COMMERCIAL Other Function Telecom Interface ICs 971

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Hybrid	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Battery Supply (V)	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	Battery Feed	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
STLC1502P	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	HCMOS			2.5 V			FLATPACK, FINE PITCH			.5 mm	70 Cel		0 Cel		QUAD	S-PQFP-G208	4.1 mm			28 mm	Not Qualified					28 mm
FC106	STMicroelectronics		COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS			3.3 V		3.3	FLATPACK	QFP64,.51SQ,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G64					Not Qualified		e0
M7040N-066ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.5 V		1.5,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	TIN LEAD	BOTTOM	S-PBGA-B388	2.46 mm			35 mm	Not Qualified		e0			35 mm
STLC5432Q	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V		5	FLATPACK, LOW PROFILE	QFP44,.47SQ,32	Other Telecom ICs	.8 mm	70 Cel		0 Cel	TIN LEAD	QUAD	S-PQFP-G44	1.6 mm		CEPT PCM-30/E-1	10 mm	Not Qualified		e0			10 mm
TS75320CP	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	48	DIP	RECTANGULAR	PLASTIC/EPOXY	NO					5 V		5	IN-LINE	DIP48,.6	Other Telecom ICs	2.54 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T48					Not Qualified		e0
STB5701TR	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel		QUAD	S-XQCC-N32	1 mm			5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	5 mm
M7020R-066ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel		0 Cel		BOTTOM	S-PBGA-B272	2.6 mm			27 mm	Not Qualified					27 mm
STB5701	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel		QUAD	S-XQCC-N32	1 mm			5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	5 mm
FC106/14	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		3.3	FLATPACK	QFP64,.66SQ,32	Other Telecom ICs	.8 mm	70 Cel		0 Cel	TIN LEAD	QUAD	S-PQFP-G64	2.35 mm			14 mm	Not Qualified		e0			14 mm
M088F1	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		MOS		180 mA	5 V		5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T40					Not Qualified		e0
STW3101	STMicroelectronics		COMMERCIAL	BALL	104	FBGA	SQUARE	PLASTIC/EPOXY	YES					2.7 V		2.7	GRID ARRAY, FINE PITCH	BGA104,12X12,20	Other Telecom ICs	.5 mm	70 Cel		-20 Cel		BOTTOM	S-PBGA-B104					Not Qualified
M7010R-066ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel		0 Cel		BOTTOM	S-PBGA-B272	2.6 mm			27 mm	Not Qualified					27 mm
M7010R-083ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel		0 Cel		BOTTOM	S-PBGA-B272	2.6 mm			27 mm	Not Qualified					27 mm
ST75C530	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	1			150 mA	5 V			FLATPACK, LOW PROFILE			.65 mm	70 Cel		0 Cel		QUAD	S-PQFP-G80	1.6 mm			14 mm	Not Qualified					14 mm
MK2180AN	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		10 mA	5 V		5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T40			T-1(DS1)		Not Qualified		e0
M044F1	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	CERAMIC	NO		MOS			5 V		5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T28					Not Qualified		e0
GS-BT2416C1.A	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	UNSPECIFIED	51		RECTANGULAR	UNSPECIFIED	NO	1				3.3 V			MICROELECTRONIC ASSEMBLY				70 Cel		-20 Cel		UNSPECIFIED	R-XXMA-X51					Not Qualified
M7020R-050ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel		0 Cel		BOTTOM	S-PBGA-B272	2.6 mm			27 mm	Not Qualified					27 mm
L3000NSOT	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		-5 V		5 V			SMALL OUTLINE, HEAT SINK/SLUG			1.27 mm	70 Cel		0 Cel		DUAL	R-PDSO-G20	3.6 mm			11 mm	Not Qualified					15.9 mm
LB1026AA	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL								BIPOLAR		1 mA			2/15		WAFER	Other Telecom ICs		50 Cel		0 Cel								Not Qualified
M7040N-083ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.5 V		1.5,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	TIN LEAD	BOTTOM	S-PBGA-B388	2.46 mm			35 mm	Not Qualified		e0			35 mm
MK2180AQ	STMicroelectronics		COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		10 mA	5 V		5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQCC-J44			T-1(DS1)		Not Qualified		e0
L3234T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	7		RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR		.003 mA	5 V		5	FLANGE MOUNT	GWZIP7H,.08,.26	Telephone Circuits		70 Cel		0 Cel		ZIG-ZAG	R-PZFM-T7					Not Qualified
EF73321P	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		MOS		40 mA	5 V		5	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T16		T-1(DS1)	CEPT PCM-30/E-1		Not Qualified		e0
L3000NSO	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	-5 V		5 V	2-4 CONVERSION	+-5	SMALL OUTLINE, HEAT SINK/SLUG	SOP20,.56	Analog Transmission Interfaces	1.27 mm	70 Cel	-48 AND +72	0 Cel	TIN LEAD	DUAL	R-PDSO-G20	3.6 mm			11 mm	Not Qualified	RESISTIVE	e0			15.9 mm
LB1026AB	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		1 mA			2/15	IN-LINE	DIP8,.3	Other Telecom ICs	2.54 mm	50 Cel		0 Cel		DUAL	R-PDIP-T8					Not Qualified
MK50H27N33	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	48	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			5 V		5	IN-LINE	DIP48,.6	Other Telecom ICs	2.54 mm	70 Cel		0 Cel	Matte Tin (Sn)	DUAL	R-PDIP-T48					Not Qualified		e3
L3030	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	-5 V	85 mA	5 V	2-4 CONVERSION	+-5	CHIP CARRIER	LDCC44,.7SQ	Analog Transmission Interfaces	1.27 mm	70 Cel	-48 TO 72	0 Cel	TIN LEAD	QUAD	S-PQCC-J44	4.57 mm			16.5862 mm	Not Qualified	CONSTANT CURRENT/RESISTIVE	e0			16.5862 mm
FC106/10	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		3.3	FLATPACK, FINE PITCH	QFP64,.51SQ,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel	TIN LEAD	QUAD	S-PQFP-G64	2.45 mm			10 mm	Not Qualified		e0			10 mm
LB1006AB	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		.9 mA			TIP-RING VOLTAGE	IN-LINE	DIP8,.3	Other Telecom ICs	2.54 mm	70 Cel		-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T8					Not Qualified		e0
EF73321C	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC	NO		MOS		40 mA	5 V		5	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T16		T-1(DS1)	CEPT PCM-30/E-1		Not Qualified		e0
MK5027P	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	48	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			5 V		5	IN-LINE	DIP48,.6	Other Telecom ICs	2.54 mm	70 Cel		0 Cel	Matte Tin (Sn)	DUAL	R-PDIP-T48					Not Qualified		e3
L3092FNT	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		-5 V		5 V			CHIP CARRIER			1.27 mm	70 Cel		0 Cel		QUAD	S-PQCC-J28	4.57 mm			11.5062 mm	Not Qualified					11.5062 mm
L3000N	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	15		RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR	-5 V	85 mA	5 V	2-4 CONVERSION	+-5	FLANGE MOUNT	SIP15,.1	Analog Transmission Interfaces	2.54 mm	70 Cel	-48 AND +72	0 Cel	TIN LEAD	SINGLE	R-PSFM-T15					Not Qualified	RESISTIVE	e0
L3092NT	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		-5 V		5 V			IN-LINE			2.54 mm	70 Cel		0 Cel		DUAL	R-PDIP-T28				15.24 mm	Not Qualified					36.83 mm
M7020R-066ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel		0 Cel		BOTTOM	S-PBGA-B272	2.6 mm			27 mm	Not Qualified					27 mm
TEA7530FP	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.03 mA	3 V		3	SMALL OUTLINE	DIP8,.3	Telephone Circuits	1.27 mm	70 Cel		-20 Cel	TIN LEAD	DUAL	R-PDSO-G8	1.75 mm			3.9 mm	Not Qualified		e0			4.9 mm
M7040N-066ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.5 V		1.5,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	TIN LEAD	BOTTOM	S-PBGA-B388	2.46 mm			35 mm	Not Qualified		e0			35 mm
STLC1502	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V			FLATPACK, FINE PITCH			.5 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G208	4.1 mm			28 mm	Not Qualified		e4			28 mm
935263520557	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V			FLATPACK			.65 mm	70 Cel		0 Cel		QUAD	R-PQFP-G100	3.2 mm			14 mm	Not Qualified					20 mm
BGB100	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL							1				3 V							55 Cel		-10 Cel								Not Qualified
NE5900N	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		4 mA	5 V			IN-LINE			2.54 mm	70 Cel		0 Cel		DUAL	R-PDIP-T16	4.2 mm			7.62 mm	Not Qualified					19.025 mm
NE5224D	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V			SMALL OUTLINE			1.27 mm	70 Cel		0 Cel		DUAL	R-PDSO-G16	1.75 mm			3.9 mm	Not Qualified					9.9 mm
NE5217D-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			13.3 mA	5 V			SMALL OUTLINE			1.27 mm	70 Cel		0 Cel		DUAL	R-PDSO-G20	2.65 mm			7.5 mm	Not Qualified					12.8 mm
NE575AN	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				5 V			IN-LINE				70 Cel		0 Cel		DUAL	R-PDIP-T20					Not Qualified
TDA8050A	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	0 V		5 V		5	SMALL OUTLINE	SOP32,.4	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G32					Not Qualified		e4
PCA1070P	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		.0001 mA	5 V		3/5	IN-LINE	DIP24,.6	Telephone Circuits	2.54 mm	60 Cel		-10 Cel		DUAL	R-PDIP-T24					Not Qualified
TDA8044AH/C2	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V			FLATPACK			.65 mm	70 Cel		0 Cel		QUAD	R-PQFP-G100	3.2 mm			14 mm	Not Qualified					20 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.