Analog Devices Other Function Telecom Interface ICs 1,164

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
HMC757	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	4	DIE	RECTANGULAR	UNSPECIFIED	YES	1				7 V		UNCASED CHIP				85 Cel	-55 Cel		UPPER		R-XUUC-N4				Not Qualified
FIDO5200CBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32		.8 mm	105 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.24 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
HMC743ALP6CE	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N40		.9 mm	6 mm					6 mm
AD6122ACPRL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	VQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm					5 mm
AD6624AABC	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V	2.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	Other Telecom ICs	1 mm	70 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM		S-PBGA-B196	3	1.5 mm	15 mm	Not Qualified	e0		240	15 mm
ADP5586ACBZ-00-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B16	1	.545 mm	1.59 mm		e1	30	260	1.59 mm
AD6600	Analog Devices	TELECOM CIRCUIT		GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1						FLATPACK						TIN LEAD	QUAD		S-PQFP-G44				Not Qualified	e0
AD9993BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.4 mm	12 mm			30	260	12 mm
ADF9010BCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		.41 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3		260	7 mm
LTC4401-2EMS8	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
AD1803JRU	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Modems	.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G24		1.1 mm	4.4 mm	Not Qualified	e0			7.8 mm
ADP5585ACBZ-00-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B16	1	.545 mm	1.59 mm		e1			1.59 mm
HMC700LP4TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm			NOT SPECIFIED	NOT SPECIFIED	4 mm
HMC739LP4E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	1	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
ADL5910ACPZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	.8 mm	3 mm		e4	30	260	3 mm
ADP5586ACBZ-01-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B16	1	.545 mm	1.59 mm		e1			1.59 mm
HMC775LC5TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel		QUAD		S-CQCC-N32	3	1.12 mm	5 mm				260	5 mm
AD6440	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK			.65 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G80		3.4 mm	14 mm	Not Qualified				14 mm
HMC738LP4E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	VQCCN	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	1	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
AD974BR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified	e0		240	17.9 mm
LTP5902IPC-IPRC1C1#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	66	XMA	RECTANGULAR	PLASTIC/EPOXY	YES	1	HYBRID			3.6 V		MICROELECTRONIC ASSEMBLY	MODULE66(UNSPEC)		1 mm	85 Cel	-40 Cel		QUAD	.25 Mbps	R-PXMA-N66		3.54 mm	24 mm			NOT SPECIFIED	NOT SPECIFIED	42 mm
HMC745LC3TR-R5	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-CQCC-N16	3	.9 mm	2.9 mm					2.9 mm
LTP5902IPC-WHMAXXX#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	66	DIE	RECTANGULAR	UNSPECIFIED	YES					3.6 V		UNCASED CHIP	DIE OR CHIP			85 Cel	-40 Cel		UPPER	.25 Mbps	R-XUUC-N66		5.5 mm	24 mm			NOT SPECIFIED	NOT SPECIFIED	37.5 mm
LTC4401-2EMS8#TRPBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	Matte Tin (Sn)	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
HMC496LP3ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	1 mm	3 mm	Not Qualified	e3		260	3 mm
HMC7891	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	4		RECTANGULAR	UNSPECIFIED	NO	1				8 V		FLANGE MOUNT				85 Cel	-40 Cel		UNSPECIFIED		R-XXFM-X4	1
AD6421	Analog Devices
AD6674BCPZ-1000	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.25 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N64	3	.8 mm	9 mm		e3		260	9 mm
LTC1957-2EMS#TR	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
HMC920LP5E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1				15 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-CQCC-N32	1	1 mm	5 mm	Not Qualified	e3	30	260	5 mm
AD61009ARS	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	TIN LEAD	DUAL		R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified	e0		240	7.2 mm
ADA8282WBCPZ	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	3	.8 mm	5 mm		e3	30	260	5 mm
LTC1758-2EMS	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
LTC1757A-1EMS8#TR	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
ADM1041AARQZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G24	1	1.7526 mm	3.9116 mm	Not Qualified	e3		260	8.6614 mm
HMC920LP5ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1				15 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-CQCC-N32	1	1 mm	5 mm		e3	30	260	5 mm
LTC4402-1EMS8#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
HMC739LP4TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm					4 mm
HMC-ABH264	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	6	DIE	RECTANGULAR	UNSPECIFIED	YES	1				5 V		UNCASED CHIP				85 Cel	-55 Cel		UPPER		R-XUUC-N6				Not Qualified		NOT APPLICABLE	NOT APPLICABLE
AD7013ARS-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V	5	SMALL OUTLINE, SHRINK PITCH	SOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G28		2 mm	5.3 mm	Not Qualified	e0			10.2 mm
ADRF5519BCPZN-RL	Analog Devices	TELECOM CIRCUIT		NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD		S-PQCC-N40	3	1 mm	6 mm			30	260	6 mm
ADP5585ACBZ-04-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.65 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B16	1	.545 mm	1.59 mm		e1			1.59 mm
ADL5506WACBZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	AEC-Q100		3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,16		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B6	1	.56 mm	.79 mm		e1	30	260	1.19 mm
LTC1758-1EMS8	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
FIDO5210BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.24 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
HMC736LP4E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				4.2 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-PQCC-N24	1	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
ADRF5519BCPZN	Analog Devices	TELECOM CIRCUIT		NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD		S-PQCC-N40	3	1 mm	6 mm			30	260	6 mm
AD6674BCPZRL7-500	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.25 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N64	3	.8 mm	9 mm		e3		260	9 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.