NO LEAD Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TFF11092HN/N1X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N24	1	1 mm	4 mm		e4	30	260	4 mm
BGX7100HN/1,115	NXP Semiconductors			NO LEAD	24	QCCN	SQUARE	PLASTIC/EPOXY	YES				5 V	5	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm				QUAD		S-PQCC-N24	1			Not Qualified			260
TFF11142HN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm					4 mm
SL3ICS3001FW/V1	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	4	DIE	UNSPECIFIED	UNSPECIFIED	YES	1					UNCASED CHIP				85 Cel	-40 Cel		UPPER		X-XUUC-N				Not Qualified
OL2381AHN/C0CZ	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32		.85 mm	5 mm					5 mm
P5DF081HN/T1AD2060	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG				85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32					e4
PN7150B0HN/C11005E	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N40		1 mm	6 mm					6 mm
OL2385AHN/001C0	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N48		1 mm	7 mm					7 mm
935272977118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1					UNCASED CHIP				85 Cel	-25 Cel		UPPER		X-XUUC-N				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
NT2H0301G0DUD	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1					UNCASED CHIP				70 Cel	-25 Cel		UPPER		X-XUUC-N
935261078025	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1			5 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		X-XUUC-N				Not Qualified
UAA3559HN	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN/NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32		1 mm	5 mm	Not Qualified	e3/e4			5 mm
SLEV400/HAB	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	5		RECTANGULAR	UNSPECIFIED	YES	1			5 V		MICROELECTRONIC ASSEMBLY							UNSPECIFIED		R-XXMA-N5				Not Qualified
TFF11101HN/N1X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm				260	4 mm
935272970005	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1					UNCASED CHIP				85 Cel	-25 Cel		UPPER		X-XUUC-N				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
OL2385AHN/00100	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N48		1 mm	7 mm					7 mm
QN9022	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N40		.9 mm	5 mm					5 mm
SL3S1203FTB0,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.265 mA	1.8 V	1.8	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-N6	1	.5 mm	1 mm	Not Qualified	e3	30	260	1.45 mm
TFF11115HN/N1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm					4 mm
TZA3013AU	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	15	DIE	RECTANGULAR	UNSPECIFIED	YES	1	MOS	.038 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel		UPPER		R-XUUC-N15				Not Qualified
TFF1024HN	NXP Semiconductors	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1X.14,20		.5 mm	85 Cel	-40 Cel		QUAD		R-PQCC-N16		1 mm	2.5 mm					3.5 mm
UAA3558HN	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3 V		CHIP CARRIER				50 Cel	-10 Cel	TIN/NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32				Not Qualified	e3/e4
SLRC61002HN/T/R	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32		1 mm	5 mm					5 mm
TZA3033U/T/C3	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	DIE	RECTANGULAR	UNSPECIFIED	YES	1			5 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N8				Not Qualified
TZA3023U/T/C3	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	13	DIE	RECTANGULAR	UNSPECIFIED	YES	1			5 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N13				Not Qualified
TZA3044U/T/C2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	29	DIE	SQUARE	UNSPECIFIED	YES	1			3.3 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		S-XUUC-N29				Not Qualified
NT2H1311F0DTL	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	4	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	-25 Cel		DUAL		R-PDSO-N4		.5 mm	1.5 mm					2 mm
NT2H1611F0DTL,125	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	4	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1					SMALL OUTLINE, VERY THIN PROFILE			.5 mm	70 Cel	-25 Cel		DUAL		R-PDSO-N4		.5 mm	1.5 mm					2 mm
TFF11086HN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm					4 mm
TFF1007HN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm					4 mm
NT2H1611F0DTL	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	4	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	-25 Cel		DUAL		R-PDSO-N4		.5 mm	1.5 mm					2 mm
SL3S1002AC0	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	2	DIE	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-PUUC-N2				Not Qualified
SL3S1203FUF/G,005	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	4	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	.265 mA	1.8 V	1.8	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel		UPPER		R-XUUC-N4				Not Qualified
QN9080DHN	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	2 Mbps	S-PQCC-N48		1 mm	6 mm					6 mm
BGX7100HN/1,118	NXP Semiconductors			NO LEAD	24	QCCN	SQUARE	PLASTIC/EPOXY	YES				5 V	5	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm				QUAD		S-PQCC-N24	1			Not Qualified			260
935408659518	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.23SQ,20		.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N40		1 mm	6 mm					6 mm
PCD6001U	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	UNSPECIFIED	YES	1			2.5 V		UNCASED CHIP				70 Cel	-25 Cel		UPPER		X-XUUC-N				Not Qualified
SL3S1213FUF/G,003	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	4	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	.265 mA	1.8 V	1.8	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel		UPPER		R-XUUC-N4				Not Qualified
TFF11094HN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm	Not Qualified				4 mm
935272975118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1					UNCASED CHIP				85 Cel	-25 Cel		UPPER		X-XUUC-N				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
935272971005	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1					UNCASED CHIP				85 Cel	-25 Cel		UPPER		X-XUUC-N				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
SL3S1002AC2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	2	DIE	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-PUUC-N2				Not Qualified
TZA3023U/C3	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	13	DIE	RECTANGULAR	UNSPECIFIED	YES	1			5 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N13				Not Qualified
OL2300NHN/F,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		19 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	1	1 mm	3 mm	Not Qualified	e4	30	260	3 mm
SL3S1003FUD/BG	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	4	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		1.8 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N4
TFF11115HN/N1,111	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm					4 mm
OM5926HN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	TIN/NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N20		1 mm	5 mm	Not Qualified	e3/e4			5 mm
BGU8010	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		DUAL		R-PDSO-N6		.5 mm	.9 mm					1.1 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.