Analog Devices Other Function Telecom Interface ICs 1,164

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD9988BBPZRL-4D4AC	Analog Devices	TELECOM CIRCUIT		BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY, HEAT SINK/SLUG			.8 mm	120 Cel	-40 Cel		BOTTOM		S-PBGA-B324		1.72 mm	15 mm						15 mm
LTM9013CY-AA#PBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, LOW PROFILE	BGA196,14X14,40		1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B196		3.02 mm	15 mm		3.3v and 5v power supply also require to operate the device		NOT SPECIFIED	NOT SPECIFIED	15 mm
HMC701LP6CETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N40	1	.9 mm	6 mm			e3			6 mm
LTC1757-2EMS	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS				3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G10				Not Qualified		e0
ADA8282WBCPZ-R7	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	3	.8 mm	5 mm			e3	30	260	5 mm
AD6140ARSRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G20		1.98 mm	5.29 mm	Not Qualified		e0			7.2 mm
IA8251-PLC28I	Analog Devices
ADMP510ACEZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	3	TLGA	RECTANGULAR	UNSPECIFIED	YES	1				1.8 V		GRID ARRAY, THIN PROFILE			1.22 mm	85 Cel	-40 Cel		BOTTOM		R-XBGA-B3		1.08 mm	2.5 mm				NOT SPECIFIED	NOT SPECIFIED	3.35 mm
ADL5375-05SCPZEPWP	Analog Devices		OTHER	NO LEAD	24	QCCN	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR			5 V	5	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	105 Cel	-55 Cel		QUAD		S-PQCC-N24
AD20MSP415	Analog Devices	TELECOM CIRCUIT								1	CMOS			3 V								TIN LEAD							Not Qualified		e0
AD8283WBCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100	.19 mA	1.8 V	1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	ATM/SONET/SDH ICs	.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N72	3	.9 mm	10 mm	Not Qualified		e3	30	260	10 mm
LTC4403-1EMS8#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LT1328CS8#PBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	1.752 mm	3.899 mm	Not Qualified		e3	30	260	4.9025 mm
HMC705LP4TRE	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-PQCC-N24	1	1 mm	4 mm			e3			4 mm
AD7011ARS-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP24,.3	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G24		2 mm	5.3 mm	Not Qualified		e0			8.2 mm
HMC496LP3E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD		S-PQCC-N16	1	1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LT5575EUF#TR	Analog Devices		INDUSTRIAL	NO LEAD	16	QCCN	SQUARE	PLASTIC/EPOXY	YES				155 mA	5 V	5	CHIP CARRIER	LCC16,.16SQ,25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-N16				Not Qualified		e0
LTC4403-1EMS8	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
ADSP-21MOD980-000X	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.75 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B352		2.62 mm	35 mm	Not Qualified		e0			35 mm
AD7010ARS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP24,.3	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G24		2 mm	5.3 mm	Not Qualified		e0			8.2 mm
LTM9004CV-AA#PBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	204	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	GOLD	BOTTOM		R-PBGA-N204		2.97 mm	15 mm	Not Qualified		e4			22 mm
ADL5354XCPZ-R71	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			5 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N36		1 mm	6 mm	Not Qualified					6 mm
HMC737LP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				4.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	1	1 mm	4 mm			e3	30	260	4 mm
FIDO5210CBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32		.8 mm	105 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.24 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm
AD9081BBPZRL-4D4AB	Analog Devices	TELECOM CIRCUIT
HMC742ALP5E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N32	1	1 mm	5 mm			e3	30	260	5 mm
ADP5589ACPZ-00-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	.8 mm	3.5 mm			e3	30	260	3.5 mm
LTC4400-2EMS8#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
ADL5354ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N36	1	1 mm	6 mm	Not Qualified		e3			6 mm
HMC981	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	30	QCCN	SQUARE	UNSPECIFIED	YES	1				8 V		CHIP CARRIER				85 Cel	-55 Cel		UPPER		S-XUCC-N30							NOT SPECIFIED	NOT SPECIFIED
HMC310MS8GETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-G8	1	1.1 mm	3 mm			e3		260	3 mm
FIDO5110BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.24 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm
LTC1758-1EMS8#TRPBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	MATTE TIN	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3		260	3 mm
LTC4402-2EMS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
ADL5390ACPZ-WP	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
LTC1757A-1EMS8	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.17 mm	3 mm	Not Qualified		e0	20	235	3 mm
LTP5901IPC-IPRC1C1#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	66	XMA	RECTANGULAR	PLASTIC/EPOXY	YES	1	HYBRID			3.6 V		MICROELECTRONIC ASSEMBLY	MODULE66(UNSPEC)		1 mm	85 Cel	-40 Cel		QUAD	.25 Mbps	R-PXMA-N66		3.54 mm	24 mm				NOT SPECIFIED	NOT SPECIFIED	42 mm
LTC1757A-2EMS#TR	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-30 Cel	TIN LEAD	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC1758-2EMS#PBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	0 Cel	Matte Tin (Sn)	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
AD7115BQ	Analog Devices	TELECOM CIRCUIT																				Tin/Lead (Sn/Pb)									e0
LTP5902IPC-IPRA1C1#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	66	XMA	RECTANGULAR	PLASTIC/EPOXY	YES	1	HYBRID			3.6 V		MICROELECTRONIC ASSEMBLY	MODULE66(UNSPEC)		1 mm	85 Cel	-40 Cel		QUAD	.25 Mbps	R-PXMA-N66		3.54 mm	24 mm				NOT SPECIFIED	NOT SPECIFIED	42 mm
AD6674BCPZRL7-1000	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.25 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N64	3	.8 mm	9 mm			e3		260	9 mm
ADSP-2178-780244	Analog Devices	TELECOM CIRCUIT		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK, LOW PROFILE, FINE PITCH			.5 mm			TIN LEAD	QUAD		S-PQFP-G100		1.6 mm	14 mm	Not Qualified		e0			14 mm
LTC4401-1ES6#PBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.95 mm	70 Cel	0 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G6	1	1 mm	1.6 mm	Not Qualified		e3	30	260	2.9 mm
LT5517EUF#TRPBF	Analog Devices		INDUSTRIAL	NO LEAD	16	QCCN	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR		110 mA	5 V	5	CHIP CARRIER	LCC16,.16SQ,25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-PQCC-N16	1			Not Qualified		e3	30	260
AD6674BCPZ-750	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.25 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N64	3	.8 mm	9 mm			e3		260	9 mm
HMC705LP4	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQCC-N24	1	1 mm	4 mm	Not Qualified		e0	20	235	4 mm
HMC705LP4TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQCC-N24	1	1 mm	4 mm			e0	20	235	4 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.