NO LEAD Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
88W9097-B1-NYH2C000-P123	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	114	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.05 V		CHIP CARRIER, HEAT SINK/SLUG	LCC114,.04SQ,16		.4 mm	70 Cel	0 Cel		QUAD	1200 Mbps	S-XQCC-N114		.9 mm	10 mm						10 mm
TDA18250BHN/C1K	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-PQCC-N32	3	.85 mm	5 mm					260	5 mm
SL3S1213FTB0,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.265 mA	1.8 V	1.8	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-N6	1	.5 mm	1 mm	Not Qualified		e3	30	260	1.45 mm
TFF11092HN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm						4 mm
SL3S1213FUF/G,005	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	4	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	.265 mA	1.8 V	1.8	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel		UPPER		R-XUUC-N4				Not Qualified
935264043025	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	13	DIE	RECTANGULAR	UNSPECIFIED	YES	1			5 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N13				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
TFF1007HN/N1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm					260	4 mm
PT5010A0HN/C1,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N32		1 mm	5 mm						5 mm
TZA3033U	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	15	DIE	RECTANGULAR	UNSPECIFIED	YES	1			5 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N15				Not Qualified
SL3S1213FUF,003	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	4	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	.265 mA	1.8 V	1.8	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel		UPPER		R-XUUC-N4				Not Qualified
OL2381AHN	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	3		5 mm			e4			5 mm
935262598026	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	13	DIE	RECTANGULAR	UNSPECIFIED	YES	1					UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N13				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
SL3S1213FUD/BG	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	4	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		1.8 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N4
SL3S1203FUD/BG	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	4	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		1.8 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N4
TDA18250BHN/C1E	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-PQCC-N32	3	.85 mm	5 mm					260	5 mm
935272969118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1					UNCASED CHIP				85 Cel	-25 Cel		UPPER		X-XUUC-N				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
P5DF081HN/T1AD2060,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER				85 Cel	-25 Cel		QUAD		S-PQCC-N32
TFF11094HN/N1,111	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm						4 mm
SL3S1203FTB0	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-N6	1	.5 mm	1 mm	Not Qualified		e3			1.45 mm
QN9021	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N32		.8 mm	5 mm						5 mm
TZA3043U/T/C2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	13	DIE	RECTANGULAR	UNSPECIFIED	YES	1			5 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N13				Not Qualified
TDA10026HN/C1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-PQCC-N64		1 mm	9 mm						9 mm
OL2311AHN	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32	3	.85 mm	5 mm						5 mm
TFF11142HN/N1,111	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm					260	4 mm
SL3S1202AC2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	2	DIE	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-PUUC-N2				Not Qualified
TFF11086HN/N1X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm					260	4 mm
TZA3044BU/C2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	29	DIE	SQUARE	UNSPECIFIED	YES	1			3.3 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		S-XUUC-N29				Not Qualified
TFF11101HN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm						4 mm
935233940122	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD			RECTANGULAR	PLASTIC/EPOXY	YES	1					SPECIAL SHAPE				85 Cel	-40 Cel		UNSPECIFIED		R-PXSS-N				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
MWCT1200CFM	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER				85 Cel	-40 Cel	TIN	QUAD		S-XQCC-N32	3					e3	40	260
TFF11101HN/N1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm					260	4 mm
935263511026	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	13	DIE	RECTANGULAR	UNSPECIFIED	YES	1			5 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N13				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
SL3S1013FTB0	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	PURE TIN	DUAL		R-PDSO-N6	1	.5 mm	1 mm						1.45 mm
SL3S1202AC0	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	2	DIE	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-PUUC-N2				Not Qualified
P5DF081HN/T1AR1070	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD	1.5 Mbps	S-PQCC-N32	1	.85 mm	5 mm		ALSO AVAILABLE WITH 5V NOMINAL SUPPLY	e4		260	5 mm
BGW200EG	NXP Semiconductors		OTHER	NO LEAD	68	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	.12 mA		1.8,2.8	CHIP CARRIER	LCC68,.4X.6,25	Other Telecom ICs	.635 mm	85 Cel	-30 Cel		QUAD		R-PQCC-N68				Not Qualified
TZA3044U/C2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	29	DIE	SQUARE	UNSPECIFIED	YES	1			3.3 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		S-XUUC-N29				Not Qualified
TZA3043U/C2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	13	DIE	RECTANGULAR	UNSPECIFIED	YES	1			5 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N13				Not Qualified
935266810026	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	29	DIE	SQUARE	UNSPECIFIED	YES	1			3.3 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		S-XUUC-N29				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
TFF11115HN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm	Not Qualified					4 mm
XSA5223CK	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1			5 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		X-XUUC-N				Not Qualified
935263381025	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	29	DIE	SQUARE	UNSPECIFIED	YES	1			3.3 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		S-XUUC-N29				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
TFF11139HN/N1X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm					260	4 mm
SL3S1204FTB0X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE	SOLCC6,.04,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL		R-PDSO-N6				Not Qualified
WLAN8101H	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	38	HLGA	RECTANGULAR	UNSPECIFIED	YES	1			3.85 V		GRID ARRAY, HEAT SINK/SLUG	LGA38(UNSPEC)		.35 mm	85 Cel	-40 Cel		BOTTOM		R-XLGA-N38		.685 mm	3 mm						4 mm
SL3S1013FTB0,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		DUAL		R-PDSO-N6	1	.5 mm	1 mm					260	1.45 mm
TDA18275HN/C1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER					-20 Cel		QUAD		S-PQCC-N32
BGB110	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	34		RECTANGULAR	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY				50 Cel	-10 Cel		UNSPECIFIED		R-XXMA-N34				Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.