COMMERCIAL Other Function Telecom Interface ICs 971

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	ISDN Access Rate	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Output High Voltage	Maximum Output Low Voltage	Standard	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Reference Point	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	Maximum Output Low Current	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PEB2045-NVA3	Infineon Technologies		COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		5 V	5		CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel				0 Cel	TIN LEAD	QUAD		S-PQCC-J44		1					Not Qualified		e0		220
DM207	Infineon Technologies		COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES				3 V	3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.635 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G24							Not Qualified		e0
PEB2055-P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS	9.5 mA	5 V	5		IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T40							Not Qualified		e0
PEB2056-C	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	CERAMIC	NO		CMOS					IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T28							Not Qualified		e0
PEB2056-N	Infineon Technologies		COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS					CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J44							Not Qualified		e0
PEB80900F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				0 Cel		QUAD		S-PQFP-G64			1.6 mm			10 mm	Not Qualified					10 mm
PSF2115H	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V			FLATPACK			.8 mm	70 Cel				0 Cel		QUAD		S-PQFP-G64			2.45 mm			14 mm	Not Qualified					14 mm
PSB2110-P	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		5 V	5		IN-LINE	DIP40,.6	Digital Transmission Interfaces	2.54 mm	70 Cel	4.5 V	.45 V	CCITT I.411	0 Cel	TIN LEAD	DUAL	.064 Mbps	R-PDIP-T40	R		5.1 mm			15.24 mm	Not Qualified	7 Amp	e0			50.9 mm
PEB2075C	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	CERAMIC	NO		CMOS	10 mA	5 V	5		IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T28							Not Qualified		e0
V23809-E1-E30	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	FLAT	51		RECTANGULAR	UNSPECIFIED	YES	1	CMOS		5 V			MICROELECTRONIC ASSEMBLY				70 Cel				0 Cel		UNSPECIFIED		R-XXMA-F51							Not Qualified
PMB2220	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V	3.3/5		SMALL OUTLINE	SSOP20,.3	Other Telecom ICs	.635 mm	55 Cel				-10 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G20							Not Qualified		e0
IRM6000	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	UNSPECIFIED	8		RECTANGULAR	UNSPECIFIED	NO	1	BICMOS					MICROELECTRONIC ASSEMBLY				70 Cel				0 Cel	TIN LEAD	SINGLE		R-XSMA-X8							Not Qualified		e0
PEB8191H	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	BASIC	FLATPACK	QFP64,.66SQ,32	Digital Transmission Interfaces	.8 mm	70 Cel	2.4 V	.45 V	ANSI T1.601	0 Cel	TIN LEAD	QUAD	.192 Mbps	S-PQFP-G64	S/T TO U (NT-1)						Not Qualified	7 Amp	e0
PSB21381	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3/5		FLATPACK	QFP44,.5SQ,32	Other Telecom ICs	.8 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G44			2.45 mm			10 mm	Not Qualified		e0			10 mm
PSB4860	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V			FLATPACK			.65 mm	70 Cel				0 Cel	TIN LEAD	QUAD		S-PQFP-G80			2.45 mm			14 mm	Not Qualified		e0			14 mm
PEB2045C	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		CMOS	10 mA	5 V	5		IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T40							Not Qualified		e0
PEB8191F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	BASIC	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Digital Transmission Interfaces	.5 mm	70 Cel	2.4 V	.45 V	ANSI T1.601	0 Cel	TIN LEAD	QUAD	.192 Mbps	S-PQFP-G64	S/T TO U (NT-1)		1.6 mm			10 mm	Not Qualified	7 Amp	e0			10 mm
PEB2235-C	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	CERAMIC	NO		CMOS	220 mA	5 V	5		IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T28				T-1(DS1)	CEPT PCM-30/E-1		Not Qualified		e0
PEB2046C	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		CMOS	10 mA	5 V	5		IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T40							Not Qualified		e0
PSF2115F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				0 Cel		QUAD		S-PQFP-G64			1.6 mm			10 mm	Not Qualified					10 mm
PEB2055A2N	Infineon Technologies		COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		5 V	5		CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J44							Not Qualified		e0
PEB2235A2P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		5 V	5		IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T28				T-1(DS1)	CEPT PCM-30/E-1		Not Qualified		e0
PEB2070-C	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	CERAMIC	NO		CMOS					IN-LINE	DIP24,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T24							Not Qualified		e0
Q67037-A4	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		5 V			CHIP CARRIER, VERY THIN PROFILE			.5 mm	70 Cel				-20 Cel		QUAD		S-PQCC-N48			.9 mm			7 mm	Not Qualified					7 mm
PSB7115F	Infineon Technologies		COMMERCIAL	GULL WING	144	QFP	SQUARE	PLASTIC/EPOXY	YES		CMOS	.153 mA		3.3,5		FLATPACK	QFP144,.87SQ,20	Other Telecom ICs	.5 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G144							Not Qualified		e0
PEB2025-N	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V	5,-12/-60		CHIP CARRIER	LDCC28,.4X.6	Digital Transmission Interfaces	1.27 mm	70 Cel	2.4 V	.45 V	CCITT I.430	0 Cel	TIN LEAD	QUAD		R-PQCC-J28	S		3.8 mm			8.95 mm	Not Qualified	2 Amp	e0			14.05 mm
PSB4595	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V	4.25,5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Modems	.65 mm	70 Cel				0 Cel	TIN LEAD	DUAL		R-PDSO-G24			1.2 mm			4.4 mm	Not Qualified		e0			7.8 mm
PEB2070B1N	Infineon Technologies		COMMERCIAL	J BEND	28	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS					CHIP CARRIER	LDCC28,.4X.6	Other Telecom ICs	1.27 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	QUAD		R-PQCC-J28							Not Qualified		e0
PSB21393HV1.3	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V			FLATPACK			.8 mm	70 Cel				0 Cel		QUAD		S-PQFP-G44		3	2.45 mm			10 mm					260	10 mm
PSB6620	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR	22 mA		TIP-RING/8.8/26		IN-LINE	DIP8,.3	Other Telecom ICs	2.54 mm	70 Cel				-20 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T8							Not Qualified		e0
PSB2115H	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	BASIC	FLATPACK	QFP64,.66SQ,32	Digital Transmission Interfaces	.8 mm	70 Cel	2.4 V	.45 V	CCITT I.430	0 Cel	TIN LEAD	QUAD	.192 Mbps	S-PQFP-G64	S/T		2.45 mm			14 mm	Not Qualified	7 Amp	e0			14 mm
PSB21382	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3/5		FLATPACK	QFP64,.66SQ,32	Other Telecom ICs	.8 mm	70 Cel				0 Cel		QUAD		S-PQFP-G64			2.45 mm			14 mm	Not Qualified					14 mm
PSB21383	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3/5		FLATPACK	QFP44,.5SQ,32	Other Telecom ICs	.8 mm	70 Cel				0 Cel		QUAD		S-PQFP-G44			2.45 mm			10 mm	Not Qualified					10 mm
BCM20733A3KFB2G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	121	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V			GRID ARRAY, THIN PROFILE, FINE PITCH			.8 mm	70 Cel				0 Cel		BOTTOM		S-PBGA-B121			1.1 mm			9 mm						9 mm
BCM43236BKMLG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	88	VQCCN	SQUARE	UNSPECIFIED	YES	1			1.2 V			CHIP CARRIER, VERY THIN PROFILE			.4 mm	65 Cel				0 Cel		QUAD		S-XQCC-N88			.9 mm			10 mm						10 mm
BCM43236KMLG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.2 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	65 Cel				0 Cel		QUAD		S-XQCC-N88			.9 mm			10 mm						10 mm
BCM20730A2KMLG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.2 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel				0 Cel		QUAD		S-XQCC-N40			1 mm			6 mm						6 mm
CYV15G0204TRB-BGXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V			GRID ARRAY			1.27 mm	70 Cel				0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256		3	1.745 mm			27 mm	Not Qualified		e1	20	260	27 mm
CYV15G0104TRB-BGXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V			GRID ARRAY			1.27 mm	70 Cel				0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256		3	1.745 mm			27 mm	Not Qualified		e1	20	260	27 mm
BCM20738A1KFBG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.8 mm	70 Cel				0 Cel		BOTTOM		S-PBGA-B64			1 mm			7 mm						7 mm
CYV15G0203TB-BGXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V			GRID ARRAY			1.27 mm	70 Cel				0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256		3	1.745 mm			27 mm	Not Qualified		e1	20	260	27 mm
BCM20730A1KFBG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.8 mm	70 Cel				0 Cel		BOTTOM		S-PBGA-B64			1 mm			7 mm						7 mm
SLB9635TT1.2	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel				0 Cel		DUAL		R-PDSO-G28			1.2 mm			4.4 mm						9.7 mm
SLB9635TT1.2F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel				0 Cel		DUAL		R-PDSO-G28			1.2 mm			4.4 mm						9.7 mm
SDA6310	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		12 V	12		IN-LINE	DIP20,.3	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T20							Not Qualified		e0
TDA5660P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR	40 mA	11 V	11		IN-LINE	DIP18,.3	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T18							Not Qualified		e0
TDA5664	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR	29 mA	5 V	5		IN-LINE	DIP14,.3	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T14							Not Qualified		e0
TDA5664-X	Infineon Technologies		COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR	29 mA	5 V	5		SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G14							Not Qualified		e0

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.