COMMERCIAL Other Function Telecom Interface ICs 971

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AMIS-52150-XTP	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.025 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	ATM/SONET/SDH ICs	.65 mm	50 Cel	0 Cel		DUAL	R-PDSO-G20		2 mm			5.3 mm	Not Qualified				7.2 mm
SX042Q	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK				70 Cel	0 Cel		QUAD	R-PQFP-G64						Not Qualified
19293-002-XTP	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	50 Cel	0 Cel		DUAL	R-PDSO-G20		2 mm			5.3 mm	Not Qualified				7.2 mm
SX041Q	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	52	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK				70 Cel	0 Cel		QUAD	R-PQFP-G52						Not Qualified
SX042J	Onsemi	TELECOM CIRCUIT	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD	S-PQCC-J68		4.57 mm			24.1808 mm	Not Qualified				24.1808 mm
AMIS-52100	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	70 Cel	0 Cel		DUAL	R-PDSO-G20		2 mm			5.3 mm	Not Qualified				7.2 mm
SX042HT	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK				70 Cel	0 Cel		QUAD	R-PQFP-G64						Not Qualified
AMIS-52000	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	50 Cel	0 Cel		DUAL	R-PDSO-G20		2 mm			5.3 mm	Not Qualified				7.2 mm
SX042HJ	Onsemi	TELECOM CIRCUIT	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD	S-PQCC-J68		4.57 mm			24.1808 mm	Not Qualified				24.1808 mm
S3526B-P	Onsemi	TELECOM CIRCUIT	COMMERCIAL							1	CMOS			10 V						70 Cel	0 Cel									Not Qualified
LA7161BM	Onsemi		COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES				48 mA	5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G16						Not Qualified
AMIS-52100-I	Onsemi		COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES				25 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Other Telecom ICs	.635 mm	50 Cel	0 Cel		DUAL	R-PDSO-G20						Not Qualified
AMIS-52150	Onsemi		COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES				25 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Other Telecom ICs	.635 mm	50 Cel	0 Cel		DUAL	R-PDSO-G20						Not Qualified
SX042T	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK				70 Cel	0 Cel		QUAD	R-PQFP-G64						Not Qualified
19293-001-XTP	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	50 Cel	0 Cel		DUAL	R-PDSO-G20		2 mm			5.3 mm	Not Qualified				7.2 mm
LA72914V-MPB-H	Onsemi		COMMERCIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR		.04 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	-20 Cel	TIN BISMUTH	DUAL	R-PDSO-G16	3					Not Qualified	e6	30	260
M7010R-066ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272		2.6 mm			27 mm	Not Qualified				27 mm
STA020DJTR	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24	3	2.65 mm			7.5 mm		e4		260	15.4 mm
STV0299B	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-10 Cel		QUAD	S-PQFP-G64		1.6 mm			10 mm	Not Qualified				10 mm
M7040N-100ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.65 V	1.65,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B388		2.46 mm			35 mm	Not Qualified	e0			35 mm
L3092FN	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	-5 V		5 V	+-5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-J28		4.57 mm			11.5062 mm	Not Qualified	e0			11.5062 mm
MTC20154TQ-C	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G64		1.6 mm			10 mm	Not Qualified				10 mm
ST5451N	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS			5 V	5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDIP-T28					15.24 mm	Not Qualified	e0			36.83 mm
EFB7332P	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		MOS		30 mA	5 V	5	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel		DUAL	R-PDIP-T16			T-1(DS1)	CEPT PCM-30/E-1		Not Qualified
STLC5465	STMicroelectronics		COMMERCIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES					5 V	5	FLATPACK	QFP160,1.2SQ	Other Telecom ICs	.635 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G160						Not Qualified	e0
M7040N-100ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.65 V	1.65,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B388		2.46 mm			35 mm	Not Qualified	e0			35 mm
M7010R-083ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272		2.6 mm			27 mm	Not Qualified				27 mm
ST75C540	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		FLATPACK, LOW PROFILE			.65 mm	70 Cel	0 Cel		QUAD	S-PQFP-G80		1.6 mm			14 mm	Not Qualified				14 mm
L3234	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	7		RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR		.003 mA	5 V	5	FLANGE MOUNT	GWZIP7H,.08,.26	Telephone Circuits		70 Cel	0 Cel		ZIG-ZAG	R-PZFM-T7						Not Qualified
STW3100	STMicroelectronics		COMMERCIAL	BALL	104	FBGA	SQUARE	PLASTIC/EPOXY	YES					2.7 V	2.7	GRID ARRAY, FINE PITCH	BGA104,12X12,20	Other Telecom ICs	.5 mm	70 Cel	-20 Cel		BOTTOM	S-PBGA-B104						Not Qualified
STLC1502D	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	HCMOS			2.5 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G208		4.1 mm			28 mm	Not Qualified	e0			28 mm
EFB7332C	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC	NO		MOS		30 mA	5 V	5	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel		DUAL	R-XDIP-T16			T-1(DS1)	CEPT PCM-30/E-1		Not Qualified
M7020R-050ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272		2.6 mm			27 mm	Not Qualified				27 mm
LB1004AC	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		1.9 mA		TIP-RING VOLTAGE	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	-20 Cel		DUAL	R-PDIP-T16						Not Qualified
L3000NT	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	15		RECTANGULAR	PLASTIC/EPOXY	NO	1		-5 V	85 mA	5 V		FLANGE MOUNT				70 Cel	0 Cel		SINGLE	R-PSFM-T15						Not Qualified
M7040N-083ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.5 V	1.5,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B388		2.46 mm			35 mm	Not Qualified	e0			35 mm
TEA7530DP	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR		.03 mA	3 V	3	IN-LINE	DIP8,.3	Telephone Circuits	2.54 mm	70 Cel	-20 Cel	TIN LEAD	DUAL	R-PDIP-T8		5.08 mm			7.62 mm	Not Qualified	e0
L3280B	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR			20 V	20	IN-LINE	DIP14,.3	Other Telecom ICs	2.54 mm	55 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T14						Not Qualified	e0
UAA4009	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR			12 V	12	IN-LINE	DIP18,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T18						Not Qualified	e0
STLC2150	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	48	VQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			2.7 V	2.7,3/3.3	CHIP CARRIER, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	70 Cel	-20 Cel		QUAD	S-XQCC-N48		1 mm			7 mm	Not Qualified	e3/e4		260	7 mm
LB1010AD	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		22 mA		3/5	IN-LINE	DIP18,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel		DUAL	R-PDIP-T18						Not Qualified
L3092N	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR	-5 V		5 V	+-5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDIP-T28					15.24 mm	Not Qualified	e0			36.83 mm
STLC5464	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		FLATPACK			.65 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G160		4.07 mm			28 mm	Not Qualified	e0			28 mm
ST5481TQF7	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48		1.6 mm			7 mm	Not Qualified	e4			7 mm
MK50H27Q33	STMicroelectronics		COMMERCIAL	J BEND	52	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS			5 V	5	CHIP CARRIER	LDCC52,.8SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	Matte Tin (Sn)	QUAD	S-PQCC-J52						Not Qualified	e3
M7020R-083ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272		2.6 mm			27 mm	Not Qualified				27 mm
M7020R-083ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B272		2.6 mm			27 mm	Not Qualified				27 mm
LS356B1	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR					IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16						Not Qualified	e0

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.