AUTOMOTIVE Other Function Telecom Interface ICs 271

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Battery Supply (V)	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
OPA2381AIDRBTG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				.0011 mA	5 V	3/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	Other Telecom ICs	.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N8	2	1 mm	3 mm	Not Qualified	e4	30	260	3 mm
OPA2381AIDRBT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	2				5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N8	2	1 mm	3 mm	Not Qualified	e4	30	260	3 mm
LMX9830SMX	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	60	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			2.75 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	125 Cel		-40 Cel	TIN LEAD	BOTTOM		R-PBGA-B60	3	1.3 mm	6 mm	Not Qualified	e0	30	235	9 mm
CC2533F96RHAR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm	6 mm	Not Qualified	e4	30	260	6 mm
CC2531F128RHAR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm	6 mm	Not Qualified	e4	30	260	6 mm
CC2533F64RHAR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm	6 mm	Not Qualified	e4	30	260	6 mm
CC2538SF23RTQR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12 Mbps	S-PQCC-N56	3	1 mm	8 mm		e4	30	260	8 mm
OPA381AIDRBR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				.0011 mA	5 V	3/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12	Other Telecom ICs	.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N8	2	1 mm	3 mm	Not Qualified	e4	30	260	3 mm
BQ51020YFPR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	42	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel	8.8	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		R-XBGA-B42	1	.5 mm	2.844 mm		e1	30	260	3.556 mm
CC2538NF23RTQR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12 Mbps	S-PQCC-N56	3	1 mm	8 mm		e4	30	260	8 mm
CC2533F32RHAT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm	6 mm	Not Qualified	e4	30	260	6 mm
OPA2381AIDGKRG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				.0011 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified	e4	30	260	3 mm
BQ51021YFPT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	42	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		R-XBGA-B42	1	.5 mm	2.844 mm		e1	30	260	3.556 mm
LMX9830SM/NOPB	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	60	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.065 mA	2.75 V	2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA60,6X10,32	Other Telecom ICs	.8 mm	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	.9216 Mbps	R-PBGA-B60	4	1.3 mm	6 mm	Not Qualified	e1	30	260	9 mm
OPA381AIDGKRG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				.0011 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel		-40 Cel		DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified		30	260	3 mm
CC2538NF11RTQR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12 Mbps	S-PQCC-N56	3	1 mm	8 mm		e4	30	260	8 mm
SN65HVD1050-Q1	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		5 V		SMALL OUTLINE			1.27 mm	125 Cel		-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
LMX9830SM	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	60	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			2.75 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	125 Cel		-40 Cel		BOTTOM		R-PBGA-B60		1.3 mm	6 mm	Not Qualified				9 mm
CC2530F64RHAR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm	6 mm	Not Qualified	e4	30	260	6 mm
OPA381AIDRBT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1				5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N8	2	1 mm	3 mm	Not Qualified	e4	30	260	3 mm
CC2538NF11RTQT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12 Mbps	S-PQCC-N56	3	1 mm	8 mm		e4	30	260	8 mm
CC2538NF23RTQT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12 Mbps	S-PQCC-N56	3	1 mm	8 mm		e4	30	260	8 mm
OPA2381AIDRBR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				.0011 mA	5 V	3/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12	Other Telecom ICs	.65 mm	125 Cel		-40 Cel		DUAL		S-PDSO-N8		1 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3 mm
BQ51020YFPT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	42	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel	8.8	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		R-XBGA-B42	1	.5 mm	2.844 mm		e1	30	260	3.556 mm
BQ51025YFPR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	42	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B42	1	.5 mm	2.844 mm		e1	30	260	3.556 mm
BQ51021YFPR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	42	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		R-XBGA-B42	1	.5 mm	2.844 mm		e1	30	260	3.556 mm
OPA381AIDRBRG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				.0011 mA	5 V	3/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12	Other Telecom ICs	.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N8	2	1 mm	3 mm	Not Qualified	e4	30	260	3 mm
OPA2381AIDGKR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	2				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified	e4	30	260	3 mm
BQ51025YFPT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	42	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B42	1	.5 mm	2.844 mm		e1	30	260	3.556 mm
CC2533F96RHAT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm	6 mm	Not Qualified	e4	30	260	6 mm
CC2530F32RHAR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm	6 mm	Not Qualified	e4	30	260	6 mm
OPA2381AIDRBRG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				.0011 mA	5 V	3/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12	Other Telecom ICs	.65 mm	125 Cel		-40 Cel		DUAL		S-PDSO-N8		1 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3 mm
CC2538SF23RTQT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12 Mbps	S-PQCC-N56	3	1 mm	8 mm		e4	30	260	8 mm
CC2533F32RHAR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm	6 mm	Not Qualified	e4	30	260	6 mm
OPA381AIDRBTG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				.0011 mA	5 V	3/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	Other Telecom ICs	.65 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N8	2	1 mm	3 mm	Not Qualified	e4	30	260	3 mm
CC2533F64RHAT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm	6 mm	Not Qualified	e4	30	260	6 mm
ADA8282WBCPZ-R7	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS	AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	3	.8 mm	5 mm		e3	30	260	5 mm
ADA8282WBCPZ	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS	AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	3	.8 mm	5 mm		e3	30	260	5 mm
MAX1471ATJ/V+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	34	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS	AEC-Q100	.0086 mA	3 V	2.4/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N34	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX7030HATJ-T	Analog Devices		AUTOMOTIVE	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			CMOS		20.4 mA		2.5/5	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel		-40 Cel	TIN LEAD	QUAD		S-PQCC-N32				Not Qualified	e0
MAX7032ATJ-T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			CMOS		20.4 mA	2.7 V	2.7	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel		-40 Cel	TIN LEAD	QUAD		S-PQCC-N32				Not Qualified	e0
MAX7032ATJ+T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		.0204 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX7030HATJ+T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		.0204 mA	2.7 V	2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX7034AUI/V+T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	AEC-Q100	.0087 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	9.7 mm
MAX7031MATJ15-T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			2.7 V	2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel		-40 Cel	TIN LEAD	QUAD		S-XQCC-N32		.8 mm	5 mm	Not Qualified	e0			5 mm
MAX1471ATJ/V+T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS	AEC-Q100		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm	5 mm		e3	30	260	5 mm
MAX7044AKA+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			2.7 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	125 Cel		-40 Cel	NICKEL GOLD PALLADIUM	DUAL		R-PDSO-G8	1	1.45 mm	1.625 mm			30	260	2.9 mm
MAX7042AAX+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V		SMALL OUTLINE, SHRINK PITCH			.8 mm	125 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G36	1	2.64 mm	7.495 mm	Not Qualified	e3			15.415 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.