Analog Devices Other Function Telecom Interface ICs 1,164

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
AD73311LARUZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.0125 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	Modems	.65 mm	105 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G20	1	1.1 mm		4.4 mm	Not Qualified	e3		260	6.5 mm
AD9875BSTZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified	e3			7 mm
ADF7012BRUZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G24		1.2 mm		4.4 mm	Not Qualified	e3			7.8 mm
ADN2821XCHIP-02KWP	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	17	DIE	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		95 Cel	-40 Cel			UPPER	R-XUUC-N17					Not Qualified		NOT SPECIFIED	NOT SPECIFIED
LTC5593IUH#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	105 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N24	1	.8 mm		5 mm	Not Qualified	e3	30	260	5 mm
AD9874BST	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	.0265 mA	3 V	3/3.3,3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified	e0			7 mm
AD9856ASTRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified	e0			7 mm
ADF7011BRUZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G24		1.2 mm		4.4 mm	Not Qualified	e3			7.8 mm
HMC571	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	7	DIE	RECTANGULAR	UNSPECIFIED	YES	1			3.5 V		UNCASED CHIP				85 Cel	-55 Cel		GOLD	UPPER	R-XUUC-N7					Not Qualified	e4
LTC5509ESC6#TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	R-PDSO-G6	1	1 mm		1.25 mm	Not Qualified	e0			2 mm
HMC5846LS6	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	16	HQCCN	SQUARE	UNSPECIFIED	YES	1			7 V		CHIP CARRIER, HEAT SINK/SLUG			1 mm	85 Cel	-55 Cel			QUAD	S-XQCC-N16	3	1.09 mm		6 mm				260	6 mm
LTC5509ESC6#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6	1	1 mm		1.25 mm	Not Qualified	e3	30	260	2 mm
ADN2882A-DF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	17	DIE	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		UNCASED CHIP				95 Cel	-40 Cel			UPPER	R-XUUC-N17		.25 mm		.7 mm					1.2 mm
ADF7030BCPZN-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N40	3	.8 mm		6 mm	Not Qualified		30	260	6 mm
AD73311LARZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.0125 mA	3 V	3	SMALL OUTLINE	SOP20,.4	Modems	1.27 mm	105 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G20	1	2.65 mm		7.5 mm	Not Qualified	e3		260	12.8 mm
AD9865CHIPS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1	CMOS		3.3 V		UNCASED CHIP				85 Cel	-40 Cel			UPPER	X-XUUC-N					Not Qualified		NOT SPECIFIED	NOT SPECIFIED
AD8316ACP-REEL7	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.012 mA	2.7 V	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel	-30 Cel		TIN LEAD	QUAD	S-XQCC-N16		1 mm		4 mm	Not Qualified	e0			4 mm
AD73322LYST	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.031 mA	3 V	3	FLATPACK, LOW PROFILE	QFP44,.63SQ,40	Codecs	1 mm	105 Cel	-40 Cel	.75 dB	TIN LEAD	QUAD	S-PQFP-G44		1.6 mm	16-BIT	14 mm	Not Qualified	e0			14 mm	YES
HMC6300BG46	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	65	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			BOTTOM	R-PBGA-B65	1	.815 mm		4 mm			30	260	6 mm
AD73360AS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK				85 Cel	-40 Cel		TIN LEAD	QUAD	S-PQFP-G44					Not Qualified	e0
HMC862LP3ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N16	1	1 mm		3 mm		e3		260	3 mm
AD9874	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified	e0			7 mm
ADF7011BRUZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G24	1	1.2 mm		4.4 mm	Not Qualified	e3		260	7.8 mm
ADN2817ACPZ-500RL7	Analog Devices
AD9862BSTZRL	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Other Telecom ICs	.5 mm	70 Cel	-40 Cel		MATTE TIN	QUAD	R-PQFP-G128	3	1.6 mm		14 mm	Not Qualified	e3	30	260	20 mm
ADN2830ACP-32-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	VQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-XQCC-N32		1 mm		5 mm	Not Qualified	e0			5 mm
AD9856AST	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.53 mA	3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-PQFP-G48	3	1.6 mm		7 mm	Not Qualified	e0		240	7 mm
AD9868BCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	.475 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Modems	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N64		1 mm		9 mm	Not Qualified	e3			9 mm
AD73322LYST-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.031 mA	3 V	3	FLATPACK, LOW PROFILE	QFP44,.63SQ,40	Codecs	1 mm	105 Cel	-40 Cel	.75 dB	TIN LEAD	QUAD	S-PQFP-G44	3	1.6 mm	16-BIT	14 mm	Not Qualified	e0		240	14 mm	YES
HMC697LP4RTR	Analog Devices		INDUSTRIAL	NO LEAD	24	QCCN	SQUARE	PLASTIC/EPOXY	YES				5 V	5	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD	S-PQCC-N24					Not Qualified
ADF7030-1BCPZN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N40	3	.8 mm		6 mm			30	260	6 mm
HMC551LP4E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N24	1	1 mm		4 mm	Not Qualified	e3			4 mm
ADN2913ACPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N24	3	1 mm		4 mm		e3		260	4 mm
ADN2892ACP-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel	-40 Cel		TIN LEAD OVER SILVER	QUAD	S-XQCC-N16	3	1 mm		3 mm	Not Qualified	e0		240	3 mm
AD8316ACP-REEL	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.012 mA	2.7 V	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel	-30 Cel			QUAD	S-XQCC-N16		1 mm		4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4 mm
ADN2882ACHIPS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	17	DIE	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		95 Cel	-40 Cel			UPPER	R-XUUC-N17					Not Qualified		NOT SPECIFIED	NOT SPECIFIED
ADN2891ACPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.049 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N16	3	.9 mm		3 mm	Not Qualified	e3	30	260	3 mm
AD73322LASTZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE			1 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQFP-G44	3	1.6 mm		14 mm	Not Qualified	e3		260	14 mm
AD8316ARM	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		.012 mA	2.7 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		TIN LEAD	DUAL	S-PDSO-G10		1.1 mm		3 mm	Not Qualified	e0			3 mm
AD9861	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL							1			3 V						85 Cel	-40 Cel		TIN LEAD							Not Qualified	e0
AD8314ACPZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	VSON	RECTANGULAR	UNSPECIFIED	YES	1			3 V		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	R-XDSO-N8		1 mm		2 mm	Not Qualified	e0			3 mm
LTC5593IUH#TRPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	105 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N24	1	.8 mm		5 mm	Not Qualified	e3	30	260	5 mm
AD9866BCPRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-XQCC-N64	3	1 mm		9 mm	Not Qualified	e0		240	9 mm
AD9878BSTZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Modems	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm		14 mm	Not Qualified	e3		260	14 mm
HMC551LP4	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-PQCC-N24	1	1 mm		4 mm	Not Qualified	e0			4 mm
ADN2820ACHIPS	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	14	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR		3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-15 Cel			UPPER	R-XUUC-N14					Not Qualified		NOT SPECIFIED	NOT SPECIFIED
HMC8108LC5TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N32	3	1.12 mm		4.9 mm			30	260	4.9 mm
AD73360LAR-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	R-PDSO-G28	3	2.65 mm		7.5 mm	Not Qualified	e0		240	17.9 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.