AUTOMOTIVE Other Function Telecom Interface ICs 271

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

MAX1471AGJ/VY+

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

AEC-Q100

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1

.8 mm

5 mm

e3

30

260

5 mm

MAX1479ATE-T

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

.0181 mA

2.7 V

2.7

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N16

1

.8 mm

3 mm

Not Qualified

e0

3 mm

MAX1472AKA-TG05

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

2.7 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G8

1

1.45 mm

1.625 mm

e0

2.9 mm

MAX7032ATJ+WC6L

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1

.8 mm

5 mm

e3

30

260

5 mm

MAX7032ATJ+TWC6L

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

S-XQCC-N32

.8 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

MAX7031HATJ51-T

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

2.7 V

2.5/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

.8 mm

5 mm

Not Qualified

e0

5 mm

MAX7031MATJ50+T

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

.0204 mA

2.7 V

2.5/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

QUAD

S-XQCC-N32

.8 mm

5 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

5 mm

MAX1471ATJ-T

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

.0086 mA

3 V

2.4/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e0

245

5 mm

MAX7049ATI+T

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

28

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N28

1

.8 mm

5 mm

e3

30

260

5 mm

MAX7060ATG/V+T

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

1

.8 mm

4 mm

e3

30

260

4 mm

MAX7031HATJ17+T

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

2.7 V

2.5/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e3

5 mm

MAX7031MATJ50+

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

.0204 mA

2.7 V

2.5/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e3

30

260

5 mm

MAX7030LATJ+

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

.0204 mA

2.7 V

2.5/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e3

30

260

5 mm

MAX7031LATJ+T

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

.0204 mA

2.7 V

2.5/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

QUAD

S-XQCC-N32

.8 mm

5 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

5 mm

MAX7031HATJ17+

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

2.7 V

2.5/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e3

30

260

5 mm

MAX7030LATJ

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

.0204 mA

2.7 V

2.5/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e0

5 mm

MAX1471AGJ/VY+T

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

AEC-Q100

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

S-XQCC-N32

.8 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

MAX7031HATJ51+T

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

2.7 V

2.5/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e3

30

260

5 mm

MAX1471ATJ-C3N

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

1

.8 mm

5 mm

e0

20

240

5 mm

MAX7030LATJ+T

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

.0204 mA

2.7 V

2.5/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e3

30

260

5 mm

MAX7060ATG+T

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

QUAD

S-XQCC-N24

1

.8 mm

4 mm

4 mm

MAX1472AKA

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

2.7 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

1.45 mm

1.625 mm

e4

30

260

2.9 mm

MAX7031MATJ50-T

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

2.7 V

2.5/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

.8 mm

5 mm

Not Qualified

e0

5 mm

MAX7057ASE+

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.0237 mA

2.7 V

2.7

SMALL OUTLINE

SOP16,.25

Other Telecom ICs

1.27 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

1.75 mm

3.9 mm

Not Qualified

e3

30

260

9.9 mm

MAX7031HATJ17

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

2.7 V

2.5/5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e0

5 mm

ISL32175EFVZ

Renesas Electronics

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

SOP16,.25

.65 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

80 Mbps

R-PDSO-G16

1.2 mm

4.4 mm

e3

5 mm

ISL32175EFBZ

Renesas Electronics

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

SMALL OUTLINE

sop16,.24

1.27 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

80 Mbps

R-PDSO-G16

1.75 mm

3.9 mm

e3

9.9 mm

ISL32273EFVZ

Renesas Electronics

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

2

1.2 mm

4.4 mm

e3

30

260

5 mm

ISL32175EFBZ-T

Renesas Electronics

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

3

1.75 mm

3.9 mm

Not Qualified

e3

30

260

9.9 mm

ISL32175EFVZ-T

Renesas Electronics

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

2

1.2 mm

4.4 mm

Not Qualified

e3

30

260

5 mm

ISL32273EFVZ-T

Renesas Electronics

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

2

1.2 mm

4.4 mm

e3

30

260

5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.