COMMERCIAL Other Function Telecom Interface ICs 971

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3768CUB+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.062 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX3773CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.195 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3965CEP+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G20	1	1.73 mm	3.9 mm	Not Qualified	e3			8.65 mm
MAX3265CUE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0			5 mm
MAX3963CSA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.02 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
MAX3267CSA+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
MAX3266CSA-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
MAX3765CUB+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
DS31256B	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		2.54 mm	27 mm	Not Qualified	e0			27 mm
MAX3267CSA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.05 mA	3.3 V	3/5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
MAX3775CEE+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	0 Cel		DUAL	R-PDSO-G16		1.65 mm	3.9 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4.89 mm
DS21372T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, THIN PROFILE			.8 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
MAX3265CUB+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX3268CUB+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.062 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
DS4000KI/WBGA-W	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	R-PBGA-B24		3.31 mm	9 mm	Not Qualified	e0			11 mm
DS2291/87-22291-000	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	NO	1			5 V		MICROELECTRONIC ASSEMBLY				70 Cel	0 Cel	TIN LEAD	SINGLE	R-XSMA-N30				Not Qualified	e0
MAX3772CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3267CSA+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3			4.9 mm
MAX3752CCM-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified	e0			7 mm
MAX3765CUB-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e0	20	240	3 mm
DS4000A0/WBGA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	R-PBGA-B24		3.31 mm	9 mm	Not Qualified	e0			11 mm
MAX3965CEP	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.04 mA	3.3 V	3.3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.25	ATM/SONET/SDH ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.73 mm	3.9 mm	Not Qualified	e0			8.65 mm
MAX3120CSA-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
DS4000GF/WBGA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	R-PBGA-B24		3.31 mm	9 mm	Not Qualified	e0	20	240	11 mm
DS3131	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		2.34 mm	27 mm	Not Qualified	e0			27 mm
DS4000A0N/WBGA-W	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	R-PBGA-B24		3.31 mm	9 mm	Not Qualified	e0			11 mm
MAX3264CUE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.062 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0			5 mm
MAX2101	Maxim Integrated		COMMERCIAL	GULL WING	100	QFP		METAL	YES		BIPOLAR		5 V	5	FLATPACK	QFP100(UNSPEC)	Other Telecom ICs		70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD					Not Qualified	e0
MAX2105CWI-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	2.65 mm	7.5 mm	Not Qualified	e0			17.9 mm
MAX2980CCB	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Modems	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified	e0			10 mm
MAX2430CSE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified	e0			9.9 mm
MAX5935CAX	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE, SHRINK PITCH			.8 mm	70 Cel	0 Cel		DUAL	R-PDSO-G36		2.65 mm	7.5 mm			NOT SPECIFIED	NOT SPECIFIED	15.375 mm
MAX2117CTI+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N28	1	.8 mm	5 mm		e3	30	260	5 mm
MAX5935CAX+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE, SHRINK PITCH			.8 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G36	1	2.65 mm	7.5 mm		e3	30	260	15.375 mm
MAX2105CWI	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	2.65 mm	7.5 mm	Not Qualified	e0		245	17.9 mm
MAX2105CWI+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	2.65 mm	7.5 mm	Not Qualified	e3	30	260	17.9 mm
MAX5935CAX+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE, SHRINK PITCH			.8 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G36	1	2.65 mm	7.5 mm		e3	30	260	15.375 mm
MAX2117CTI+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	28	QCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V		CHIP CARRIER			.75 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N28	1		5 mm		e3	30	260	5 mm
MAX5935CAX-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE, SHRINK PITCH			.8 mm	70 Cel	0 Cel		DUAL	R-PDSO-G36		2.65 mm	7.5 mm			20	240	15.375 mm
MAX2105CWI+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	TIN	DUAL	R-PDSO-G28	1	2.65 mm	7.5 mm	Not Qualified	e3			17.9 mm
TA1243BF	Toshiba		COMMERCIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR	83.5 mA		5,33	SMALL OUTLINE, SHRINK PITCH	SOP24,.3,40	Other Telecom ICs	1 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G24				Not Qualified
TA1372FNG	Toshiba		COMMERCIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR	51 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G16				Not Qualified
TB32301AFL	Toshiba	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	36	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	.042 mA	3 V	3	CHIP CARRIER, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	70 Cel	-20 Cel	TIN LEAD	QUAD	S-PQCC-N36		.9 mm	6.21 mm	Not Qualified	e0			6.21 mm
TA1243BFN	Toshiba		COMMERCIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR	83.5 mA		5,33	SMALL OUTLINE, SHRINK PITCH	SSOP24,.3	Other Telecom ICs	.635 mm	70 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G24				Not Qualified	e0
92HD92B2X5NLGXYYX8	Renesas Electronics	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	1 mm	7 mm		e3			7 mm
ISL35822IK	Renesas Electronics	TELECOM CIRCUIT	COMMERCIAL	BALL	192	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.5 V	1.2,1.5,2.5	GRID ARRAY, LOW PROFILE	BGA192,16X16,40	ATM/SONET/SDH ICs	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B192	3		17 mm	Not Qualified	e0			17 mm
UPD43501R	Renesas Electronics		COMMERCIAL	PIN/PEG	132	PGA	SQUARE	CERAMIC	NO		CMOS				GRID ARRAY	PGA132,14X14	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	PERPENDICULAR	S-XPGA-P132				Not Qualified	e0
HKT100XXXU	Renesas Electronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING		SOP	RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE	SOP(UNSPEC)	Other Telecom ICs		40 Cel	0 Cel		DUAL					Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.