COMMERCIAL Other Function Telecom Interface ICs 971

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-1	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LTC1957-2EMS	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified		e0			3 mm
LTC4401-1ES6#TRPBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.95 mm	70 Cel	MATTE TIN	DUAL	R-PDSO-G6	1	1 mm		1.6 mm	Not Qualified		e3	30	260	2.9 mm
LTC4401-2EMS8#PBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	Matte Tin (Sn)	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e3	30	260	3 mm
LTC1957-1EMS8#TR	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e0			3 mm
LTM9004CV-AB#PBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	204	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		GRID ARRAY			1.27 mm	70 Cel	GOLD	BOTTOM	R-PBGA-N204		2.97 mm		15 mm	Not Qualified		e4			22 mm
LTC4401-1ES6#TR	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.95 mm	70 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1 mm		1.6 mm	Not Qualified		e0			2.9 mm
LT1328CS8#TRPBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	70 Cel	MATTE TIN	DUAL	R-PDSO-G8		1.752 mm		3.9 mm	Not Qualified		e3			4.9 mm
ADSP-21MOD980-000	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.75 V		GRID ARRAY			1.27 mm	70 Cel	TIN LEAD	BOTTOM	S-PBGA-B352		2.62 mm		35 mm	Not Qualified		e0			35 mm
AD9950KJ	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	J BEND	68	QCCJ	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR	-5.2 V	.054 mA	5 V	5,-5.2	CHIP CARRIER	LDCC68,1.0SQ	Other Telecom ICs	1.27 mm	70 Cel	TIN LEAD	QUAD	S-CQCC-J68					Not Qualified		e0
LTC1957-2EMS#PBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	Matte Tin (Sn)	DUAL	S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified		e3	30	260	3 mm
LTC4401-1ES6#TRMPBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.95 mm	70 Cel	MATTE TIN	DUAL	R-PDSO-G6	1	1 mm		1.6 mm	Not Qualified		e3	30	260	2.9 mm
LT1328CMS8#PBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e3	30	260	3 mm
MAX3754CCM-T	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	70 Cel	TIN LEAD	QUAD	S-PQFP-G48	1	1.2 mm		7 mm	Not Qualified		e0			7 mm
DS2180Q	Analog Devices		COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS			5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	TIN LEAD	QUAD	S-PQCC-J44			T-1(DS1)		Not Qualified		e0
MAX3266CSA+T	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G8		1.75 mm		3.9 mm	Not Qualified		e3			4.9 mm
MAX3966CEE	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.635 mm	70 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.73 mm		3.9 mm	Not Qualified		e0		245	4.89 mm
MAX3120CUA+T	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e3	30	260	3 mm
DS2172T/T&R+	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		FLATPACK, THIN PROFILE			.8 mm	70 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G32	1	1.2 mm		7 mm	Not Qualified		e3			7 mm
MAX3968C/DW	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	20	DIE	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		UNCASED CHIP				70 Cel	TIN LEAD	UPPER	R-XUUC-N20					Not Qualified		e0
DS2185	Analog Devices		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS					IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	TIN LEAD	DUAL	R-PDIP-T16					Not Qualified		e0
MAX3750CEE+	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.084 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	1.75 mm		3.9 mm	Not Qualified		e3	30	260	4.9 mm
MAX3120CSA+	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G8	1	1.75 mm		3.9 mm	Not Qualified		e3	30	260	4.9 mm
MAX3266CSA+	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G8	1	1.75 mm		3.9 mm	Not Qualified		e3	30	260	4.9 mm
DS2190-003	Analog Devices		COMMERCIAL	THROUGH-HOLE	42	DIP	RECTANGULAR		NO				110 mA	5 V	5	IN-LINE	DIP42,1.8	Other Telecom ICs	2.54 mm	70 Cel	TIN LEAD	DUAL	R-XDIP-T42					Not Qualified		e0
DS2153Q-A7/TR+	Analog Devices		COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS			5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQCC-J44			CEPT PCM-30/E-1		Not Qualified		e3
DS2180	Analog Devices		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel	TIN LEAD	DUAL	R-PDIP-T40			T-1(DS1)		Not Qualified		e0
DS3131+	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY			1.27 mm	70 Cel		BOTTOM	S-PBGA-B272		2.34 mm		27 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	27 mm
MAX3770CEE+	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	70 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	1.73 mm		3.9 mm	Not Qualified		e3			4.89 mm
MAX3966CEG+	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	70 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G24	1	1.73 mm		3.9 mm	Not Qualified		e3			8.65 mm
MAX3771CEE	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.73 mm		3.9 mm	Not Qualified		e0			4.89 mm
MAX3750CEE+T	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.084 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	1.75 mm		3.9 mm	Not Qualified		e3	30	260	4.9 mm
MAX3753CCM	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			.353 mA	3.3 V	3.3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP48,.35SQ	Other Telecom ICs	.5 mm	70 Cel	TIN LEAD	QUAD	S-PQFP-G48	3	1.2 mm		7 mm	Not Qualified		e0			7 mm
MAX3120CUA+	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e3	30	260	3 mm
MAX3266C/D	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	7	DIE	RECTANGULAR	UNSPECIFIED	YES	1			50 mA	3.3 V		UNCASED CHIP				70 Cel	TIN LEAD	UPPER	R-XUUC-N7	1				Not Qualified		e0
LTC4401-1ES6	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.95 mm	70 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1 mm		1.6 mm	Not Qualified		e0			2.9 mm
LTC1758-2EMS#TR	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified		e0			3 mm
LTC1957-2EMS#TRPBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified		e3		260	3 mm
LT1328CS8	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	70 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G8	1	1.752 mm		3.899 mm	Not Qualified		e0			4.9025 mm
LTC4401-2EMS8#TR	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e0			3 mm
ADSP-21MOD980N-000	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.9 V	1.9,3.3	GRID ARRAY	BGA352,26X26,50	Modems	1.27 mm	70 Cel	TIN LEAD	BOTTOM	S-PBGA-B352		2.62 mm		35 mm	Not Qualified		e0			35 mm
LTC1758-1EMS8#TR	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e0			3 mm
LTC1757-2CMS8	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		.5 mm	70 Cel		DUAL	S-PDSO-G10	1	1.17 mm		3 mm		SEATED HT-CALCULATED			245	3 mm
LTC1757A-2EMS	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.17 mm		3 mm	Not Qualified		e0			3 mm
LTM9004CV-AD#PBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	204	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		GRID ARRAY			1.27 mm	70 Cel	GOLD	BOTTOM	R-PBGA-N204		2.97 mm		15 mm	Not Qualified		e4			22 mm
LTC4401-1ES6#TRM	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.95 mm	70 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1 mm		1.6 mm	Not Qualified		e0			2.9 mm
LTC1957-1EMS8#PBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	Matte Tin (Sn)	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e3	30	260	3 mm
AD1803JRU-REEL	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Modems	.65 mm	70 Cel	TIN LEAD	DUAL	R-PDSO-G24		1.2 mm		4.4 mm	Not Qualified		e0			7.8 mm
LTC1758-1EMS8#PBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	Matte Tin (Sn)	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified		e3	30	260	3 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.