Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
52 |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
S-XXMA-N52 |
3 |
1.25 mm |
6.5 mm |
6.5 mm |
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|
Digi International |
TELECOM CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
20 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
X-XDMA-T20 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
AEC-Q100; TS 16949 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N24 |
4 |
2.6 mm |
12.2 mm |
16 mm |
||||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Murata Manufacturing |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
37 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
2.5 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N37 |
3 |
1 mm |
7 mm |
7.4 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
2 |
.8 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
4 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
S-PQCC-N32 |
3 |
1 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
3 |
40 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
31 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.1781 Mbps |
R-XXMA-N31 |
2.6 mm |
14 mm |
NOT SPECIFIED |
NOT SPECIFIED |
25.6 mm |
|||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
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|
Panasonic |
TELECOM CIRCUIT |
250 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.01 mA |
5 V |
5 |
SMALL OUTLINE |
SOP14,.25 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1 |
4 mm |
Not Qualified |
e4 |
30 |
260 |
8.75 mm |
||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N24 |
4 |
2.6 mm |
12.2 mm |
NOT SPECIFIED |
NOT SPECIFIED |
16 mm |
||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SSOP20,.25 |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
1 |
1.5 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
6.5 mm |
||||||||||||||||||||||||||||||||||||
|
Laird Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
39 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
.75 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N39 |
4 |
2.33 mm |
10 mm |
30 |
260 |
14 mm |
|||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-30 Cel |
QUAD |
S-PQCC-N40 |
2 |
1 mm |
6 mm |
260 |
6 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Ttm Technologies |
TELECOM CIRCUIT |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
28 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.25 Mbps |
S-PQCC-N28 |
3 |
1 mm |
5 mm |
Not Qualified |
e4 |
30 |
260 |
5 mm |
|||||||||||||||||||||||||||||||||||
|
Taiyo Yuden |
TELECOM CIRCUIT |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
HYBRID |
3 V |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-N28 |
.85 mm |
3.25 mm |
8.55 mm |
||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
SMALL OUTLINE, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-N6 |
1 |
.4 mm |
.7 mm |
e3 |
1.1 mm |
||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
.008 mA |
5 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Telecom ICs |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
S-PDSO-G8 |
2 |
1.1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
36 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
3.3 |
UNCASED CHIP |
MODULE,36LEAD,.8 |
Other Telecom ICs |
70 Cel |
0 Cel |
MATTE TIN |
UPPER |
R-XUUC-N36 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
2 Mbps |
R-XXMA-N |
3 |
250 |
||||||||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
NO LEAD |
31 |
XMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.5 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
3 Mbps |
R-XXMA-N31 |
2.4 mm |
14 mm |
25.6 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
1.25 Mbps |
S-PQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
5 mm |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
43 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
.9 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
8000 Mbps |
R-XXMA-N43 |
3 |
2 mm |
14 mm |
18.5 mm |
||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
3 |
NOT SPECIFIED |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
.0053 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Modems |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
S-PQCC-N48 |
3 |
1 mm |
7 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
7 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
1.6 mm |
7 mm |
Not Qualified |
e3 |
7 mm |
||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
33 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
MODULE,33LEAD(UNSPEC) |
1.1 mm |
70 Cel |
-20 Cel |
Nickel/Gold (Ni/Au) |
UNSPECIFIED |
.0086 Mbps |
R-XXMA-N33 |
2.46 mm |
12 mm |
e4 |
22 mm |
|||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
BUTT |
63 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL GOLD |
QUAD |
R-XQMA-B63 |
3 |
2.4 mm |
17.5 mm |
e4 |
30 |
260 |
20.5 mm |
||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
DUAL |
R-PDSO-G20 |
1 |
1.5 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
6.5 mm |
|||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Ttm Technologies |
TELECOM CIRCUIT |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
33 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1.9 V |
MICROELECTRONIC ASSEMBLY |
MODULE,33LEAD(UNSPEC) |
1.1 mm |
70 Cel |
-20 Cel |
GOLD OVER NICKEL |
UNSPECIFIED |
R-XXMA-N33 |
2.46 mm |
12 mm |
e4 |
22 mm |
||||||||||||||||||||||||||||||||||||||||
|
Murata Manufacturing |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
72 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-30 Cel |
UNSPECIFIED |
R-XXMA-N72 |
3 |
1.1 mm |
7.3 mm |
10 |
250 |
7.9 mm |
||||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
4 |
245 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
.07 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.8 mm |
Not Qualified |
e4 |
30 |
260 |
4.905 mm |
||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BUTT |
88 |
HLGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
-5 V |
3.3 V |
GRID ARRAY, HEAT SINK/SLUG |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B88 |
3 |
.8 mm |
7 mm |
260 |
7 mm |
||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
31 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.2 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N31 |
2.2 mm |
12.9 mm |
15 mm |
|||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
20 |
VQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
.002 Mbps |
R-PQCC-N20 |
2 |
1 mm |
3.5 mm |
e4 |
NOT SPECIFIED |
260 |
4.5 mm |
|||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
4 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
64 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1 Mbps |
S-PBGA-B64 |
3 |
1 mm |
5 mm |
e1 |
30 |
260 |
5 mm |
|||||||||||||||||||||||||||||||||||||
|
Digi International |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
34 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N34 |
13 mm |
NOT SPECIFIED |
NOT SPECIFIED |
19 mm |
|||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BUTT |
88 |
HLGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
-5 V |
3.3 V |
GRID ARRAY, HEAT SINK/SLUG |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B88 |
.8 mm |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.