIT

4

NOT SPECIFIED

NOT SPECIFIED

ODIN-W260-00B

U-blox Ag

TELECOM CIRCUIT

CC2530F256RHAR

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

3

1 mm

6 mm

Not Qualified

e4

30

260

6 mm

BLE112-A-V1

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

31

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

1.25 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N31

2.3 mm

12.05 mm

18.1 mm

RN4870-V/RM118

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

33

XMA

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

MODULE,33LEAD(UNSPEC)

1.1 mm

70 Cel

-20 Cel

UNSPECIFIED

.01 Mbps

R-XXMA-N33

2.46 mm

12 mm

22 mm

SJA1105TELY

NXP Semiconductors

TELECOM CIRCUIT

BALL

159

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA159,14X14,32

.8 mm

105 Cel

-40 Cel

BOTTOM

100 Mbps

S-PBGA-B159

3

1.5 mm

12 mm

260

12 mm

BT840E

Fanstel

TELECOM CIRCUIT

NO LEAD

61

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

2 Mbps

R-XXMA-N61

14 mm

16 mm

ESP32-D0WD

Espressif Systems (Shanghai)

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

38

DMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

DUAL

150 Mbps

R-XDMA-N38

3.45 mm

18 mm

31.4 mm

NINA-B112-04B

U-blox Ag

TELECOM CIRCUIT

4

ST25RU3993-BQFT

STMicroelectronics

TELECOM CIRCUIT

BMD-300-A-R-10

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

47

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

2 Mbps

R-XXMA-N47

1.9 mm

9.8 mm

14 mm

BM78SPPS5NC2-0002AA

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

33

XMA

RECTANGULAR

UNSPECIFIED

YES

1

1.9 V

MICROELECTRONIC ASSEMBLY

MODULE,33LEAD(UNSPEC)

1.1 mm

70 Cel

-20 Cel

GOLD OVER NICKEL

UNSPECIFIED

R-XXMA-N33

2.46 mm

12 mm

e4

40

255

22 mm

BQ51013BYFPR

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

BALL

28

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

.002 Mbps

R-XBGA-B28

1

.5 mm

1.88 mm

e1

30

260

3 mm

DWM3000TR13

Qorvo

TELECOM CIRCUIT

SX1503I091TRT

Semtech

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

28

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N28

.6 mm

4 mm

Not Qualified

e3

4 mm

TUSB211IRWBR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

.02 mA

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

480.24 Mbps

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

MAX2771ETI+

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

28

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

2.85 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC28,.2SQ,20

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N28

1

.8 mm

5 mm

e3

30

260

5 mm

RS9116W-DB00-CC1-X23

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

107

LGA

RECTANGULAR

UNSPECIFIED

YES

1

1.85 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

R-XBGA-N107

ZED-F9T-00B

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

BUTT

54

LGA

RECTANGULAR

UNSPECIFIED

YES

1

AEC-Q100

3 V

GRID ARRAY

1.1 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-B54

4

2.6 mm

17 mm

22 mm

HTRC11001T/02EE

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.01 mA

5 V

5

SMALL OUTLINE

SOP14,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

8.65 mm

NORA-B106-00B

U-blox Ag

TELECOM CIRCUIT

WSM-BL241-ADA-008

Murata Manufacturing

TELECOM CIRCUIT

INDUSTRIAL

BUTT

LGA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

R-XBGA-B

ADRV9002BBCZ-RL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA196,14X14,32

.8 mm

110 Cel

-40 Cel

BOTTOM

S-PBGA-B196

3

1.19 mm

12 mm

30

260

12 mm

EFR32BG22C224F512IM40-C

Silicon Labs

TELECOM CIRCUIT

MATTE TIN

2

e3

40

260

XBP9X-DMUS-001

Digi International

TELECOM CIRCUIT

NO LEAD

37

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

.25 Mbps

R-XXMA-N37

L86-M33

Quectel Wireless Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

SQUARE

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

DUAL

S-XDMA-N12

7.15 mm

18.4 mm

260

18.4 mm

TRF37B73IDSGT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

1

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-N8

1

.8 mm

2 mm

e4

30

260

2 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.