COMMERCIAL Other Function Telecom Interface ICs 971

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Output Code	No. of Channels	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
RTL8152BN-VB-CG	Realtek Semiconductor	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1							1.05 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	70 Cel		0 Cel		QUAD		S-XQCC-N48			1 mm	6 mm							6 mm
CYG2021	IXYS Corporation		COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO				HYBRID			9 mA	5 V	5	IN-LINE	DIP18(UNSPEC)	Other Telecom ICs		70 Cel		0 Cel		DUAL		R-PDIP-T18					Not Qualified
CYW20734UA1KFFB3G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	90	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS				3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.8 mm	70 Cel		0 Cel		BOTTOM		R-PBGA-B90			1.2 mm	8.5 mm							8.5 mm
CY7B923-SXCT	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BICMOS			.085 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	DUAL	400 Mbps	R-PDSO-G28		3	2.67 mm	7.505 mm	Not Qualified			e4	30	260	17.905 mm
XR2211ACD-F	Exar	TELECOM CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BIPOLAR			.009 mA	12 V	12	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	MATTE TIN	DUAL		R-PDSO-G14		2	1.75 mm	3.9 mm	Not Qualified			e3			8.65 mm
AD630KN/+	Analog Devices		COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO				BIPOLAR		-15 V	.005 mA	15 V	+-15	IN-LINE	DIP20,.3	Other Telecom ICs	2.54 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T20								e0
BM78SPPS5MC2-0004AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1							1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel		-20 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N33			2.46 mm	12 mm				e4	40	255	22 mm
XR2211ACDTR-F	Exar	TELECOM CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BIPOLAR				12 V		SMALL OUTLINE			1.27 mm	70 Cel		0 Cel	MATTE TIN	DUAL		R-PDSO-G14		2	1.75 mm	3.9 mm	Not Qualified			e3			8.65 mm
BM78SPP05MC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED	YES	1							1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,30LEAD(UNSPEC)		1.1 mm	70 Cel		-20 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N30			1.86 mm	12 mm				e4	40	255	15 mm
CY7B923-400JXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS			.085 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28		3	4.572 mm	11.5316 mm	Not Qualified			e3	20	260	11.5316 mm
CY7C924ADX-AXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS			.25 mA	5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel	MATTE TIN	QUAD		S-PQFP-G100		3	1.6 mm	14 mm	Not Qualified			e3	30	260	14 mm
PI3EQX1001XUAEX	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	18	HVQCCN	SQUARE	UNSPECIFIED	YES	1							3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	70 Cel		0 Cel		QUAD		S-XQCC-N18			.4 mm	2 mm					NOT SPECIFIED	NOT SPECIFIED	2 mm
PI3EQX1004ZHEX	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	42	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1							3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel		0 Cel		QUAD		R-XQCC-N42			.84 mm	3.5 mm					NOT SPECIFIED	NOT SPECIFIED	9 mm
RTL8139DL-LF	Realtek Semiconductor	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS				2.5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		0 Cel		QUAD		S-PQFP-G100			1.7 mm	14 mm					NOT SPECIFIED	NOT SPECIFIED	14 mm
BM23SPKS1NB9-0001AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	43	XMA	RECTANGULAR	UNSPECIFIED	YES	1							3.7 V		MICROELECTRONIC ASSEMBLY	MODULE,43LEAD(UNSPEC)		1.2 mm	70 Cel		-20 Cel		UNSPECIFIED		R-XXMA-N43			1.9 mm	15 mm							29 mm
MLX90109CDC-AAA-000-TU	Melexis N V	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							5 V		SMALL OUTLINE			1.27 mm	70 Cel		0 Cel	MATTE TIN	DUAL		R-PDSO-G8		1	1.72 mm	3.9 mm				e3		260	4.9 mm
RTL8139DL	Realtek Semiconductor	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS				2.5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		0 Cel		QUAD		S-PQFP-G100			1.7 mm	14 mm					NOT SPECIFIED	NOT SPECIFIED	14 mm
RTL8139DL-GR	Realtek Semiconductor	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS				2.5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		0 Cel		QUAD		S-PQFP-G100			1.7 mm	14 mm					NOT SPECIFIED	NOT SPECIFIED	14 mm
AFE4300PNR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BINARY/TWOS COMP	2				.00097 mA	3.3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Codecs	.5 mm	70 Cel	16	0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G80	VOLTAGE	3	1.6 mm	12 mm	Not Qualified	DIFFERENTIAL	3.4 V	e4	30	260	12 mm
MLX90109CDC-AAA-000-RE	Melexis N V	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							5 V		SMALL OUTLINE			1.27 mm	70 Cel		0 Cel	MATTE TIN	DUAL		R-PDSO-G8		1	1.72 mm	3.9 mm				e3		260	4.9 mm
SI32391-B-FM	Silicon Labs	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1							3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel		0 Cel		QUAD		S-XQCC-N48			.9 mm	7 mm					NOT SPECIFIED	NOT SPECIFIED	7 mm
CY7B933-JXCT	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS			.155 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28		3	4.572 mm	11.5316 mm	Not Qualified			e3	20	260	11.5316 mm
CYRF7936-40LFXC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1							2.4 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel	MATTE TIN	QUAD		S-XQCC-N40		3	1 mm	6 mm	Not Qualified			e3	20	260	6 mm
TLK2711JRGQE	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1							2.5 V	2.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,9X9,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel		BOTTOM		S-PBGA-B80			1 mm	5 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	5 mm
TLK2711JRZQE	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1							2.5 V	2.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,9X9,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B80		3	1 mm	5 mm	Not Qualified			e1	30	260	5 mm
UCC3750DWG4	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BICMOS				5 V		SMALL OUTLINE			1.27 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28		2	2.65 mm	7.5 mm	Not Qualified			e4	30	260	17.9 mm
BM23SPKA1NB9-0001AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	43	XMA	RECTANGULAR	UNSPECIFIED	YES	1							3.7 V		MICROELECTRONIC ASSEMBLY	MODULE,43LEAD(UNSPEC)		1.2 mm	70 Cel		-20 Cel		UNSPECIFIED		R-XXMA-N43			1.9 mm	15 mm							29 mm
410	Siltronics		COMMERCIAL										BIPOLAR			.55 mA		1.8/6		DIE OR CHIP	Other Telecom ICs		60 Cel		0 Cel									Not Qualified
BM23SPKA1NB9-0B02AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	43	XMA	RECTANGULAR	UNSPECIFIED	YES	1							3.7 V		MICROELECTRONIC ASSEMBLY	MODULE,43LEAD(UNSPEC)		1.2 mm	70 Cel		-20 Cel		UNSPECIFIED		R-XXMA-N43			1.9 mm	15 mm							29 mm
IS1678SM-151-TRAY	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1				TS 16949			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	70 Cel		-20 Cel		QUAD		S-XQCC-N40			.9 mm	6 mm							6 mm
SI32919-A-FS	Silicon Labs	TELECOM CIRCUIT	COMMERCIAL			SOP				1							3.3 V					1.27 mm	70 Cel		0 Cel							1.75 mm	3.9 mm							9.9 mm
BM71BLE01FC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	17	QMA	RECTANGULAR	UNSPECIFIED	YES	1							3 V		MICROELECTRONIC ASSEMBLY	MODULE,17LEAD(UNSPEC)		1.2 mm	70 Cel		-20 Cel	Nickel/Gold (Ni/Au)	QUAD	.0086 Mbps	R-XQMA-N17			1.66 mm	6 mm				e4			8 mm
CY7B923-SC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BICMOS			85 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G28		1	2.67 mm	7.5 mm	Not Qualified			e0	30	225	17.905 mm
LA72914V-TLM-H	Onsemi		COMMERCIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES				BIPOLAR			.04 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel		-20 Cel	TIN BISMUTH	DUAL		R-PDSO-G16		3			Not Qualified			e6	30	260
PSB21150FV1.4	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		0 Cel		QUAD		S-PQFP-G64		3	1.6 mm	10 mm						260	10 mm
XR-2211ACD	Exar	TELECOM CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BIPOLAR			9 mA	12 V	12	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G14		1	1.75 mm	3.9 mm	Not Qualified			e0	30	215	8.65 mm
XR2211ACP-F	Exar	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			BIPOLAR			.009 mA	12 V	12	IN-LINE	DIP14,.3	Other Telecom ICs	2.54 mm	70 Cel		0 Cel	MATTE TIN	DUAL		R-PDIP-T14			5.33 mm	7.62 mm	Not Qualified			e3			19.305 mm
AFE4300PN	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BINARY/TWOS COMP	2				.00097 mA	3.3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Codecs	.5 mm	70 Cel	16	0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G80	VOLTAGE	3	1.6 mm	12 mm	Not Qualified	DIFFERENTIAL	3.4 V	e4	30	260	12 mm
CY7B9234-270JXCT	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS				5 V		CHIP CARRIER			1.27 mm	70 Cel		0 Cel	MATTE TIN	QUAD		S-PQCC-J28		3	4.572 mm	11.5316 mm	Not Qualified			e3	20	260	11.5316 mm
DS2174Q	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1						.06 mA	3.3 V	3.3	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	TIN LEAD	QUAD		S-PQCC-J44		3	4.57 mm	16.585 mm	Not Qualified			e0			16.585 mm
DS2174Q+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1						.06 mA	3.3 V	3.3	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	MATTE TIN	QUAD		S-PQCC-J44		3	4.57 mm	16.585 mm	Not Qualified			e3		245	16.585 mm
RN4677-V/RM112	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1				TS 16949			3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel		-20 Cel	GOLD OVER NICKEL	UNSPECIFIED	.4 Mbps	R-XXMA-N33			2.46 mm	12 mm				e4			22 mm
CY7B933-SXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BICMOS			.155 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	DUAL	400 Mbps	R-PDSO-G28		3	2.67 mm	7.505 mm	Not Qualified			e4	20	260	17.905 mm
CYRF6936-40LTXC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1							3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N40		3	1 mm	6 mm	Not Qualified			e4	20	260	6 mm
CY7B9334-270JXC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS				5 V		CHIP CARRIER			1.27 mm	70 Cel		0 Cel		QUAD		S-PQCC-J28			4.572 mm	11.5316 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	11.5316 mm
HC1-55536-5	Intersil		COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	CERAMIC	NO				CMOS			1.5 mA	5 V	5	IN-LINE	DIP14,.3	Other Telecom ICs	2.54 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T14					Not Qualified			e0
PI2EQX4402DNBE	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	BALL	84	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1							1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B84		3	1.46 mm	9 mm	Not Qualified			e1			9 mm
CY7B923-JC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS			85 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	TIN LEAD	QUAD		S-PQCC-J28		3	4.57 mm	11.53 mm	Not Qualified			e0			11.53 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.