NO LEAD Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PN512AA0HN1/C2,551	NXP Semiconductors		OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			AEC-Q100	100 mA		1.8/3.3,2.5/3.3	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N32	3			Not Qualified			260
PN5320A3HN/C1XX	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N40		1 mm	6 mm					6 mm
SL2S5002FTB,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	3	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					SMALL OUTLINE, VERY THIN PROFILE			.55 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-N3	1	.5 mm	1 mm		e3	30	260	1.45 mm
PN512AA0HN1/C2BIY	NXP Semiconductors		INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			AEC-Q100	100 mA		3/3.3	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	90 Cel	-40 Cel		QUAD		S-PQCC-N32				Not Qualified
CLRC66302HN/TRAYB	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32		1 mm	5 mm					5 mm
MFRC63102HN/T/R	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32		1 mm	5 mm					5 mm
MFRC63002HN/TRAYB	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-25 Cel		QUAD	1 Mbps	S-PQCC-N32		1 mm	5 mm					5 mm
SL2S5302FUD	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	4	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS					UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N4				Not Qualified
BGT24ATR11E6433	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR	AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		R-XQCC-N32		.9 mm	4.5 mm					5.5 mm
BGA8V1BN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		DUAL		R-PDSO-N6	1	.4 mm	.7 mm					1.1 mm
BGA711N7E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	DUAL		R-PDSO-N6	1	.4 mm	1.3 mm		e3			2 mm
BGA7H1N6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-N6	1	.4 mm	.7 mm		e3			1.1 mm
BGM681L11E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT		NO LEAD	11	DIE	SQUARE	UNSPECIFIED	YES	1				2.8 V		UNCASED CHIP							UPPER		S-XUUC-N11		.65 mm	2.5 mm					2.5 mm
BGB707L7ESD	Infineon Technologies	TELECOM CIRCUIT		NO LEAD	7	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm			GOLD PALLADIUM	DUAL		R-PDSO-N7	1	.5 mm	1.3 mm	Not Qualified				2 mm
BGT24MR2	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD		R-PQCC-N32	3	.9 mm	4.5 mm					5.5 mm
BGA711N7	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		DUAL		R-PDSO-N6	1	.4 mm	1.3 mm					2 mm
BGT24ATR12	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		R-PQCC-N32	3	.9 mm	4.5 mm					5.5 mm
BGA7L1N6	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-N6	1	.4 mm	.7 mm		e3			1.1 mm
BGT24MR2E6327FUSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD		R-PQCC-N32		.9 mm	4.5 mm			NOT SPECIFIED	NOT SPECIFIED	5.5 mm
BGT24AR4	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		R-PQCC-N32		.9 mm	4.3 mm			NOT SPECIFIED	NOT SPECIFIED	5.5 mm
BGM781N11E6327XT	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	VSON	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, VERY THIN PROFILE				85 Cel	-40 Cel		DUAL		S-PDSO-N11		.77 mm	2.5 mm					2.5 mm
BGT24ATR12E6433	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR	AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		R-XQCC-N32		.9 mm	4.5 mm					5.5 mm
PBA31308	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	54	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			2.5 V		GRID ARRAY			1.2 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-N54		1.8 mm	8.7 mm	Not Qualified				11.6 mm
BGT24AR2	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		R-PQCC-N32	3	.9 mm	4.5 mm					5.5 mm
BGT24AR2E6433XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	TIN	QUAD		R-PQCC-N32	3	.9 mm	4.5 mm		e3			5.5 mm
BGT24AR4E6433XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		R-PQCC-N32	3	.9 mm	4.5 mm					5.5 mm
BGA7H1N6	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-N6	1	.4 mm	.7 mm		e3			1.1 mm
BGA751N7	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		DUAL		R-PDSO-N6	1	.4 mm	1.3 mm					2 mm
BGT24AT2E6433XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	TIN	QUAD		R-PQCC-N32	3	.9 mm	4.5 mm		e3			5.5 mm
BGT24MTR12	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD		R-PQCC-N32	3	.9 mm	4.5 mm					5.5 mm
BGA123L4E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	4	VQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		BOTTOM		S-XBCC-N4	1	.32 mm	.7 mm					.7 mm
BGSF110GN26	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	26	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel		QUAD		R-PQCC-N26	1	.77 mm	2.6 mm					3.4 mm
BGT24MTR11E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD		R-PQCC-N32		.9 mm	4.5 mm			NOT SPECIFIED	NOT SPECIFIED	5.5 mm
BGT24ATR11E6327	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	AEC-Q100		3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		R-PQCC-N32		.9 mm	4.5 mm					5.5 mm
BGT24MTR12E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD		R-PQCC-N32		.9 mm	4.5 mm			NOT SPECIFIED	NOT SPECIFIED	5.5 mm
BGT24ATR11	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		R-PQCC-N32	3	.9 mm	4.5 mm					5.5 mm
BGA7M1N6	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-N6	1	.4 mm	.7 mm		e3			1.1 mm
BGT24AR2E6327	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	AEC-Q100		3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		R-PQCC-N32		.9 mm	4.5 mm					5.5 mm
NWX1900P	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	3	QCCN	SQUARE	PLASTIC/EPOXY	YES	1						CHIP CARRIER				85 Cel	-30 Cel		QUAD		S-PQCC-N3		1.22 mm	3.8 mm	Not Qualified				3.8 mm
BGA7M1N6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-N6	1	.4 mm	.7 mm		e3			1.1 mm
BGA7L1N6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-N6	1	.4 mm	.7 mm		e3			1.1 mm
BGM781N11	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	VSON	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-N11	1	.77 mm	2.5 mm	Not Qualified			225	2.5 mm
BGA735N16	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	16	VQCCN	SQUARE	UNSPECIFIED	YES	1				2.8 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		S-XQCC-N16	1	.4 mm	2.3 mm	Not Qualified				2.3 mm
BGT24ATR11E6433XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	TIN	QUAD		R-PQCC-N32	3	.9 mm	4.5 mm		e3			5.5 mm
BGT24AT2	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		R-PQCC-N32		.9 mm	4.3 mm			NOT SPECIFIED	NOT SPECIFIED	5.5 mm
BGA735N16E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	QUAD		S-XQCC-N16	1	.4 mm	2.3 mm		e3			2.3 mm
BGM781N11E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	VSON	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, VERY THIN PROFILE				85 Cel	-40 Cel		DUAL		S-PDSO-N11		.77 mm	2.5 mm			NOT SPECIFIED	NOT SPECIFIED	2.5 mm
BGT24ATR12E6433XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	TIN	QUAD		R-PQCC-N32	3	.9 mm	4.5 mm		e3			5.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.