AUTOMOTIVE Other Function Telecom Interface ICs 271

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX1471ATJ+T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			.0086 mA	3 V	2.4/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX1472AKA+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				2.7 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.45 mm	1.625 mm		e4	30	260	2.9 mm
MAX7030LATJ-T	Analog Devices		AUTOMOTIVE	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES		CMOS			20.4 mA		2.5/5	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	TIN LEAD	QUAD		S-PQCC-N32				Not Qualified	e0
MAX1471ATJ+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			.0086 mA	3 V	2.4/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX7031MATJ50	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				2.7 V	2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e0			5 mm
MAX1479ATE+T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			.0181 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N16	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX1479ATE+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			.0181 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N16	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX7031MATJ15+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			.0204 mA	2.7 V	2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified				5 mm
MAX7042ATJ+T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			.0092 mA	3 V	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX7032ATJ+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			.0204 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX7034AUI+T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			.0087 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	9.7 mm
MAX7031MATJ15	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				2.7 V	2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e0			5 mm
MAX7031LATJ	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				2.7 V	2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e0			5 mm
MAX7042ATJ/V+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm	5 mm		e3	30	260	5 mm
MAX7030MATJ	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			.0204 mA	2.7 V	2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e0			5 mm
MAX7031HATJ51	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				2.7 V	2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e0			5 mm
MAX7042ATJ-T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			.0086 mA	3 V	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e0			5 mm
MAX7032ATJ	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			.0204 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e0			5 mm
MAX7030MATJ+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			.0204 mA	2.7 V	2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3			5 mm
MAX7042ATJ/V+T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm	5 mm		e3	30	260	5 mm
MAX7034AUI/V+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.1 mm	4.4 mm		e3	30	260	9.7 mm
MAX7030HATJ+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			.0204 mA	2.7 V	2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX7030MATJ-T	Analog Devices		AUTOMOTIVE	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES		CMOS			20.4 mA		2.5/5	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	TIN LEAD	QUAD		S-PQCC-N32				Not Qualified	e0
MAX7034AUI+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.1 mm	4.4 mm		e3	30	260	9.7 mm
NLHVQ001USG	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			10 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G8		.9 mm	2 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
NLHVQ011USG	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					20 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G8	1	.9 mm	2 mm		e3	30	260	2.3 mm
NCV7428D1L3R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	2	1.72 mm	3.937 mm		e3	30	260	4.927 mm
NCV7425DW5R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	2	2.65 mm	7.5 mm		e3	30	260	10.3 mm
NCV7428MW3R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	1 mm	3 mm		e3	30	260	3 mm
NCV7425DW0G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-G16		2.65 mm	7.5 mm		e3			10.3 mm
NCV7428MWL5R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	1 mm	3 mm		e3	30	260	3 mm
NCV7425DW0R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-G16	2	2.65 mm	7.5 mm		e3		260	10.3 mm
NCV7428MWL3R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	1 mm	3 mm		e3	30	260	3 mm
NCV7425DW5G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-G16		2.65 mm	7.5 mm		e3			10.3 mm
NCV7428D1L5R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	2	1.72 mm	3.937 mm		e3	30	260	4.927 mm
STB3300	STMicroelectronics	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1				.06 mA	5 V	5	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	Other Telecom ICs	.8 mm	125 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G32		1.6 mm	7 mm	Not Qualified	e0			7 mm
UJA1023T/2R04	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified				9.9 mm
UJA1023T/2R04/C	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified				9.9 mm
MC33660BEF	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-N8	3	1.75 mm	3.9 mm		e3	40	260	4.9 mm
MC33742PEG/R2	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V	5.5/18	SMALL OUTLINE		Network Interfaces	1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified	e3	40	260	17.925 mm
MC33MR2001VVK	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	BALL	90	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B90	3	1.02 mm	6 mm		e1	40	260	6 mm
MC33742PEP	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	48	QCCN	SQUARE	PLASTIC/EPOXY	YES				1	.045 mA		5.5/18	CHIP CARRIER	LCC48,.27SQ,20	Network Interfaces	.5 mm	125 Cel	-40 Cel	TIN	QUAD	1 Mbps	S-PQCC-N48	3			Not Qualified	e3	40	260
MC33742PEG	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES				1	.045 mA		5.5/18	SMALL OUTLINE	SOP28,.4	Network Interfaces	1.27 mm	125 Cel	-40 Cel	TIN	DUAL	1 Mbps	R-PDSO-G28	3			Not Qualified	e3	40	260
MC33660EFR2	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	3	1.75 mm	3.9 mm		e3			4.9 mm
MC33742SPEG/R2	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V	5.5/18	SMALL OUTLINE		Network Interfaces	1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified	e3	40	260	17.925 mm
MC33742SPEG	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES				1	.045 mA		5.5/18	SMALL OUTLINE	SOP28,.4	Network Interfaces	1.27 mm	125 Cel	-40 Cel	TIN	DUAL	1 Mbps	R-PDSO-G28	3			Not Qualified	e3	40	260
MC33MR2001RVK	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	BALL	85	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B85	3	1.02 mm	6 mm		e1	40	260	6 mm
MC33MR2001TVK	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	BALL	89	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B89	3	1.02 mm	6 mm		e1	40	260	6 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.