TELECOM CIRCUIT Other Function Telecom Interface ICs 2,400+

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

ANNA-B112-01B

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

52

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

S-XXMA-N52

3

1.25 mm

6.5 mm

6.5 mm

XB3-24Z8ST-J

Digi International

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

20

UNSPECIFIED

UNSPECIFIED

NO

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

DUAL

X-XDMA-T20

NOT SPECIFIED

NOT SPECIFIED

NEO-M8U-06B

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

DMA

RECTANGULAR

UNSPECIFIED

YES

1

AEC-Q100; TS 16949

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

DUAL

R-XDMA-N24

4

2.6 mm

12.2 mm

16 mm

SAM-M8Q-0

U-blox Ag

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

LBCA2HNZYZ-711

Murata Manufacturing

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

37

RECTANGULAR

UNSPECIFIED

YES

1

2.5 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N37

3

1 mm

7 mm

7.4 mm

TCA8418RTWR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N24

2

.8 mm

4 mm

Not Qualified

e4

30

260

4 mm

CC2640R2FRSMT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

S-PQCC-N32

3

1 mm

4 mm

e4

30

260

4 mm

BGM220SC22HNA2

Silicon Labs

TELECOM CIRCUIT

3

40

260

WT12-A-AI5

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

31

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

2.1781 Mbps

R-XXMA-N31

2.6 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

25.6 mm

ANNA-B112-01B-00

U-blox Ag

TELECOM CIRCUIT

ENW89823A4KF

Panasonic

TELECOM CIRCUIT

250

ST25R3915-AQFT

STMicroelectronics

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

HTRC11001T/03EE,11

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.01 mA

5 V

5

SMALL OUTLINE

SOP14,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1

4 mm

Not Qualified

e4

30

260

8.75 mm

NEO-M8T-0

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

RECTANGULAR

UNSPECIFIED

NO

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

DUAL

R-XDMA-N24

4

2.6 mm

12.2 mm

NOT SPECIFIED

NOT SPECIFIED

16 mm

SA636DK/01,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

SSOP20,.25

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1

1.5 mm

4.4 mm

Not Qualified

e4

30

260

6.5 mm

453-00005C

Laird Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

39

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

.75 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N39

4

2.33 mm

10 mm

30

260

14 mm

PN5321A3HN/C106,51

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

QUAD

S-PQCC-N40

2

1 mm

6 mm

260

6 mm

A1101R09C00GM

Ttm Technologies

TELECOM CIRCUIT

CC2520RHDRG4

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

28

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.25 Mbps

S-PQCC-N28

3

1 mm

5 mm

Not Qualified

e4

30

260

5 mm

EYSHSNZWZ

Taiyo Yuden

TELECOM CIRCUIT

NO LEAD

28

RECTANGULAR

UNSPECIFIED

YES

1

HYBRID

3 V

85 Cel

-40 Cel

BOTTOM

R-XBGA-N28

.85 mm

3.25 mm

8.55 mm

BGA524N6E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.8 V

SMALL OUTLINE, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

TIN

DUAL

R-PDSO-N6

1

.4 mm

.7 mm

e3

1.1 mm

OPA380AIDGKT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

1

.008 mA

5 V

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Telecom ICs

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

S-PDSO-G8

2

1.1 mm

3 mm

Not Qualified

e4

30

260

3 mm

MRF24WB0MA/RM

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

36

DIE

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

3.3

UNCASED CHIP

MODULE,36LEAD,.8

Other Telecom ICs

70 Cel

0 Cel

MATTE TIN

UPPER

R-XUUC-N36

Not Qualified

e3

BMD-330-A-R

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

XMA

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

2 Mbps

R-XXMA-N

3

250

NEO-M8Q-01A

U-blox Ag

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

WT12-A-AI4C

Silicon Labs

TELECOM CIRCUIT

NO LEAD

31

XMA

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.5 mm

85 Cel

-40 Cel

UNSPECIFIED

3 Mbps

R-XXMA-N31

2.4 mm

14 mm

25.6 mm

CC1200RHBR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

1.25 Mbps

S-PQCC-N32

3

1 mm

5 mm

Not Qualified

e4

NOT SPECIFIED

260

5 mm

CYBLE-416045-02

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

43

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

.9 mm

85 Cel

-40 Cel

UNSPECIFIED

8000 Mbps

R-XXMA-N43

3

2 mm

14 mm

18.5 mm

PN7160A1HN/C100E

NXP Semiconductors

TELECOM CIRCUIT

3

NOT SPECIFIED

260

AFE031AIRGZR

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

.0053 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Modems

.5 mm

125 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

S-PQCC-N48

3

1 mm

7 mm

Not Qualified

e4

NOT SPECIFIED

260

7 mm

AD9874ABSTZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

1.6 mm

7 mm

Not Qualified

e3

7 mm

BM70BLES1FC2-0002AA

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

33

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

MODULE,33LEAD(UNSPEC)

1.1 mm

70 Cel

-20 Cel

Nickel/Gold (Ni/Au)

UNSPECIFIED

.0086 Mbps

R-XXMA-N33

2.46 mm

12 mm

e4

22 mm

CC3235MODSF12MOBR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BUTT

63

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

NICKEL GOLD

QUAD

R-XQMA-B63

3

2.4 mm

17.5 mm

e4

30

260

20.5 mm

SA602AD/01,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

DUAL

R-PDSO-G20

1

1.5 mm

4.4 mm

Not Qualified

e4

30

260

6.5 mm

OC2321VQFN8XTMA1

Infineon Technologies

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

A1101R04C00GM

Ttm Technologies

TELECOM CIRCUIT

BLUENRG-232

STMicroelectronics

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

RN4678-V/RM113

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

33

XMA

RECTANGULAR

UNSPECIFIED

YES

1

1.9 V

MICROELECTRONIC ASSEMBLY

MODULE,33LEAD(UNSPEC)

1.1 mm

70 Cel

-20 Cel

GOLD OVER NICKEL

UNSPECIFIED

R-XXMA-N33

2.46 mm

12 mm

e4

22 mm

LBEE5HY1MW-230

Murata Manufacturing

TELECOM CIRCUIT

OTHER

NO LEAD

72

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-30 Cel

UNSPECIFIED

R-XXMA-N72

3

1.1 mm

7.3 mm

10

250

7.9 mm

ODIN-W260-00B-00

U-blox Ag

TELECOM CIRCUIT

4

245

SN65HVD1050QDRQ1

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

1

.07 mA

5 V

5

SMALL OUTLINE

SOP8,.25

Network Interfaces

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1 Mbps

R-PDSO-G8

1

1.75 mm

3.8 mm

Not Qualified

e4

30

260

4.905 mm

ADAR1000ACCZN-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BUTT

88

HLGA

SQUARE

PLASTIC/EPOXY

YES

1

-5 V

3.3 V

GRID ARRAY, HEAT SINK/SLUG

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B88

3

.8 mm

7 mm

260

7 mm

BGM111A256V21

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

31

RECTANGULAR

UNSPECIFIED

YES

3.3 V

MICROELECTRONIC ASSEMBLY

1.2 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N31

2.2 mm

12.9 mm

15 mm

BQ51013BRHLT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

20

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

.002 Mbps

R-PQCC-N20

2

1 mm

3.5 mm

e4

NOT SPECIFIED

260

4.5 mm

ODIN-W260-01B-01

U-blox Ag

TELECOM CIRCUIT

4

SN65DSI84ZQER

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

64

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1 Mbps

S-PBGA-B64

3

1 mm

5 mm

e1

30

260

5 mm

XB3-24Z8UM-J

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

34

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N34

13 mm

NOT SPECIFIED

NOT SPECIFIED

19 mm

ADAR1000ACCZN

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BUTT

88

HLGA

SQUARE

PLASTIC/EPOXY

YES

1

-5 V

3.3 V

GRID ARRAY, HEAT SINK/SLUG

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B88

.8 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.