NO LEAD Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BGM704N7	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	7	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		DUAL	R-PDSO-N7		.4 mm	1.3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	2 mm
BGT24MTR11	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD	R-PQCC-N32	3	.9 mm	4.5 mm					5.5 mm
PBA31308/2	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	54	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					GRID ARRAY			1.2 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-N54			8.7 mm	Not Qualified				11.6 mm
BGM681L11	Infineon Technologies	TELECOM CIRCUIT		NO LEAD	11	DIE	SQUARE	UNSPECIFIED	YES	1				2.8 V		UNCASED CHIP							UPPER	S-XUUC-N11				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
BGA924N6	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6	1	.4 mm	.7 mm					1.1 mm
IRMS5000	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	6		RECTANGULAR	UNSPECIFIED	NO	1	BICMOS			5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-25 Cel		SINGLE	R-XSMA-N6				Not Qualified
Q67037-A4	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	70 Cel	-20 Cel		QUAD	S-PQCC-N48		.9 mm	7 mm	Not Qualified				7 mm
BGA924N6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	TIN	DUAL	R-PDSO-N6	1	.4 mm	.7 mm		e3			1.1 mm
BGA8V1BN6	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6	1	.4 mm	.7 mm					1.1 mm
BGA771N16	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	S-PQCC-N16		.625 mm	2.3 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
BCM43236BKMLG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	88	VQCCN	SQUARE	UNSPECIFIED	YES	1				1.2 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	65 Cel	0 Cel		QUAD	S-XQCC-N88		.9 mm	10 mm					10 mm
WM72016-6-DG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES				.025 mA	2.5 V	2.5	SMALL OUTLINE	SOLCC8,.12,25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N8				Not Qualified
CYW89035CWMLG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	60	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N60		.9 mm	7 mm					7 mm
BCM43236KMLG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	65 Cel	0 Cel		QUAD	S-XQCC-N88		.9 mm	10 mm					10 mm
BCM20730A2KMLG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD	S-XQCC-N40		1 mm	6 mm					6 mm
BCM20736A0KML2G	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	S-XQCC-N32		1 mm	5 mm					5 mm
SP000892662	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-N6		.77 mm	1.7 mm		e3			2.3 mm
SLE95050H	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.55 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	110 Cel	-20 Cel		QUAD	S-PQCC-N6		.8 mm	2.5 mm					2.5 mm
BGS16MN14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	Tin (Sn)	QUAD	S-PQCC-N14	1	.77 mm	2 mm		e3	NOT SPECIFIED	NOT SPECIFIED	2 mm
TLE8457BLE	Infineon Technologies	TELECOM CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	AEC-Q100		8 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm			TIN	DUAL	S-PDSO-N8	2A	1.15 mm	3 mm		e3			3 mm
BGM15HA12E6327	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1				2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	R-XQCC-N12		.65 mm	1.1 mm					1.9 mm
TLE8457ALE	Infineon Technologies	TELECOM CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	AEC-Q100		8 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm			TIN	DUAL	S-PDSO-N8	2A	1.15 mm	3 mm		e3			3 mm
TDA7255VXUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	R-PQCC-N40		.9 mm	5.5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6.5 mm
BGM1032N7	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
TDA7255V	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3 V	2.5/5	CHIP CARRIER, VERY THIN PROFILE	LCC40,.22X.26,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	R-PQCC-N40		.9 mm	5.5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6.5 mm
BGS15BN14	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel		QUAD	S-XQCC-N14		.77 mm	1.6 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
BGM1033N7E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
BGS14PN10E6327XTSA1/SAMPLE	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1	CMOS			2.85 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	R-XQCC-N10		.4 mm	1.1 mm					1.5 mm
BGS13BN14	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel	MATTE TIN	QUAD	S-XQCC-N14		.77 mm	1.6 mm		e3			1.6 mm
BGS14PN10	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1	CMOS			2.85 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	R-XQCC-N10	1	.4 mm	1.1 mm					1.5 mm
BGS18MN14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	QUAD	S-PQCC-N14	1	.77 mm	2 mm		e3			2 mm
BGM1034N7	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	7	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N7		.77 mm	1.7 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
BGS12PN10	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	10	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.85 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel		DUAL	R-PDSO-N10	1	.4 mm	1.1 mm					1.5 mm
BGM1043N7E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
BGM1043N7	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
BGM1034N7E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	7	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N7		.77 mm	1.7 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
BGS18MN14	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	Tin (Sn)	QUAD	S-PQCC-N14	1	.77 mm	2 mm		e3	NOT SPECIFIED	NOT SPECIFIED	2 mm
BGM15MA12	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1				2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	R-XQCC-N12	1	.65 mm	1.1 mm					1.9 mm
BGM1033N7E6327	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
BGS16MN14	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	S-PQCC-N14	1	.77 mm	2 mm					2 mm
BGS14BN14	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel	MATTE TIN	QUAD	S-XQCC-N14		.77 mm	1.6 mm		e3			1.6 mm
BGS15MA12E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	12	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1	CMOS			2.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N12	1	.65 mm	1.1 mm					1.9 mm
BGS15MA12	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	12	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1	CMOS			2.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N12	1	.65 mm	1.1 mm					1.9 mm
BGM15HA12	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1				2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	R-XQCC-N12	1	.65 mm	1.1 mm					1.9 mm
BGM15MA12E6327	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1				2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	R-XQCC-N12		.65 mm	1.1 mm			NOT SPECIFIED	NOT SPECIFIED	1.9 mm
CYW20733A3KML1G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	70 Cel	0 Cel		QUAD	S-XQCC-N56		1 mm	7 mm					7 mm
CYBL21571-56LQXI	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.6 mm	7 mm					7 mm
CYBL21171-56LQXI	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56		.6 mm	7 mm					7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.