COMMERCIAL Other Function Telecom Interface ICs 971

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

DS4000GW/WBGA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000CW/WBGA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

MAX3264CUE-T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

16

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.062 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

ATM/SONET/SDH ICs

.65 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e0

5 mm

DS4000G0/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

MAX3120CUA-T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

70 Cel

0 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

3 mm

MAX3968CEP-T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.04 mA

3.3 V

3.3/5

SMALL OUTLINE, SHRINK PITCH

SSOP20,.25

ATM/SONET/SDH ICs

.635 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G20

1

1.75 mm

3.9 mm

Not Qualified

e0

8.65 mm

MAX3964C/DW

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

20

DIE

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

UNCASED CHIP

70 Cel

0 Cel

TIN LEAD

UPPER

R-XUUC-N20

Not Qualified

e0

DS2291

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

30

SIMM

RECTANGULAR

UNSPECIFIED

NO

1

HYBRID

.05 mA

5 V

5

MICROELECTRONIC ASSEMBLY

SIM30,.2

ATM/SONET/SDH ICs

2.54 mm

70 Cel

0 Cel

TIN LEAD

SINGLE

R-XSMA-N30

Not Qualified

e0

MAX3265CUB

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.076 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

TIN LEAD

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e0

20

240

3 mm

MAX3968CEP+

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

70 Cel

0 Cel

TIN

DUAL

R-PDSO-G20

1

1.73 mm

3.9 mm

Not Qualified

e3

8.65 mm

DS4000

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

MAX3750CEE-T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

16

HSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.084 mA

3.3 V

3.3

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

SSOP16,.25

Other Telecom ICs

.635 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G16

1

1.75 mm

3.9 mm

Not Qualified

e0

4.9 mm

MAX3965C/DW

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

20

DIE

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

UNCASED CHIP

70 Cel

0 Cel

TIN LEAD

UPPER

R-XUUC-N20

Not Qualified

e0

MAX3262C/D

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

24

DIE

RECTANGULAR

UNSPECIFIED

YES

1

60 mA

5 V

UNCASED CHIP

70 Cel

0 Cel

TIN LEAD

UPPER

R-XUUC-N24

1

Not Qualified

e0

DS2174Q+T&R

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

.06 mA

3.3 V

3.3

CHIP CARRIER

LDCC44,.7SQ

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQCC-J44

3

4.57 mm

16.585 mm

Not Qualified

e3

16.585 mm

DS2174Q/T&R+

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

.06 mA

3.3 V

3.3

CHIP CARRIER

LDCC44,.7SQ

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQCC-J44

3

4.57 mm

16.5862 mm

Not Qualified

e3

16.5862 mm

MAX3964CEP

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.04 mA

3.3 V

3.3/5

SMALL OUTLINE, SHRINK PITCH

SSOP20,.25

ATM/SONET/SDH ICs

.635 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G20

1

1.73 mm

3.9 mm

Not Qualified

e0

8.65 mm

MAX3768CUB

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.062 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

TIN LEAD

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e0

20

240

3 mm

DS31256+

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

MATTE TIN

BOTTOM

S-PBGA-B256

3

2.54 mm

27 mm

Not Qualified

e3

27 mm

DS4000G0/WBGA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

MAX3774CEE

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

16

HLSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.164 mA

3.3 V

3.3

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

SSOP16,.25

Other Telecom ICs

.635 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G16

1

1.65 mm

3.9 mm

Not Qualified

e0

4.89 mm

DS4000D0/WBGA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

MAX3268C/D

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

16

DIE

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

UNCASED CHIP

70 Cel

0 Cel

TIN LEAD

UPPER

R-XUUC-N16

1

Not Qualified

e0

MAX3120CSA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e0

4.9 mm

DS2172T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

5

FLATPACK, THIN PROFILE

TQFP32,.35SQ,32

Other Telecom ICs

.8 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

1.2 mm

7 mm

Not Qualified

e0

7 mm

MAX3964C/D

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

20

DIE

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

UNCASED CHIP

70 Cel

0 Cel

TIN LEAD

UPPER

R-XUUC-N20

Not Qualified

e0

MAX3267CSA-T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e0

4.9 mm

MAX3264CUE+

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

16

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.062 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

ATM/SONET/SDH ICs

.65 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

5 mm

DS4000EC/WBGA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

MAX3773CEE+

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

16

HLSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.195 mA

3.3 V

3.3

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

SSOP16,.25

Other Telecom ICs

.635 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

1.65 mm

3.9 mm

Not Qualified

e3

30

260

4.89 mm

MAX3968C/D

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

20

DIE

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

UNCASED CHIP

70 Cel

0 Cel

TIN LEAD

UPPER

R-XUUC-N20

1

Not Qualified

e0

DS31256

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B256

3

2.54 mm

27 mm

Not Qualified

e0

27 mm

MAX3965C/D

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

20

DIE

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

UNCASED CHIP

70 Cel

0 Cel

TIN LEAD

UPPER

R-XUUC-N20

1

Not Qualified

e0

MAX3269CUB

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.078 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

Tin/Lead (Sn85Pb15)

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e0

20

240

3 mm

MAX3755CCM

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

48

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.411 mA

3.3 V

3.3

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP48,.35SQ

Other Telecom ICs

.5 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G48

3

1.2 mm

7 mm

Not Qualified

e0

7 mm

DS2172T+

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

5

FLATPACK, THIN PROFILE

TQFP32,.35SQ,32

Other Telecom ICs

.8 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G32

1

1.2 mm

7 mm

Not Qualified

e3

30

260

7 mm

MAX3755CCM+

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

48

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G48

1

1.2 mm

7 mm

Not Qualified

e3

30

255

7 mm

MAX3755CCM-T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

48

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G48

3

1.2 mm

7 mm

Not Qualified

e0

7 mm

MAX3269C/D

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

16

DIE

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

UNCASED CHIP

70 Cel

0 Cel

TIN LEAD

UPPER

R-XUUC-N16

1

Not Qualified

e0

MAX3966CEG-T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

24

HSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

.635 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G24

1

1.73 mm

3.9 mm

Not Qualified

e0

8.65 mm

DS2172

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

32

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

5

FLATPACK, THIN PROFILE

TQFP32,.35SQ,32

Other Telecom ICs

.8 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

1.2 mm

7 mm

Not Qualified

e0

7 mm

DS2181Q

Maxim Integrated

COMMERCIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

CMOS

5 V

5

CHIP CARRIER

LDCC44,.7SQ

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQCC-J44

CEPT PCM-30/E-1

Not Qualified

e0

MAX3773CEE+T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

16

HLSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

.635 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

1.65 mm

3.9 mm

Not Qualified

e3

30

260

4.89 mm

MAX3262CAG

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

60 mA

5 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP24,.3

ATM/SONET/SDH ICs

.65 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G24

1

1.99 mm

5.29 mm

Not Qualified

e0

8.2 mm

MAX3966CEG

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

24

HSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

.635 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G24

1

1.73 mm

3.9 mm

Not Qualified

e0

8.65 mm

MAX3265CUB-T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

10

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.076 mA

3.3 V

3.3/5

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

ATM/SONET/SDH ICs

.5 mm

70 Cel

0 Cel

Tin/Lead (Sn85Pb15)

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

Not Qualified

e0

20

240

3 mm

DS4000KI/WBGA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

MAX3775CEE-T

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

16

HLSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

.635 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G16

1

1.65 mm

3.9 mm

Not Qualified

e0

4.89 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.