COMMERCIAL Other Function Telecom Interface ICs 971

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BM20SPKS1NBC-0001AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	XMA	RECTANGULAR	UNSPECIFIED	YES	1						3.7 V		MICROELECTRONIC ASSEMBLY	MODULE,40LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N40		2.5 mm	15 mm					29 mm
WL1801MODGBMOCT	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel	-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
RN4871-V/RM118	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949			3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm					11.5 mm
RN4678-V/RM100	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1						3.3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm					22 mm
BM77SPPS3MC2-0007AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED	YES	1						3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,30LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel		UNSPECIFIED	.1125 Mbps	R-XXMA-N30		1.86 mm	12 mm			NOT SPECIFIED	NOT SPECIFIED	15 mm
RN4677-V/RM100	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949			3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED	.4 Mbps	R-XXMA-N33		2.46 mm	12 mm		e4			22 mm
BM78SPPS5MC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1						1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm		e4	40	255	22 mm
WL1831MODGBMOCR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel	-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
RN4871-V/RM140	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949			3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm					11.5 mm
WL1831MODGBMOCT	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel	-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
RN4871-V/RM130	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949			3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm					11.5 mm
MRF24WB0MA/RM	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	36	DIE	RECTANGULAR	UNSPECIFIED	YES	1						3.3 V	3.3	UNCASED CHIP	MODULE,36LEAD,.8	Other Telecom ICs		70 Cel	0 Cel	MATTE TIN	UPPER		R-XUUC-N36				Not Qualified	e3
BM70BLES1FC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1						3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel	Nickel/Gold (Ni/Au)	UNSPECIFIED	.0086 Mbps	R-XXMA-N33		2.46 mm	12 mm		e4			22 mm
RN4678-V/RM113	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1						1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm		e4			22 mm
RN4870-V/RM118	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	NO	1						3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N33		2.46 mm	12 mm					22 mm
BM78SPPS5NC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1						1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm		e4	40	255	22 mm
RN4678APL-V/RM100	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1						1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm					22 mm
WL1835MODGBMOCR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel	-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
RTL8152B-VB-CG	Realtek Semiconductor	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N24		.9 mm	4 mm					4 mm
BM71BLES1FC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1						3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel	Nickel/Gold (Ni/Au)	UNSPECIFIED	.0086 Mbps	R-XXMA-N16		2.16 mm	9 mm		e4			11.5 mm
WL1801MODGBMOCR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel	-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
RN4678-V/RM111	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949			1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm					22 mm
WL1835MODGBMOCT	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel	-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
RN4678APL-V/RM120	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1						1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm					22 mm
RN4678APL-V/RM113	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1						1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm					22 mm
CY7B923-JXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS			85 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified	e3	20	260	11.5316 mm
BM23SPKS1NB9-0B02AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	43	XMA	RECTANGULAR	UNSPECIFIED	YES	1						3.7 V		MICROELECTRONIC ASSEMBLY	MODULE,43LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N43		1.9 mm	15 mm					29 mm
TUSB211RWBR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1				.02 mA	3.3 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	480.24 Mbps	S-PQCC-N12	2	.4 mm	1.6 mm		e4	30	260	1.6 mm
WL1805MODGBMOCT	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel	-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
CY7B923-JXCT	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS			.085 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified	e3	20	260	11.5316 mm
ATA8405C-6DQY-66	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	50 Cel	0 Cel	MATTE TIN	DUAL		S-PDSO-G10	2	1.1 mm	3 mm		e3	40	260	3 mm
HT12D(18DIP)	Holtek Semiconductor	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			CMOS					2.4/12	IN-LINE	DIP18(UNSPEC)	Other Telecom ICs		70 Cel	-20 Cel		DUAL		R-PDIP-T18				Not Qualified
UCC3750DW	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS				5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	2	2.65 mm	7.5 mm	Not Qualified	e4	30	260	17.9 mm
UCC3750DWTR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS				5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	2	2.65 mm	7.5 mm	Not Qualified	e4	30	260	17.9 mm
HT12D(20SOP)	Holtek Semiconductor	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			CMOS					2.4/12	SMALL OUTLINE	SOP20(UNSPEC)	Other Telecom ICs		70 Cel	-20 Cel		DUAL		R-PDSO-G20				Not Qualified
RN4870-V/RM140	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949			3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N33		2.46 mm	12 mm					22 mm
UCC3750DWTRG4	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS				5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	2	2.65 mm	7.5 mm	Not Qualified	e4	30	260	17.9 mm
CY7B923-SXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			.085 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL	400 Mbps	R-PDSO-G28	3	2.67 mm	7.505 mm	Not Qualified	e4	20	260	17.905 mm
RN4678APL-V/RM111	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949			1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm					22 mm
ADV7619KSVZ-P	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				1.8 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.4 mm	70 Cel	0 Cel	Matte Tin (Sn) - annealed	QUAD		S-PQFP-G128	3	1.2 mm	14 mm		e3		260	14 mm
ATA8404C-6DQY-66	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		.5 mm	50 Cel	0 Cel	MATTE TIN	DUAL		S-PDSO-G10	2	1.1 mm	3 mm		e3	40	260	3 mm
CYG2030	IXYS Corporation		COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			HYBRID			9 mA	5 V	5	IN-LINE	DIP18(UNSPEC)	Other Telecom ICs		70 Cel	0 Cel		DUAL		R-PDIP-T18				Not Qualified
AD630JN/+	Analog Devices		COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			BIPOLAR		-15 V	.005 mA	15 V	+-15	IN-LINE	DIP20,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T20					e0
TLK2711AJRZQE	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1						2.5 V	2.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,9X9,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B80	3	1 mm	5 mm	Not Qualified	e1	30	260	5 mm
CY7B933-JXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS			155 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified	e3	20	260	11.5316 mm
CYG2031	IXYS Corporation		COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			HYBRID			9 mA	5 V	5	IN-LINE	DIP18(UNSPEC)	Other Telecom ICs		70 Cel	0 Cel		DUAL		R-PDIP-T18				Not Qualified
MRF24WB0MB/RM	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	36	DIE	RECTANGULAR	UNSPECIFIED	YES	1						3.3 V		UNCASED CHIP				70 Cel	0 Cel	MATTE TIN	UPPER		R-XUUC-N36				Not Qualified	e3
RTL8139D-LF	Realtek Semiconductor	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS				2.5 V		FLATPACK			.65 mm	70 Cel	0 Cel		QUAD		R-PQFP-G100		3.3 mm	14 mm			NOT SPECIFIED	NOT SPECIFIED	20 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.