COMMERCIAL Other Function Telecom Interface ICs 971

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TDA5660X	Infineon Technologies		COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR	40 mA	11 V	11	SMALL OUTLINE	SOP20,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G20				Not Qualified	e0
CYW20733A3KML1G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	70 Cel	0 Cel		QUAD		S-XQCC-N56		1 mm	7 mm					7 mm
CYW20735KFBG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	111	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B111		.97 mm	9 mm					9 mm
CY7B933-SXCT	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	.155 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL	400 Mbps	R-PDSO-G28	3	2.67 mm	7.505 mm	Not Qualified	e4	30	260	17.905 mm
CYW20730A1KML2G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N32		1 mm	5 mm					5 mm
CYW20738A1KFBG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B64		1 mm	7 mm					7 mm
CYW43143KMLG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	65 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N56	3	.9 mm	7 mm		e4	30	260	7 mm
CY7B933-400JXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	.155 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified	e3	20	260	11.5316 mm
CYW20733A3KFB2G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	121	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B121		1.1 mm	9 mm					9 mm
CYW20730A1KMLG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N40		1 mm	6 mm					6 mm
CY7B9233-270JC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		BICMOS	160 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J28				Not Qualified	e0
CYW20730A2KML2G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N32		1 mm	5 mm					5 mm
CYW20738A2KML3G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N40		1 mm	6 mm					6 mm
CY7B923-400JXCT	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	.085 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified	e3	20	260	11.5316 mm
CYW43143KMLGT	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	65 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N56	3	.9 mm	7 mm		e4	30	260	7 mm
CY7B933-400JXCT	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	.155 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified	e3	20	260	11.5316 mm
CYW20730A1KFBG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B64		1 mm	7 mm					7 mm
CYW20730A2KFBG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B64		1 mm	7 mm					7 mm
CYW20730A2KMLG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N40		1 mm	6 mm					6 mm
CYW20733A3KFB1G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	81	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B81		1.1 mm	8 mm					8 mm
CY7B9233-400JC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		BICMOS	160 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J28				Not Qualified	e0
CYW20735PKML1G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	60	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	70 Cel	0 Cel		QUAD		S-XQCC-N60		.9 mm	7 mm					7 mm
PT8A983W	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES				3.3 V	3.3	SMALL OUTLINE	SO18(UNSPEC)	Other Telecom ICs		70 Cel	0 Cel		DUAL		R-PDSO-G18				Not Qualified
PI3EQX1002B1ZLEX	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	30	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	70 Cel	0 Cel		QUAD		R-XQCC-N30		.8 mm	2.5 mm			30	260	4.5 mm
PT8A985S	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES				5 V	5	SMALL OUTLINE	SOP20(UNSPEC)	Other Telecom ICs		70 Cel	0 Cel		DUAL		R-PDSO-G20				Not Qualified
PT8A978BP	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO				4 V	4	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel		DUAL		R-PDIP-T16				Not Qualified
PT8A985P	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO				5 V	5	IN-LINE	DIP20(UNSPEC)	Other Telecom ICs		70 Cel	0 Cel		DUAL		R-PDIP-T20				Not Qualified
PT8A9792W	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS		3 V	3	SMALL OUTLINE	SOP16(UNSPEC)	Other Telecom ICs		55 Cel	-10 Cel		DUAL		R-PDSO-G16				Not Qualified
PT8A986P	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO				5 V	5	IN-LINE	DIP24(UNSPEC)	Other Telecom ICs		70 Cel	0 Cel		DUAL		R-PDIP-T24				Not Qualified
PT8A9792P	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		3 V	3	IN-LINE	DIP16(UNSPEC)	Other Telecom ICs		55 Cel	-10 Cel		DUAL		R-PDIP-T16				Not Qualified
PT8A991AP	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		4 V	4	IN-LINE	DIP24(UNSPEC)	Other Telecom ICs		70 Cel	0 Cel		DUAL		R-PDIP-T24				Not Qualified
PT8A986S	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES				5 V	5	SMALL OUTLINE	SOP24(UNSPEC)	Other Telecom ICs		70 Cel	0 Cel		DUAL		R-PDSO-G24				Not Qualified
PI3EQX1004B1ZHEX	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	42	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD		R-XQCC-N42		.84 mm	3.5 mm					9 mm
WN6612LH-L5	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	52		RECTANGULAR	UNSPECIFIED	NO	1	CMOS		3.3 V		MICROELECTRONIC ASSEMBLY				70 Cel	0 Cel		ZIG-ZAG		R-XZMA-N52			26.8 mm			NOT SPECIFIED	NOT SPECIFIED	30 mm
PI2EQX4401DZFE	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	36	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD		R-XQCC-N36	1	.8 mm	5 mm	Not Qualified	e3			6 mm
PI2EQX4401DZFEX	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	36	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD		R-XQCC-N36	1	.8 mm	5 mm	Not Qualified	e3			6 mm
PI2EQX4402DNBEX	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	BALL	84	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B84	3	1.46 mm	9 mm	Not Qualified	e1			9 mm
PI2EQX4432DZDE	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-XQCC-N48		.84 mm	7 mm	Not Qualified	e3			7 mm
PI2EQX4432DZDEX	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-XQCC-N48		.84 mm	7 mm	Not Qualified	e3			7 mm
MAX3774CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G16		1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3968CEP	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.04 mA	3.3 V	3.3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.25	ATM/SONET/SDH ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G20	1	1.75 mm	3.9 mm	Not Qualified	e0			8.65 mm
MAX3269CUB-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.078 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn85Pb15)	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e0	20	240	3 mm
DS21372T+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, THIN PROFILE			.8 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX3772CEE+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.195 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e3	30	260	4.89 mm
MAX3120CUA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
MAX3770CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	70 Cel	0 Cel		DUAL		R-PDSO-G16		1.73 mm	3.9 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4.89 mm
MAX3765CUB	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.09 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e0	20	240	3 mm
MAX3265CUE+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.